User's Guide
SNVA104A – January 2005 – Revised May 2013
AN-1358 LM5070 (AE) Evaluation Board
1
Introduction
The LM5070 AE (Area Efficient) evaluation board is designed to provide an IEEE802.3af compliant, Power
over Ethernet (PoE) power supply. The power supply features the LM5070 PoE powered device (PD)
interface and controller integrated circuit (IC) configured in the versatile flyback topology. The board
features a fully isolated solution, but you have the freedom to transform the circuit into a non-isolated
regulator if you desire. Several schematic versions are supplied in this document to those ends.
General performance features of the AE evaluation board are:
• Isolated 3.3V output
• Input range: 32 to 57V
• Output current: 0 to 3.3A
• Measured converter efficiency: 84% at 3.0A
• Operating frequency: 250kHz
• Programmed undervoltage lockout (UVLO) release: 38.6V
• Programmed UVLO: 32.4V (6.2V Hysteresis)
2
A Note About Potentials
The LM5070 is designed to work with PoE applications that are typically -48V systems. The datasheet for
the LM5070 was written under the more generic, and more easily understood, positive voltage convention
referenced to the VEE pin of the IC. The application board is an example of a PoE system architecture, and
has pins “GND” and “-VIN” for the high and low input potentials, respectively, and output pins “Vout+” and
“SGND”. For simplicity and consistency with the datasheet, this application note will be written and all
measurements will be taken using the positive voltage convention, with the “-VIN” pin connected to the
bench power supply ground, and the GND pin connected to the power supply high potential. Input bridge
rectifiers allow either polarity operation when using the RJ-45 connector.
3
Signature Discovery Mode
To detect a powered device connected to the Ethernet cable, the Power Sourcing Equipment (PSE) will
apply two different voltages between 2.8V and 10V across the input terminals of the PD. A PD will be
considered present if the detected differential impedance is above 23.75kΩ and below 26.25kΩ If the
impedance is less than 15kΩ or greater than 33kΩ, a PD will be considered not present and will not
receive power. Impedances between these values may or may not indicate the presence of a valid PD.
The LM5070 will enable the signature resistor (R5) at an input voltage of 1.5V, and disable signature
mode around 12V, measured at the input pins of the IC. The actual differential threshold voltages
measured at the PD board terminals will be somewhat higher (~1.0V) due to the input diodes that are in
series with the input.
4
Classification Mode
To classify the PD according to power draw, the PSE will present a voltage between 14.5V and 20.5V to
the PD. The LM5070 enables classification mode at a nominal input voltage of 11.7V, again measured at
the input pins of the IC. An internal 1.5V linear regulator (referenced to VEE) and an external resistor
connected between the RCLASS pin and VEE provide classification programming current. The following table
can be used to select the proper RCLASS resistor.
All trademarks are the property of their respective owners.
SNVA104A – January 2005 – Revised May 2013
Submit Documentation Feedback
AN-1358 LM5070 (AE) Evaluation Board
Copyright © 2005–2013, Texas Instruments Incorporated
1
UVLO and UVLO Hysteresis
www.ti.com
Class
PMIN
PMAX
ICLASS
(MIN)
ICLASS
(MAX)
RCLASS
0
0.44W
12.95W
1
0.44W
3.84W
0mA
4mA
Open
9mA
12mA
2
3.84W
150Ω
6.49W
17mA
20mA
82.5Ω
3
6.49W
12.95W
26mA
30mA
53.6Ω
4
Reserved
Reserved
36mA
44mA
38.3Ω
As seen on the board schematic, no resistor is needed to program class 0 (full power) because the bias
current of the IC (~600µA) will be considered class 0 without any additional current draw.
5
UVLO and UVLO Hysteresis
The UVLO threshold and UVLO hysteresis can be programmed completely independently of each other.
UVLO hysteresis is accomplished with an internal 10uA current source that is switched on and off into the
impedance of the UVLO set point resistor divider. When the UVLO pin exceeds 2.00V, the current source
is activated to instantly raise the voltage at the UVLO pin. When the UVLO pin voltage falls below the
2.00V threshold, the current source is turned off, causing the voltage at the UVLO pin to fall. The LM5070
UVLO thresholds cannot be programmed lower than 23V, otherwise the device would operate in
classification mode with both the classification current source and the SMPS enabled. The combined
power dissipation of these two functions could exceed the maximum power dissipation of the package.
Without taking into account the external diodes, UVLO is programmed on the AE board to 31.4V, with
6.2V of hysteresis. UVLO will therefore release at 37.6V. The input steering diodes will add approximately
1V to each threshold, so the UVLO and UVLO release thresholds will be 32.4V and 38.6V, measured at
the input connector, respectively.
6
Inrush Current Limiting
The LM5070's default inrush current can be as high as 400mA at room temperature. With 20Ω effective
series resistance in the input line, an 8V drop may occur at startup. When all tolerances are taken into
consideration, it is difficult to guarantee a minimum of 8V of hysteresis while staying within the threshold
limits of the IEEE specification. Also, margin between the minimum hysteresis designed and the maximum
required is an important design constraint. To lessen the hysteresis requirement, one should program the
inrush current to a lesser value.
On the AE application board, the inrush current has been programmed to 150mA using the following
equation:
RCLP =
16 k: x A
I inrush
(A)
LIMIT
=
16 k: x A
= 107 k:
0.150A
(1)
Taking 20% current programming accuracy into consideration, programming the current limit to 150mA
decreases the hysteresis requirement to 3.6V, and a much more robust design is now possible.
Programming the inrush current does not affect the power delivering capability during normal operation
because the current limit level is switched back to the default level at the end of the inrush sequence.
7
Flyback Theory of Operation
The flyback transformer is actually a coupled inductor with multiple windings wound on a single gapped
core. For simplification, we refer to the first, driven winding, as the primary and the main output winding as
the secondary winding of the flyback transformer.
The flyback converter is a converter in which inductive energy is stored by applying a voltage across the
primary in a similar manner to that of a boost converter. A second coupled winding (secondary) of the
inductor transfers the energy to a secondary side rectifier after the primary voltage has been switched off.
This allows the converter input and output grounds to be configured either isolated or non-isolated. A
voltage / current ratio transformation is possible by altering the winding ratio between the primary and any
other winding. A semi-regulated auxiliary winding can also be provided to bias primary or secondary
control circuits.
2
AN-1358 LM5070 (AE) Evaluation Board
SNVA104A – January 2005 – Revised May 2013
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Proper Board Connections
www.ti.com
The transformer’s primary inductance is typically designed as large as is practical. However, the air gap
necessary to store the cycle energy lowers the obtainable inductance. The higher the primary inductance,
the less input ripple current will be generated and the less input filtering will be required.
As shown, the LM5070 directly drives a MOSFET switch to apply voltage across the primary. When the
switch turns off, the secondary applies a forward current to the output rectifier and charges the output
capacitor. In applications where the input voltage is considerably higher than the output voltage, the turns
ratio between primary and secondary will reflect the input/output voltage ratio and the duty cycle.
The LM5070 controller provides an internal startup regulator (VCC), soft start, and over-current protection.
The controller can and will run indefinitely without the winding, but the increase in on chip power
dissipation will decrease efficiency and may reduce the maximum ambient operating temperature.
8
Proper Board Connections
Be sure to choose the correct wire size when connecting the source supply and load. Monitor the current
into and out of the unit under test (UUT). Monitor the voltages directly at the board terminals, as resistive
voltage drops along the wires may decrease measurement accuracy. These precautions are especially
important during measurement of conversion efficiency.
9
Source Power
To fully test the LM5070 evaluation board, a DC power supply capable of at least 60V and 1A is required.
Adjusting the short circuit current limit on the power supply to ~1A may prevent board damage if an errant
connection is made during evaluation.
10
Loading / Current Limiting Behavior
A resistive load is optimal, but an appropriate electronic load specified for operation down to 2.0V is
acceptable. The maximum load current is 3.4A, exceeding this current at low line may cause oscillatory
behavior as the part will go into current limit mode. Current limit mode is triggered any time the average
current through the main internal circuit breaker MOSFET exceeds 390mA. If current limit is triggered, the
switching regulator is automatically disabled by discharging the softstart pin. The module is then allowed
to restart, but the part will reset itself indefinitely if the condition causing the current limit to trip remains.
11
Power Up
It is suggested that the load be kept reasonably low during the first power up. Check the supply current
during signature and classification modes before applying full power. During signature mode, the module
should have the I-V characteristics of a 25kΩ resistor in series with two diodes. During classification
mode, current draw should be about 600µA at 15V as the RCLASS pin is left open to default to class 0. If the
proper response is not observed during both signature and classification modes, check the connections
closely.
Once proper setup has been established, full power (48V) may be applied. A voltmeter across the output
terminals, Vout+ and SGND, will allow direct measurement of the 3.3V output line. Because the output
voltage is isolated, it cannot be measured by a meter referenced to the bench power supply ground. If
3.3V is not observed within a few seconds, turn the power supply off and review connections.
A final check of efficiency is the best way to confirm that the UUT is operating properly. Few parameters
can be incorrect in a switching power supply without creating additional losses and potentially damaging
heat. Efficiency above 70% is expected.
12
Performance Characteristics
12.1 Power-up Sequence
In addition to a reduction in board area, the high level of integration designed into the LM5070 allows all
power sequencing communications to occur within the IC. Very little system management design is
required by the design engineer. The power up sequence is as follows:
1. Before power up, all nodes in the non-isolated section of the power supply remain at high potential until
SNVA104A – January 2005 – Revised May 2013
Submit Documentation Feedback
AN-1358 LM5070 (AE) Evaluation Board
Copyright © 2005–2013, Texas Instruments Incorporated
3
Performance Characteristics
www.ti.com
UVLO is released and the drain of the main circuit breaker internal MOSFET is pulled down to VEE (IC
pin 7).
2. Once the RTN pin of the IC (pin 8) drops below 1.5V (referenced to VEE), the VCC regulator is released
and allowed to start. This signals the assertion of the internal “Power Good” signal. The VCC regulator
ramps at a rate equal to its current limit, typically 20 mA, divided by the VCC load capacitance.
3. Once the VCC regulator is within minimum regulation, about 7.9V referenced to RTN, the softstart pin is
released. The softstart pin will rise at a rate equal to the softstart current source, typically 10µA,
divided by the softstart pin capacitance.
4. As the switching regulator achieves regulation, the auxiliary winding will raise the VCC voltage to ~12V,
thus shutting down the internal regulator and increasing efficiency.
Figure 1 shows the RTN, VCC, and Softstart IC pins during a normal startup sequence. The auxiliary
winding starts to supply a higher voltage to VCC as the switching regulator output voltage rises.
3
2
1
Horizontal resolution: 5 ms/Div.
Trace 1: RTN pin, elevated until UVLO release 20.0 V/Div.
`
Trace 2. Softstart pin, starts when VCC achieves minimum regulation, 5.0 V/Div.
Trace 3: VCC, starts when RTN < 1.5V, elevated by auxiliary winding, 5.0 V/Div.
Figure 1. Normal Startup Sequence
Figure 2 shows a normal 3.3V line startup.
1
Horizontal Resolution: 1.0 ms/Div.
Trace 1: +3.3V output line, 1.0V/Div
Figure 2. Regulator Output (+3.3V) Startup Detail
4
AN-1358 LM5070 (AE) Evaluation Board
SNVA104A – January 2005 – Revised May 2013
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Performance Characteristics
www.ti.com
12.2 Output Dead Short Fault Response
The system should be able to survive a dead short at the output. Applying a dead short to the +3.3V line
causes a number of protection mechanisms to trip sequentially. They are:
1. Feedback raises duty cycle in an attempt to maintain the output voltage. This causes a cycle-by-cycle
over-current condition to exist at the programmable current sense (CS) pin of the IC.
2. The average current in the internal circuit breaker MOSFET rises until it is current limited around
390mA. Some overshoot in the current will be observed, as it takes time for the current limit amplifier
to react and change the operating mode of the MOSFET.
3. Because linear current limit is accomplished by driving the MOSET into saturation, the drain voltage
(RTN pin) rises. When it reaches 2.5V with respect to VEE, the internal Power Good signal is deasserted.
4. The de-assertion of Power Good causes the discharge of the Softstart pin, which disables all switching
action.
5. Once the switching action stops, the fault condition is no longer observed by the LM5070, and the
system is allowed to automatically restart when Power Good is re-asserted.
The AE board has a programmed switching regulator current limit of 1.5A, not high enough to cause an
over current condition in the circuit breaker MOSFET. Consequently, steps 2-5 above will not be observed
and the module will remain in cycle-by-cycle current limit indefinitely until the fault condition is removed.
Changing the current sense resistor to a lower value may induce automatic re-try mode per steps 1-5.
Figure 3 shows the CS pin during an output short condition.
1
Horizontal Resolution: 2.0 Ps/Div.
Trace 1: CS pin, 200 mV/Div.
Figure 3. CS Pin During Output Short Fault
SNVA104A – January 2005 – Revised May 2013
Submit Documentation Feedback
AN-1358 LM5070 (AE) Evaluation Board
Copyright © 2005–2013, Texas Instruments Incorporated
5
Performance Characteristics
www.ti.com
12.3 Step Response
Figure 4 shows the step response at VIN = 48V for an alternating instantaneous load change from 1A to
3A.
1
Horizontal Resolution: 200.0 Ps/Div.
Trace 1: +3.3V Output (AC coupled), 100 mV/Div.
Figure 4. Regulator Response to Step Load
12.4 Ripple Voltage/Currents
2
1
Horizontal Resolution: 2.0 Ps/Div.
Trace 1 = Input Current Ripple, 100 mA/Div.
Trace 2 = Input Ripple (AC Coupled), 200 mV/Div.
Figure 5. Input Ripple
6
AN-1358 LM5070 (AE) Evaluation Board
SNVA104A – January 2005 – Revised May 2013
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
A Note on the Schematics
www.ti.com
1
2
Horizontal Resolution
: 2.0 ms/Div.
Trace 1 = Output Ripple(AC Coupled), 20 mV/Div.
Trace 2 = Output Current Ripple 1.0 A/Div.
Figure 6. Output Ripple
12.5 Switching Waveforms
2
1
Horizontal Resolution: 1.0 Ps/Div.
Trace 1 = CS Pin, 200 mV/Div.
Trace 2 = Drain of MOSFET Q1, 50V/Div.
Figure 7. Typical Switching Waveforms
13
A Note on the Schematics
The AE evaluation board is typically configured with the output fully isolated from the GND and "-VIN"
terminals, though it may be desirable to configure a non-isolated solution in some applications. The board
is fully configurable using various jumpers that are preset when the board leaves the factory. Three
schematics are supplied to aid the engineer with the design of various configurations. The first is
representative of the isolated design, the second a typical non-isolated solution. The last shows the entire
configurable board with all jumpers required to design either isolated or non-isolated regulators.
SNVA104A – January 2005 – Revised May 2013
Submit Documentation Feedback
AN-1358 LM5070 (AE) Evaluation Board
Copyright © 2005–2013, Texas Instruments Incorporated
7
A Note on the Schematics
www.ti.com
Figure 8. Isolated Solution
Figure 9. Non-Isolated Solution
8
AN-1358 LM5070 (AE) Evaluation Board
SNVA104A – January 2005 – Revised May 2013
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Bill of Materials for LM5070 3.3V PoE Isolated Evaluation Board
www.ti.com
Figure 10. Full Board with Jumpers and All Components
14
Bill of Materials for LM5070 3.3V PoE Isolated Evaluation Board
Designator
Part Type
Footprint
Description
Manufacturer
C1
2.2µ, 100V
1812
Capacitor Ceramic X7R
TDK/C4532X7R2A225
C2
2.2µ, 100V
1812
Capacitor Ceramic X7R
TDK/C4532X7R2A225
C3
2.2µ, 100V
1812
Capacitor Ceramic X7R
TDK/C4532X7R2A225
C4
0.1µ
805
Capacitor Ceramic X7R
Vitramon/VJ0805
C5
0.22µ
805
Capacitor Ceramic X7R
Vitramon/VJ0805
C6
0.1µ
805
Capacitor Ceramic X7R
Vitramon/VJ0805
C7
47n
805
Capacitor Ceramic X7R
Vitramon/VJ0805
C9
1µ
805
Capacitor Ceramic X7R
TDK/C2012X5R1A105K
C10
1n
805
Capacitor Ceramic X7R
Vitramon/VJ0805
C13
OPEN
805
C14
10µ, 6.3V
1206
Capacitor Ceramic X7R
TDK/C3216X5R0J106K
C15
10µ, 6.3V
1206
Capacitor Ceramic X7R
TDK/C3216X5R0J106K
C16
390u
Capacitor electrolytic
Sanyo/6CV390EX
C17
10µ, 6.3V
1206
Capacitor Ceramic X7R
TDK/C3216X5R0J106K
C18
1n
805
Capacitor Ceramic X7R
Vitramon/VJ0805
C19
4.7n
805
Capacitor Ceramic X7R
Vitramon/VJ0805
C20
10µ, 6.3V
1206
Capacitor Ceramic X7R
TDK/C3216X5R0J106K
C21
1µ
805
Capacitor Ceramic X7R
TDK/C2012X5R1A105K
C22
27n
805
Capacitor Ceramic X7R
Vitramon/VJ0805
Capacitor ceramic
Panasonic/ECKANA152ME
C23
1.5n
D1
DF01S
DFS
Diode bridge
Vishay/DF01S
D1A
HD01
MiniDip
Diode bridge
Diodes Inc/HD01
D2
DF01S
DFS
Diode bridge
Vishay/DF01S
SNVA104A – January 2005 – Revised May 2013
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
AN-1358 LM5070 (AE) Evaluation Board
9
Bill of Materials for LM5070 3.3V PoE Isolated Evaluation Board
Designator
10
Part Type
Footprint
www.ti.com
Description
Manufacturer
D2A
HD01
MiniDip
Diode bridge
Diodes Inc/HD01
D3
MMSD4148
SOT-23
Small signal diode
Vishay/MMSD4148
D4
OPEN
SOD-123
D5
12CWQ03
DPAK
Shottky rectifier
IR/12CWQ03
DZ1
SMAJ60A
SMA
Transient suppressor diode
Diodes/SMAJ60A
DZ2
OPEN
SMA
Transient suppressor diode
J1A
RJ45
Unshielded Ethernet jack
Samtec/MODS-A-8P8C-X
Shielded Ethernet jack
Samtec/MODS-A-8P8C-X-C
J1B
RJ45
JP_1
OPEN
JP_2
OPEN
JP_3
OPEN
L1
0.18µH
DO1813P181HC
Output inductor
Coilcraft/DO1813P-181HC
Q1
SI4848DY
SO-8
N-channel power MOSFET
Vishay/SI4848DY
R1
1.00k
805
1% Thick Film
DALE CRCW0805
R2
590k
805
1% Thick Film
DALE CRCW0805
R3
33.2k
805
1% Thick Film
DALE CRCW0805
R5
24.9k
805
1% Thick Film
DALE CRCW0805
R6
OPEN
805
1% Thick Film
DALE CRCW0805
R7
100
805
1% Thick Film
DALE CRCW0805
R8
0.33
1210
1% Thick Film
DALE CRCW1210
R10
107k
805
1% Thick Film
DALE CRCW0805
R13
20
805
1% Thick Film
DALE CRCW0805
R14
12.1k
805
1% Thick Film
DALE CRCW0805
R15
OPEN
1210
R16
10/OPEN for NI
805
1% Thick Film
DALE CRCW0805
R17
24.3k
805
1% Thick Film
DALE CRCW0805
R18
14.7k
805
1% Thick Film
DALE CRCW0805
R19
10.0k
805
1% Thick Film
DALE CRCW0805
R20
590/OPEN for NI
805
1% Thick Film
DALE CRCW0805
R23
1.00k/OPEN for NI
805
1% Thick Film
DALE CRCW0805
R24
0
805
1% Thick Film
DALE CRCW0805
REF1
LMV431/OPEN for NI
SOT23-5
Precision adjustable shunt regulator
Texas Instruments/LMV431
T1A
Pulse PA1269
EP13
POE Power transformer
Pulse/PA1269
T1B
Coilcraft C1495-A
EP13
U1
LM5070-50
TSSOP-16
POE PD Interface and PWM Controller
Texas Instruments/LM5070
U2
PS2501L-1-H
dip4-smt
Surface mount opto-coupler
NEC/PS2501L-1-H
AN-1358 LM5070 (AE) Evaluation Board
Coilcraft/C1495-A
SNVA104A – January 2005 – Revised May 2013
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated