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ESD5451X-MS

ESD5451X-MS

  • 厂商:

    MSKSEMI(美森科)

  • 封装:

    DFN1006-2L

  • 描述:

    ESD抑制器 DFN1006-2L 5V

  • 数据手册
  • 价格&库存
ESD5451X-MS 数据手册
ESD5451X-MS Product specification ESD5451X-MS FEATURES MACHANICAL DATA   Capacitance: 15pF(typ.)  IEC 61000-4-2 (ESD Air): ±25KV IEC 61000-4-2 (ESD Contact): ±25KV Reverse Working Voltage: 5V IEC 61000-4-5 (Lightning 8/20µs): 8A   DFN1006-2L package  Packaging: Tape and Reel  High temperature solderin guaranted: 2 6 0 C/ 1 0 s  Reel size: 7 inch Flammability Rating: UL 94V-0 APPLICATIONS  Smart Phone and Tablet PC  TV and Set Top Box  Wearable Devices  PDA Reference News PACKAGE OUTLINE PIN CONFIGURATION Marking C* DFN1006-2L Copyright© Msksemi Incorporated www.msksemi.com ESD5451X-MS ABSOLUTE MAXIMUM RATING Symbol Parameter VESD PPP IPPM TA Tstg Conditions Electrostatic Discharge Voltage Min IEC 61000-4-2; Contact Discharge IEC 61000-4-2; Air Discharge Peak Pulse Power tP = 8/20 µs Rated Peak Pulse Current tP = 8/20 µs Ambient Temperature Range Storage Temperature Range Max ±25 - ±25 - Unit V V - 80 W - 8 A - -55 125 ℃ - -55 150 ℃ ELECTRICAL CHARACTERISTICS (Tamb=25℃) Symbol Parameter VRWM VBR IR VC CJ Reverse Working Voltage Conditions TA = 25 °C Breakdown Voltage IR Reverse Leakage Current VRWM = 5V; TA = 25 °C Clamping Voltage = 1mA; TA = 25 °C IPP=1A, tP =8/20µs IPP=8A, tP =8/20µs Junction Capacitance Copyright© Msksemi Incorporated VR = 0V, f = 1 MHz Min Typ. Max Unit - - 5.0 V 5.6 6.5 8.4 V - - 0.1 A - - 6 V - - 10 V - 15 18 F www.msksemi.com ESD5451X-MS ELECTRICAL CHARACTERISTICS CURVE Copyright© Msksemi Incorporated www.msksemi.com ESD5451X-MS PACKAGE MECHANICAL DATA Dim Inches MIN Millimeters MAX MIN MAX A 0.0125 0.02 0.32 0.52 B 0.000 0.002 0.00 0.05 C 0.037 0.043 0.95 1.080 D 0.022 0.027 0.55 0.680 E 0.016 0.024 0.40 0.60 F 0.008 0.012 0.20 0.30 H R 0.015Typ. 0.001 0.005 0.40Typ. 0.05 0. 15 Suggested Pad Layout NOTES: 1.CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2.THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. REEL SPECIFICATION P/N ESD5451X-MS Copyright© Msksemi Incorporated PKG DFN1006-2L QTY 10000 www.msksemi.com ESD5451X-MS Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not handle applications that require extremely high levels of reliability, such as life-support have specifications that can systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from theauthorities concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. Copyright© Msksemi Incorporated www.msksemi.com
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