ESD5451X-MS
Product specification
ESD5451X-MS
FEATURES
MACHANICAL DATA
Capacitance: 15pF(typ.)
IEC 61000-4-2 (ESD Air): ±25KV
IEC 61000-4-2 (ESD Contact): ±25KV
Reverse Working Voltage: 5V
IEC 61000-4-5 (Lightning 8/20µs): 8A
DFN1006-2L package
Packaging: Tape and Reel
High temperature solderin guaranted: 2 6 0 C/ 1 0 s
Reel size: 7 inch
Flammability Rating: UL 94V-0
APPLICATIONS
Smart Phone and Tablet PC
TV and Set Top Box
Wearable Devices
PDA
Reference News
PACKAGE OUTLINE
PIN CONFIGURATION
Marking
C*
DFN1006-2L
Copyright© Msksemi Incorporated
www.msksemi.com
ESD5451X-MS
ABSOLUTE MAXIMUM RATING
Symbol Parameter
VESD
PPP
IPPM
TA
Tstg
Conditions
Electrostatic Discharge Voltage
Min
IEC 61000-4-2; Contact Discharge
IEC 61000-4-2; Air Discharge
Peak Pulse Power
tP = 8/20 µs
Rated Peak Pulse Current
tP = 8/20 µs
Ambient Temperature Range
Storage Temperature Range
Max
±25
-
±25
-
Unit
V
V
-
80
W
-
8
A
-
-55
125
℃
-
-55
150
℃
ELECTRICAL CHARACTERISTICS (Tamb=25℃)
Symbol Parameter
VRWM
VBR
IR
VC
CJ
Reverse Working Voltage
Conditions
TA = 25 °C
Breakdown Voltage
IR
Reverse Leakage Current
VRWM = 5V; TA = 25 °C
Clamping Voltage
= 1mA; TA = 25 °C
IPP=1A, tP =8/20µs
IPP=8A, tP =8/20µs
Junction Capacitance
Copyright© Msksemi Incorporated
VR
= 0V, f = 1 MHz
Min
Typ.
Max
Unit
-
-
5.0
V
5.6
6.5
8.4
V
-
-
0.1
A
-
-
6
V
-
-
10
V
-
15
18
F
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ESD5451X-MS
ELECTRICAL CHARACTERISTICS CURVE
Copyright© Msksemi Incorporated
www.msksemi.com
ESD5451X-MS
PACKAGE MECHANICAL DATA
Dim
Inches
MIN
Millimeters
MAX
MIN
MAX
A
0.0125
0.02
0.32
0.52
B
0.000
0.002
0.00
0.05
C
0.037
0.043
0.95
1.080
D
0.022
0.027
0.55
0.680
E
0.016
0.024
0.40
0.60
F
0.008
0.012
0.20
0.30
H
R
0.015Typ.
0.001
0.005
0.40Typ.
0.05
0. 15
Suggested Pad Layout
NOTES:
1.CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN
DEGREES).
2.THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
REEL SPECIFICATION
P/N
ESD5451X-MS
Copyright© Msksemi Incorporated
PKG
DFN1006-2L
QTY
10000
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ESD5451X-MS
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not
handle applications that require extremely high levels of reliability, such as life-support
have specifications
that can
systems, aircraft's control systems, or
other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with
your MSKSEMI Semiconductor representative
nearest
you before using any MSKSEMI Semiconductor products described
or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in
products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the
performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To
verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test
devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor
products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could
endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing
equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are
not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design.
■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described
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written permission of MSKSEMI Semiconductor.
■
Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume
production. MSKSEMI Semiconductor believes information herein is accurate and
reliable, but no guarantees are made or
implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties.
■
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI
Semiconductor productthat you intend to use.
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