10018783-10012TLF

Type NUMBER PRODUCT SPECIFICATION TITLE GS-12-233 PAGE REV. TM PCI EXPRESS CONNECTOR AUTHORIZED BY Richard Chiu TABLE OF INTRODUCTION SECTION 2 GENERAL REQUIREMENTS 07/04/08 MECHANICAL 3.1 3.2 3.3 3.4 3.5 SECTION 4 EXAMINATION OF PRODUCT INSERTION/WITHDRAWAL FORCES – ADD IN CARD CONTACT RETENTION BOARD INSERTION/RETENTION FORCE SOLDERABILITY ELECTRICAL 4.1 4.2 4.3 4.4 4.5 4.6 4.7 SECTION 5 DATE CONTENTS SECTION 1 SECTION 3 H 1 of 11 LOW LEVEL CONTACT RESISTANCE INSULATION RESISTANCE DIELECTRIC WITHSTANDING CONTACT CURRENT RATING INSERTION LOSS RETURN LOSS CROSSTALK ENVIRONMENTAL 5.1 THERMAL SHOCK 5.2 CYCLIC TEMPERATURE AND HUMIDITY 5.3 TEMPERATURE LIFE (PRE-CONDITIONING) 5.4 TEMPERATURE LIFE 5.5 VIBRATION 5.6 DURABILITY (PRE-CONDITIONING) 5.7 DURABILITY 5.8 MIXED FLOWING GAS 5.9 RESEATING 5.10 RESISTANCE TO SOLDER HEAT SECTION 6 TEST MATRIX This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI. Form E-3005 Rev E GS-01-001 PDM: Rev:H STATUS:Released Printed: Nov 27, 2010. Type NUMBER PRODUCT SPECIFICATION TITLE GS-12-233 PAGE TM PCI EXPRESS CONNECTOR REV. H 2 of 11 AUTHORIZED BY Richard Chiu DATE 07/04/08 1.0 INTRODUCTION 1.1 SCOPE This document describes the functional and test requirements for the PCI ExpressTM card-edge connector. The connector is designed to meet the requirements of the PCI Express Card Electromechanical Specification and certain customer specifications not covered by the PCI-SIG document. 1.2 APPLICABLE DOCUMENTS 1.2.1 1.2.2 1.2.3 1.2.4 1.2.5 1.2.6 Solderability : BUS-19-002/A PCI Express Card Electromechanical Specification EIA –90, EIA-36409,17,20,21,28,31,32,65,70,101,108,638 PCI Express Connector High Speed Electrical Test Procedure. FCI drawing, PCI Express connector, inspection & customer copy. FCI drawing, solder washer, 78523 : inspection copy. 1.3 DRAWING PRECEDENCE In the event of conflict between this document and product prints, the product prints shall take precedence. 2.0 GENERAL REQUIREMENTS 2.1 2.2 2.3 2.4 2.5 The connector has the following characteristics: 1.00m(0.040”) pitch, X1, X4, X8, X16 sizes, through hole or straddle mount configuration, rectangular outline, plastic peg or two forklock holdowns requiring TH holes on PCB. Visual examination, unless otherwise specified, shall be made at 7X. Silicone compounds (mold releases, lubricants, etc.) May not be used in the manufacturing processes. Flammability to be rated UL 94V-0. Unless otherwise specified, tests that require the use of a pc edge card shall use the following 2.5.1Card material: FR-4 glass epoxy. 2.5.2Thickness: 1.57 +/- 0.13 (0.062 +/- 0.005 inch) 2.5.3Trace material: 0.035 (0.0014 inches), copper. 2.5.4Trace plating: 0.76 micrometers (30 microinches) minimum gold over 1.27 micrometers (50 microinches) minimum unbrushed nickel This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI. Form E-3005 Rev E GS-01-001 PDM: Rev:H STATUS:Released Printed: Nov 27, 2010. Type NUMBER PRODUCT SPECIFICATION TITLE GS-12-233 PAGE TM PCI EXPRESS CONNECTOR REV. H 3 of 11 AUTHORIZED BY Richard Chiu DATE 07/04/08 2.5.5Pad and trace design: pad and trace design shall follow PCI Express standard as depicted in customer drawing. 2.6 SOLDERTAIL TERMINATION Tests requiring termination of the soldertails to a PC board shall be prepared as follows: 2.6.1A 2.4mm +/- 0.13 (0.094 +/- 0.005) thick FR-4 glass epoxy board having no internal ground planes with plated thru holes in the pattern specified in AFCI customer drawing, shall be used. 2.6.2 Solder washers, AFCI part number 78523-001, shall be applied to the tails, and the connector vapor phase reflowed at 215°C (419°F) for a time not to exceed 2 minutes. 3.0 MECHANICAL REQUIREMENTS 3.1 EXAMINATION OF PRODUCT Samples must comply to applicable FCI product prints. 3.2 INSERTION / WITHDRAWAL FORCE- ADD IN CARD PER EIA-364-13 Mating cycle is with maximum/minimum thickness gage at a rate of 25.4 mm/minute. 3.2.1 Maximum insertion force is 1.15 N max. per contact pair when measured with a 1.70 +0.00/-0.01(0.067 +0.000/ -0.004 inches) thick hardened steel card made to the dimensions shown for the PCI Express expansion board in the FCI customer drawing. The card has a R0.05 min., R0.10 max.(sharpedge)and the surface roughness in connector area to be 0.10 micrometers (4 microinches) maximum. 3.2.2 Withdrawal force is 0.15N minimum per contact pair when measured with a 1.44 +0.01/-0.00 (0.067 +0.004/-0.000 inches) thick hardened steel card made to the dimensions shown for the PCI Express expansion board in the FCI customer drawing. The card has a R0.05 min., R0.10 max (sharp edge) and the surface roughness in the connector area to be 0.10 micrometers (4 microinches) maximum. 3.3 CONTACT RETENTION This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI. Form E-3005 Rev E GS-01-001 PDM: Rev:H STATUS:Released Printed: Nov 27, 2010. Type NUMBER PRODUCT SPECIFICATION TITLE GS-12-233 PAGE TM PCI EXPRESS CONNECTOR REV. H 4 of 11 AUTHORIZED BY Richard Chiu DATE 07/04/08 Minimum retention force of terminals in the connector housing to be 5N each. Pull rate to be 1.27 mm/min. 3.4 BOARD RETENTION / INSERTION FORCES 3.4.1 Board retention / insertion forces should be checked on an 1.57 +/- 0.13 (0.062 +/- 0.005 inch) thick segment of FR-4 glass / epoxy circuit board segment with a hole of diameter as described below drilled through. Connectors should have all contacts present. Forces apply to connectors with plastic pegs and metal board locks. 3.4.2 Maximum insertion force(including all types post or straddle mount solder tails) to seat connector in PCB(including straddle mount or through PCB)are: 36 pos 2.14 kg max. 64 pos 3.91 kg max. 98 pos 7.45 kg max. 164 pos 7.45 kg max. 3.5 SOLDERABILITY Per J-STD-002 a. steam age for 1 hour b. contact areas evaluated shall meet 95% minimum coverage. 4.0 ELECTRICAL REQUIREMENTS Unless otherwise specified, all measurements should be performed in the following ambients: relative humidity: temperature: barometric pressure: 50% or less 25°C +/- 5°c 711 to 812 mm mercury (at sea level) 4.1 LOW LEVEL CONTACT RESISTANCE EIA-364-23 This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI. Form E-3005 Rev E GS-01-001 PDM: Rev:H STATUS:Released Printed: Nov 27, 2010. Type NUMBER PRODUCT SPECIFICATION TITLE GS-12-233 PAGE REV. TM PCI EXPRESS CONNECTOR H 5 of 11 AUTHORIZED BY Richard Chiu DATE 07/04/08 4.1.1Solder connector to pc board per section 2.6 and insert card per section 2.5 4.1.2Resistance measurements should be made from the underside of the pc board to the PTH in the add-in card above the contact pad. The test current shall be 100 milliampere d.c. max. with a maximum open circuit voltage of 20 millivolts D.C. See figure 1.0 for attachment of current and voltage leads. 4.1.3Requirement is 30 milliohms maximum initial, with change of 10 milliohms maximum after exposure testing. CONTACT RESISTANCE TEST SET UP THROUGH HOLE FIGURE 1 This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI. Form E-3005 Rev E GS-01-001 PDM: Rev:H STATUS:Released Printed: Nov 27, 2010. Type NUMBER PRODUCT SPECIFICATION TITLE GS-12-233 PAGE REV. TM PCI EXPRESS CONNECTOR H 6 of 11 AUTHORIZED BY Richard Chiu DATE 07/04/08 CONTACT RESISTANCE TEST SET UP STRADDLE MOUNT FIGURE 2 4.2 INSULATION RESISTANCE Requirement is 1000 megohm minimum at 100 + / - 10% vdc when tested to EIA-364-21 per spec. The connector shall not be mated during insulation resistance measurement. 4.3 DIELECTRIC WITHSTANDING Per EIA-364-20 method B per spec. Test potential to be 300 VAC RMS, 60 HZ, and applied for 1 minute. No breakdown should occur. Test is performed with connector unmated. 4.4 CONTACT CURRENT RATING 1.1 amp per contact minimum per EIA-364—70, method 2 and PCI Express Connector High Speed Electrical Test Procedure. The temperature rise shall not exceed 30 degree C. Ambient condition is still air at 25°C. 4.5 INSERTION LOSS Per EIA-364-101 and PCI Express Connector High Speed Electrical Test Procedure. Requirements: Less than or equal to 1dB up to 1.25 GHz This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI. Form E-3005 Rev E GS-01-001 PDM: Rev:H STATUS:Released Printed: Nov 27, 2010. Type NUMBER PRODUCT SPECIFICATION TITLE GS-12-233 PAGE TM PCI EXPRESS CONNECTOR REV. H 7 of 11 AUTHORIZED BY Richard Chiu DATE 07/04/08 Less than or equal to 1.6 x (F-1.25)+1) db between 1.25GHz and 3.75GHz. Less than or equal to 5 dB at 3.75 GHz 4.6 RETURN LOSS Per EIA-364-108 and Test Procedure. Requirements: Less than Less than Less than PCI Express Connector High Speed Electrical or equal to -12dB up to 1.3 GHz or equal to -7dB up to 2.0 GHz or equal to -4dB up to 3.75 GHz 4.7 CROSSTALK: NEXT Per EIA-90 and PCI Express Connector Procedure. Requirements: Less than or equal to -32 dB max Less than or equal to –(32 – 2.4 GHz and 3.75GHz. Less than or equal to -26 dB max High Speed Electrical Test up to 1.25 GHz x (F-1.25)) db between 1.25 up to 3.75 GHz 5.0 ENVIRONMENTAL REQUIREMENTS (Per EIA-364-1000.01) 5.1 THERMAL SHOCK Per EIA-364-32, test condition I, 10 cycles 5.2 CYCLIC TEMPERATURE AND HUMIDITY Per EIA-364-31, 24 cycles 5.3 TEMPERATURE LIFE (Pre-conditioning) Per EIA-364-17, method A, 92 hours at 105°C 5.4 TEMPERATURE LIFE Per EIA-364-17, method A, 168 hours at 105°C 5.5 VIBRATION Per EIA-364-28, test condition VII, test condition letter D. Requirements: no evidence of physical damage 5.6 DURABILITY (Pre-conditioning) CYCLE RATE : 500 MATING / HOUR Per EIA-364-09, 20 cycles This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI. Form E-3005 Rev E GS-01-001 PDM: Rev:H STATUS:Released Printed: Nov 27, 2010. Type NUMBER PRODUCT SPECIFICATION TITLE GS-12-233 PAGE REV. TM PCI EXPRESS CONNECTOR H 8 of 11 AUTHORIZED BY Richard Chiu DATE 07/04/08 5.7 DURABILITY CYCLE RATE : 500 MATING / HOUR Per EIA-364-09, 50 cycles 5.8 MIXED FLOWING GAS Per EIA-364-65, class IIA, 10 days exposure. Expose connectors unmated for 2/3 of the total duration. Mate each connector to the same add-in card that it was mated to in temperature life (preconditioning) and expose for the remainder of the test duration. 5.9 RESEATING Manually plug/unplug the card and connector, 3 cycles. 5.10RESISTANCE TO SOLDERING HEAT Per EIA-364-56 procedure 3, test condition C. 260°±5°C 10±2 seconds This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI. Form E-3005 Rev E GS-01-001 PDM: Rev:H STATUS:Released Printed: Nov 27, 2010. Type NUMBER PRODUCT SPECIFICATION GS-12-233 TITLE PAGE REV. TM PCI EXPRESS CONNECTOR H 9 of 11 AUTHORIZED BY DATE Richard Chiu 07/04/08 6.0 Test Matrix for 1X,4X,8X,& 16X TABLE 1 - QUALIFICATION TESTING MATRIX TEST Examination of Product Insertion/Withdrawal Force – Add In Card Contact Retention Board Retention /Insertion Forces Solderability Low Level Contact Resistance Insulation Resistance DWV Contact Current Rating Insertion Loss Return Loss Crosstalk Thermal Shock Cyclic Temp and Humidity Temperature Life (preconditioning) Temperature Life Vibration Durability (preconditioning) Durability Mixed Flowing Gas Reseating Resistance to soldering heat PARA 3.1 TEST GROUP TEST GROUP TEST GROUP TEST GROUP 1 2 3 4 1 1 1 1 5 TEST SEQUENCE 1 3.2 3.3 3 5 3.4 3.5 2 4 4.1 4.2 4.3 4.4 4.5 4.6 4.7 5.1 2,5,7 5.6 5.7 5.8 5.9 2,5,7 TEST GROUP TEST GROUP TEST GROUP 6 7 8 1 1 1 2,5,7,9 ,11 TEST GROUP 9 1 3,5 2,6 2 2 3 4 4 5.2 5.3 5.4 5.5 2,5,8, 10 7 8 6 4 4 4 6 3 3 3 3 4 6 9 6 10 5.10 (1) Sample Quantity / Group TEST GROUP 16X-5 (1) 200-5 (1) 280-5 16X-5 16X10,8X-10, 4X-10,1X(3) 16X-5 10 200-10, 200-5 (2) 280-5 16X-10 280-10 (4) 4X-3 16X-10 (1) 200-10 (1) (5) 280-10 16X-4 2 16X-3 Plasti c peg 16X-3 board lock This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI. Form E-3005 Rev E GS-01-001 PDM: Rev:H STATUS:Released Printed: Nov 27, 2010. Type NUMBER PRODUCT SPECIFICATION TITLE GS-12-233 PAGE TM PCI EXPRESS CONNECTOR REV. H 10 of 11 AUTHORIZED BY Richard Chiu DATE 07/04/08 Notes: 1. 2. samples for test groups 1,2,3,6 & 8 have metal hold downs, phos bronze contacts and 0.38 micrometers (15 u”) gold plate, and black housings. samples for test group 4: a. 5 each same as note 1 b. 5 each same as note except with 0.76 micrometers (30u”) gold plate. 3. samples for test group 5: a. 5 each same as b. 5 each same as 4. samples for test group 7: a. 5 each same as b. 5 each same as note 1 note except with plastic locating pegs. note 1 note except with 0.76 micrometers (30U”) gold plate. 5. samples for test group 8: a. 2 each same as note 1 b. 2 each same as note except with 0.76 micrometers (30U”) gold plate. This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI. Form E-3005 Rev E GS-01-001 PDM: Rev:H STATUS:Released Printed: Nov 27, 2010. Type NUMBER PRODUCT SPECIFICATION TITLE GS-12-233 PAGE TM PCI EXPRESS CONNECTOR REV. H 11 of 11 AUTHORIZED BY Richard Chiu DATE 07/04/08 REVISION RECORD REV A PAGE ALL RELEASED B ALL c ALL D ALL E DESCRIPTION ECR # T03-0302 DATE 07/21/2003 Add 5.10 on Sheet 7 Add group 9 on sheet 8 Modify 5.8 on sheet 7 T03-0463 T03-0513 10/17/03 11/24/03 03/10/04 ALL 3.2 add PER EIA-364-13 & cycle T04-0114 rate 4.1 add PER EIA-364-23 5.6 & 5.7 add cycle rate ADD STRADDLE MOUNT TYPE T04-0341 08/04/04 F ALL ADD 3.4.3 T04-0414 11/23/04 G ALL 06/20/06 H 4 MODIFY 3.4.2, REMOVE 3.4.3 AND T06-0120 CHANGE FORM SOLDERABILITY-REFERENCE T08-1128 DOCUMENT WAS REPLACED BY “JSTD-002” 07/04/08 This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI. Form E-3005 Rev E GS-01-001 PDM: Rev:H STATUS:Released Printed: Nov 27, 2010.