TFP410-EP
PanelBus™ DIGITAL TRANSMITTER
SGLS344A − JULY 2006 − REVISED MAY 2011
D Controlled Baseline
D
D
D
D
D
D
D
D Enhanced PLL Noise Immunity
− One Assembly
− One Test Site
− One Fabrication Site
Extended Temperature Performance of
−55°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree†
Digital Visual Interface (DVI) Compliant(1)
Supports Pixel Rates Up to 165MHz
(Including 1080p and WUXGA at 60Hz)
Universal Graphics Controller Interface
− 12-Bit Dual-Edge and 24-Bit Single-Edge
Input Modes
− Adjustable 1.1-V to 1.8-V and Standard
3.3-V CMOS Input Signal Levels
− Fully Differential and Single-Ended Input
Clocking Modes
− Standard Intelt 12-Bit Digital Video Port
Compatible as on Intel 81x Chipsets
D
D
D
D
D
D
D
†
− On-Chip Regulators and Bypass
Capacitors for Reducing System Costs
Enhanced Jitter Performance
− No HSYNC Jitter Anomaly
− Negligible Data-Dependent Jitter
Programmable Using I2C Serial Interface
Monitor Detection Through Hot-Plug and
Receiver Detection
Single 3.3-V Supply Operation
64-Pin Thin Quad Flat Pack (TQFP) Using
TI’s PowerPAD™ Package
TI Advanced 0.18-μm EPIC-5™ CMOS
Process Technology
Pin Compatible With SiI164 DVI Transmitter
Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
description
The TFP410 is a Texas Instruments PanelBust flat panel display product, part of a comprehensive family of
end-to-end digital visual interface (DVI) 1.0-compliant solutions, targeted at the PC and consumer electronics
industry.
The TFP410 provides a universal interface to allow a glueless connection to most commonly available graphics
controllers. Some of the advantages of this universal interface include selectable bus widths, adjustable signal
levels, and differential and single-ended clocking. The adjustable 1.1-V to 1.8-V digital interface provides a
low-EMI, high-speed bus that connects seamlessly with 12-bit or 24-bit interfaces. The DVI interface supports
flat panel display resolutions up to UXGA at 165 MHz in 24-bit true color pixel format.
The TFP410 combines PanelBus circuit innovation with TI advanced 0.18-μm EPIC-5 CMOS process
technology and ultralow ground inductance PowerPADt package. The result is a compact 64-pin thin quad flat
pack (TQFP) package providing a reliable, low-current, low-noise, high-speed digital interface solution.
ORDERING INFORMATION
−55°C to 125°C
†
ORDERABLE
PART NUMBER
PACKAGE†
TA
PAP − TQFP
Tape and reel
TFP410MPAPREP
TOP-SIDE
MARKING
TFP410MEP
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1. The digital visual interface (DVI) specification is an industry standard developed by the digital display working group (DDWG) for high-speed
digital connection to digital displays and has been adopted by industry-leading PC and consumer electronics manufacturers. The TFP410
is compliant to the DVI Revision 1.0 specification.
PanelBus, PowerPAD, and EPIC-5 are trademarks of Texas Instruments.
VESA is a trademark of Video Electronics Standards Association.
Intel is a trademark of Intel Corporation.
Copyright © 2006 − 2011, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
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1
TFP410-EP
PanelBus™ DIGITAL TRANSMITTER
SGLS344A − JULY 2006 − REVISED MAY 2011
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These
circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,
Method 3015; however, it is advised that precautions be taken to avoid application of any voltage higher than maximum-rated
voltages to these high-impedance circuits. During storage or handling, the device leads should be shorted together or the device
should be placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic voltage level,
preferably either VCC or ground. Specific guidelines for handling devices of this type are contained in the publication Guidelines for
Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.
pin assignments
DGND
DATA12
DATA13
DATA14
DATA15
DATA16
DATA17
DATA18
DATA19
DATA20
DATA21
DATA22
DATA23
DKEN
RESERVED
DVDD
PAP PACKAGE
(TOP VIEW)
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
32
49
50
31
51
30
52
29
53
28
54
27
55
26
56
25
57
24
58
23
59
22
60
21
61
20
62
19
63
18
64
1 2
3 4
5
17
6 7 8 9 10 11 12 13 14 15 16
DVDD
DE
VREF
HSYNC
VSYNC
A3/DK3
CTL2/A2/DK2
CTL1/A1/DK1
EDGE/HTPLG
PD
MSEN/PO1
DVDD
ISEL/RST
DSEL/SDA
BSEL/SCL
DGND
NC
DATA11
DATA10
DATA9
DATA8
DATA7
DATA6
IDCK−
IDCK+
DATA5
DATA4
DATA3
DATA2
DATA1
DATA0
DGND
2
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TGND
TX2+
TX2−
TVDD
TX1+
TX1−
TGND
TX0+
TX0−
TVDD
TXC+
TXC−
TGND
TFADJ
PVDD
PGND
TFP410-EP
PanelBus™ DIGITAL TRANSMITTER
SGLS344A − JULY 2006 − REVISED MAY 2011
functional block diagram
Universal Input
IDCK±
DATA[23:0]
DE
VSYNC
12/24 Bit
I/F
HSYNC
VREF
TMDS Transmitter
Data
Format
EDGE/HTPLG
DKEN
Encoder
Serializer
TX2±
Encoder
Serializer
TX1±
Encoder
Serializer
TX0±
Control
TXC±
MSEN
PD
ISEL/RST
CTL/A/DK[3:1]
TFADJ
I2C Slave I/F
For DDC
BSEL/SCL
DSEL/SDA
1.8-V Regulators
With Bypass
Capacitors
PLL
Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
Input
The operation of these three multifunction inputs depends on the settings of the ISEL (pin 13) and
DKEN (pin 35) inputs. All three inputs support 3.3-V CMOS signal levels and contain weak pulldown
resistors so that, if left unconnected, they default to all low.
A3/DK3
CTL2/A2/DK2
CTL1/A1/DK1
6
7
8
I
When the I2C bus is disabled (ISEL = low) and the deskew mode is disabled (DKEN = low), pins 7 and 8
become the control inputs, CTL[2:1], which can be used to send additional information across the DVI
link during the blanking interval (DE = low). Pin 6 is not used.
When the I2C bus is disabled (ISEL = low) and the deskew mode is enabled (DKEN = high), these three
inputs become the deskew inputs DK[3:1], used to adjust the setup and hold times of the pixel data
inputs DATA[23:0], relative to the clock input IDCK±.
When the I2C bus is enabled (ISEL = high), these three inputs become the three LSBs of the I2C slave
address, A[3:1].
Upper 12 bits of the 24-bit pixel bus
In 24-bit, single-edge input mode (BSEL = high), this bus inputs the top half of the 24-bit pixel bus.
DATA[23:12]
36−47
I
In 12-bit, dual-edge input mode (BSEL = low), these bits are not used to input pixel data. In this mode,
the state of DATA[23:16] is input to the I2C register CFG. This allows eight bits of user configuration
data to be read by the graphics controller through the I2C interface (see the I2C register descriptions
section).
Note: All unused data inputs should be tied to GND or VDD.
Lower 12 bits of the 24-bit pixel bus/12-bit pixel bus input
DATA[11:0]
50−55,
58−63
I
In 24-bit, single-edge input mode (BSEL = high), this bus inputs the bottom half of the 24-bit pixel bus.
In 12-bit, dual-edge input mode (BSEL = low), this bus inputs one-half a pixel (12 bits) at every latch
edge (both rising and falling) of the clock.
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TFP410-EP
PanelBus™ DIGITAL TRANSMITTER
SGLS344A − JULY 2006 − REVISED MAY 2011
Terminal Functions (Continued)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
DE
2
I
Data enable. As defined in DVI 1.0 specification, the DE signal allows the transmitter to encode pixel
data or control data on any given input clock cycle. During active video (DE = high), the transmitter
encodes pixel data, DATA[23:0]. During the blanking interval (DE = low), the transmitter encodes
HSYNC, VSYNC, and CTL[3:1].
HSYNC
4
I
Horizontal sync input
IDCK−
IDCK+
56
57
I
Differential clock input. The TFP410 supports both single-ended and fully differential clock input
modes. In the single-ended clock input mode, the IDCK+ input (pin 57) should be connected to the
single-ended clock source and the IDCK− input (pin 56) should be tied to GND. In the differential clock
input mode, the TFP410 uses the crossover point between the IDCK+ and IDCK− signals as the timing
reference for latching incoming data DATA[23:0], DE, HSYNC, and VSYNC. The differential clock input
mode is only available in the low signal swing mode.
VSYNC
5
I
Vertical sync input
Configuration/Programming
Input bus select/I2C clock input. The operation of this pin depends on whether the I2C interface is
enabled or disabled. This pin is only 3.3-V tolerant.
BSEL/SCL
15
I
When I2C is disabled (ISEL = low), a high level selects 24-bit input, single-edge input mode. A low level
selects 12-bit input, dual-edge input mode.
When I2C is enabled (ISEL = high), this pin functions as the I2C clock input (see the I2C register
descriptions section). In this configuration, this pin has an open-drain output that requires an external
5-kΩ pullup resistor connected to VDD.
Data deskew enable. The deskew function can be enabled either through I2C or by this pin when I2C is
disabled. When deskew is enabled, the input clock to data setup/hold time can be adjusted in discrete
trim increments. The amount of trim per increment is defined by t(STEP).
DKEN
35
I
When I2C is disabled (ISEL = low), a high level enables deskew with the trim increment determined by
pins DK[3:1] (see the data deskew section). A low level disables deskew and the default trim setting is
used.
When I2C is enabled (ISEL = high), the value of DKEN and the trim increment are selected through I2C.
In this configuration, the DKEN pin should be tied to either GND or VDD to avoid a floating input.
DSEL/I2C data. The operation of this pin depends on whether the I2C interface is enabled or disabled.
This pin is only 3.3-V tolerant.
DSEL/SDA
14
I/O
When I2C is disabled (ISEL = low), this pin is used with BSEL and VREF to select the single-ended or
differential input clock mode (see the universal graphics controller interface modes section).
When I2C is enabled (ISEL = high), this pin functions as the I2C bidirectional data line. In this
configuration, this pin has an open-drain output that requires an external 5-kΩ pullup resistor
connected to VDD.
Edge select/hot plug input. The operation of this pin depends on whether the I2C interface is enabled or
disabled. This input is 3.3-V tolerant only.
EDGE/HTPLG
9
I
When I2C is disabled (ISEL = low), a high level selects the primary latch to occur on the rising edge of
the input clock IDCK+. A low level selects the primary latch to occur on the falling edge of the input clock
IDCK+. This is the case for both single-ended and differential input clock modes.
When I2C is enabled (ISEL = high), this pin is used to monitor the hot plug detect signal (see the DVI or
VESA™ P&D and DFP standards). When used for hot-plug detection, this pin requires a series 1-KΩ
resistor.
I2C interface select/I2C reset (active low, asynchronous)
If ISEL is high, the I2C interface is active. Default values for the I2C registers can be found in the I2C
register descriptions section.
ISEL/RST
13
I
If ISEL is low, I2C is disabled and the chip configuration is specified by the configuration pins (BSEL,
DSEL, EDGE, VREF) and state pins (PD, DKEN).
If ISEL is brought low and then back high, the I2C state machine is reset. The register values are
changed to their default values and are not preserved from before the reset.
4
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TFP410-EP
PanelBus™ DIGITAL TRANSMITTER
SGLS344A − JULY 2006 − REVISED MAY 2011
Terminal Functions (Continued)
TERMINAL
NAME
I/O
NO.
DESCRIPTION
Monitor sense/programmable output 1. The operation of this pin depends on whether the I2C interface
is enabled or disabled. This pin has an open-drain output and is only 3.3-V tolerant. An external 5-kΩ
pullup resistor connected to VDD is required on this pin.
MSEN/PO1
11
O
When I2C is disabled (ISEL = low), a high level indicates a powered-on receiver is detected at the
differential outputs. A low level indicates a powered-on receiver is not detected. This function is valid
only in dc-coupled systems.
When I2C is enabled (ISEL = high), this output is programmable through the I2C interface (see the I2C
register descriptions section).
Power down (active low). In the power-down state, only the digital I/O buffers and I2C interface remain
active.
PD
10
I
When I2C is disabled (ISEL = low), a high level selects the normal operating mode. A low level selects
the power-down mode.
When I2C is enabled (ISEL = high), the power-down state is selected through I2C. In this configuration,
PD should be tied to GND.
Note: The default register value for PD is low, so the device is in power-down mode when I2C is first
enabled or after an I2C reset.
Input reference voltage. Selects the swing range of the digital data inputs (DATA[23:0], DE, HSYNC,
VSYNC, and IDCK±).
VREF
3
I
For high-swing 3.3-V input signal levels, VREF should be tied to VDD.
For low-swing input signal levels, VREF should be set to half of the maximum input voltage level. See
the recommended operating conditions section for the allowable range for VREF.
The desired VREF voltage level is typically derived using a simple voltage-divider circuit.
Reserved
RESERVED
34
In
This pin is reserved and must be tied to GND for normal operation.
DVI Differential Signal Output
TFADJ
19
I
Full-scale adjust. This pin controls the amplitude of the DVI output voltage swing, determined by the
value of the pullup resistor RTFADJ connected to TVDD.
TX0+
TX0−
25
24
O
Channel 0 DVI differential output pair. TX0± transmits the 8-bit blue pixel data during active video and
HSYNC and VSYNC during the blanking interval.
TX1+
TX1−
28
27
O
Channel 1 DVI differential output pair. TX1± transmits the 8-bit green pixel data during active video and
CTL[1] during the blanking interval.
TX2+
TX2−
31
30
O
Channel 2 DVI differential output pair. TX2± transmits the 8-bit red pixel data during active video and
CTL[3:2] during the blanking interval.
TXC+
TXC−
22
21
O
DVI differential output clock
DGND
16, 48, 64
Ground
Digital ground
DVDD
Digital power supply. Must be set to 3.3-V nominal.
Power and Ground
1, 12, 33
Power
NC
49
NC
PGND
17
Ground
PLL ground
No connection required. If connected, tie high.
PVDD
18
Power
PLL power supply. Must be set to 3.3-V nominal.
TGND
20, 26, 32
Ground
Transmitter differential output driver ground
TVDD
23, 29
Power
Transmitter differential output driver power supply. Must be set to 3.3-V nominal.
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5
TFP410-EP
PanelBus™ DIGITAL TRANSMITTER
SGLS344A − JULY 2006 − REVISED MAY 2011
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage range, DVDD, PVDD, TVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4 V
Input voltage, logic/analog signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4 V
External DVI single-ended termination resistance, RT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 Ω to open circuit
External TFADJ resistance, RTFADJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 Ω to open circuit
Storage temperature range‡, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
Case temperature for 10 s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 in) from case for 10 s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
ESD protection: DVI pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 kV, Human-Body Model
All other pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV, Human-Body Model
JEDEC latch up (EIA/JESD78) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall
device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
dissipation ratings
PACKAGE
AIR FLOW
(cfm)
TA 3 255C
POWER RATING
DERATING FACTOR
ABOVE TA = 255C
TA = 705C
POWER RATING
TA = 855C
POWER RATING
TA = 1255C
POWER RATING
PAP
0
2.962 W
23.7 mW/°C
1.895 W
1.54 W
592 mW
NOTE: See Table 2 for the thermal properties of the 64-pin TQFP PowerPAD package.
recommended operating conditions
Supply voltage, VDD (DVDD, PVDD, TVDD)
Low-swing mode
Input reference voltage,
voltage VREF
NOM
MAX
3
3.3
3.6
0.55
VDDQ/2§
High-swing mode
DVI termination supply voltage, AVDD (see Note 1)
DVI receiver
DVI Single-ended termination resistance, RT (see Note 2)
DVI receiver
TFADJ resistor for DVI-compliant V(SWING), R(TFADJ)
400 mV = V(SWING) = 600 mV
Operating free-air temperature, TA
§
VDDQ defines the maximum low-level input voltage, it is not an actual input voltage.
NOTES: 1. AVDD is the termination supply voltage of the DVI link.
2. RT is the single-ended termination resistance at the receiver end of the DVI link.
6
MIN
POST OFFICE BOX 655303
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0.9
DVDD
3.14
3.3
UNIT
V
V
3.46
V
45
50
55
Ω
505
510
515
Ω
−55
25
125
°C
TFP410-EP
PanelBus™ DIGITAL TRANSMITTER
SGLS344A − JULY 2006 − REVISED MAY 2011
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
dc specifications
PARAMETERS
VIH
High-level
High
level input voltage
TEST CONDITIONS
Data, DE, VSYNC,
HSYNC, and IDCK+/−
VREF = DVDD
0.5 V ≤ VREF ≤ 0.95 V
Other inputs
Data, DE, VSYNC,
HSYNC, and IDCK+/−
MIN
TYP
MAX
UNIT
0.7 VDD
VREF + 0.2
V
0.7 VDD
VREF = DVDD
0.3 VDD
VIL
Low-level
L
l
l input
i
t voltage
lt
(CMOS input)
VOH
High-level digital output voltage (open-drain output)
VDD = 3 V, IOH = 20 μA
VOL
Low-level digital output voltage (open-drain output)
VDD = 3.6 V, IOL = 4 mA
0.4
V
IIH
High-level input current
VI = 3.6 V
±50
μA
IIL
Low-level input current
VI = 0
±50
μA
VH
DVI single-ended high-level output voltage
AVDD = 3.3 V ± 5%,
RT† = 50 Ω ± 10%,
RTFADJ = 510 Ω ± 1%
AVDD − 0.01
AVDD + 0.01
V
VL
DVI single-ended low-level output voltage
AVDD = 3.3 V ± 5%,
RT† = 50 Ω ± 10%,
RTFADJ = 510 Ω ± 1%
AVDD − 0.6
AVDD − 0.4
V
VSWING
DVI single-ended output swing voltage
AVDD = 3.3 V ± 5%,
RT† = 50 Ω ± 10%,
RTFADJ = 510 Ω ± 1%
400
600
VOFF
DVI single-ended standby/off output voltage
AVDD = 3.3 V ± 5%,
RT† = 50 Ω ± 10%,
RTFADJ = 510 Ω ± 1%
AVDD − 0.01
AVDD + 0.01
V
IPD
Power-down current (see Note 1)
200
500
μA
200
250
mA
IIDD
0.5 V ≤ VREF ≤ 0.95 V
VREF − 0.2
Other inputs
Normal power-supply current
V
0.3VDD
Worst-case
pattern‡
2.4
V
mVP-P
†
RT is the single-ended termination resistance at the receiver end of the DVI link.
‡ Black and white checkerboard pattern, each checker is one pixel wide.
NOTE 1: Assumes all inputs to the transmitter are not toggling.
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TFP410-EP
PanelBus™ DIGITAL TRANSMITTER
SGLS344A − JULY 2006 − REVISED MAY 2011
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) − (continued)
ac specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
f(IDCK)
IDCK frequency
25
165
MHz
t(pixel)
Pixel time period (see Note 1)
6.06
40
ns
t(IDCK)
IDCK duty cycle
30%
t(ijit)
IDCK clock jitter tolerance
70%
2
ns
0°C to 70°C
75
240
−55°C to 125°C
45
320
0°C to 70°C
75
240
−55°C to 125°C
45
320
tr
DVI output rise time (20-80%)
(20 80%) (see Note 2)
f(IDCK) = 165 MHz
tf
DVI output fall time (20-80%)
(20 80%) (see Note 2)
f(IDCK) = 165 MHz
tsk(D)
DVI output intra-pair + to − differential skew
(see Note 3)
f(IDCK) = 165 MHz
tsk(CC)
DVI output inter-pair or channel-to-channel
skew (see Note 3)
f(IDCK) = 165 MHz
tojit
DVI output clock jitter,
jitter max
max. (see Note 4)
f(IDCK) = 165 MHz
tsu(IDF)
Data, DE, VSYNC, HSYNC setup time to
IDCK+ falling edge
Single edge
(BSE = 1, DSEL = 0,
DKEN = 0, EDGE = 0)
IDCK = 165 MHz
1.5
ns
th(IDF)
Data, DE, VSYNC, HSYNC hold time to
IDCK+ falling edge
Single edge
(BSE = 1, DSEL = 0,
DKEN = 0, EDGE = 0)
IDCK = 165 MHz
1.5
ns
tsu(IDR)
Data, DE, VSYNC, HSYNC setup time to
IDCK+ rising edge
Single edge
(BSEL = 1, DSEL = 0,
DKEN = 0, EDGE = 1)
IDCK = 165 MHz
1.5
ns
th(IDR)
Data, DE, VSYNC, HSYNC hold time to
IDCK+ rising edge
Single edge
(BSEL = 1, DSEL = 0,
DKEN = 0, EDGE = 1)
IDCK = 165 MHz
1.5
ns
tsu(ID)
Data, DE, VSYNC, HSYNC setup time to
IDCK+ falling/rising edge
Dual edge
(BSEL = 0, DSEL = 1,
DKEN = 0)
IDCK = 165 MHz
0.9
ns
th(ID)
Data, DE, VSYNC, HSYNC hold time to
IDCK+ falling/rising edge
Dual edge (BSEL = 0,
DSEL = 1, DKEN = 0)
IDCK = 165 MHz
1
ns
t(STEP)
De-skew trim increment
DKEN = 1
IDCK = 165 MHz
NOTES: 1.
2.
3.
4.
8
50
0°C to 70°C
150
−55°C to 125°C
190
350
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• DALLAS, TEXAS 75265
ps
ps
1.2
t(pixel) is the pixel time defined as the period of the TXC output clock. The period of IDCK is equal to t(pixel).
Rise and fall times are measured as the time between 20% and 80% of signal amplitude.
Measured differentially at the 50% crossing point using the IDCK+ input clock as a trigger
Relative to input clock (IDCK)
ps
ns
ps
ps
TFP410-EP
PanelBus™ DIGITAL TRANSMITTER
SGLS344A − JULY 2006 − REVISED MAY 2011
timing diagrams
tr
tf
DVI
Outputs
80% VOD
20% VOD
Figure 1. Rise and Fall Time for DVI Outputs
th(IDF)
IDCK−
IDCK+
tsu(IDF)
th(IDR)
tsu(IDR)
VIH
VIL
DATA[23:0], DE,
HSYNC, VSYNC
Figure 2. Control and Single-Edge-Data Setup/Hold Time to IDCK±
IDCK+
tsu(ID)
th(ID)
th(ID)
tsu(ID)
DATA[23:0], DE,
HSYNC, VSYNC
VIH
VIL
Figure 3. Dual-Edge Data Setup/Hold Times to IDCK+
tsk(D)
TX+
50%
TX−
Figure 4. Analog Output Intra-Pair ± Differential Skew
TXN
50%
tsk(CC)
TXM
50%
Figure 5. Analog Output Channel-to-Channel Skew
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TFP410-EP
PanelBus™ DIGITAL TRANSMITTER
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functional description
The TFP410 is a DVI-compliant digital transmitter that is used in digital host monitor systems to transition
minimized differential signaling (TMDS) encode and serialize RGB pixel data streams. The TFP410 supports
resolutions from VGA to WUXGA (and 1080p) and can be controlled in two ways: 1) configuration and state pins
or 2) the programmable I2C serial interface (see the terminal functions section).
The host in a digital display system, usually a PC or consumer electronics device, contains a DVI-compatible
transmitter, such as the TFP410, that receives 24-bit pixel data along with appropriate control signals. The
TFP410 encodes the signals into a high-speed, low-voltage, differential serial bit stream optimized for
transmission over a twisted-pair cable to a display device. The display device, usually a flat-panel monitor,
requires a DVI-compatible receiver like the TFP401 to decode the serial bit stream back to the same 24-bit pixel
data and control signals that originated at the host. This decoded data can then be applied directly to the
flat-panel drive circuitry to produce an image on the display. Since the host and display can be separated by
distances up to 5 meters or more, serial transmission of the pixel data is preferred (see the TMDS pixel data
and control signal encoding, pixel data and control signal encoding, universal graphics contoller interface
voltage signal levels, and universal graphics controller interface clock inputs sections).
The TFP410 integrates a high-speed digital interface, a TMDS encoder, and three differential TMDS drivers.
Data is driven to the TFP410 encoder across 12 or 24 data lines, along with differential clock pair and sync
signals. The flexibility of the TFP410 allows for multiple clock and data formats that enhance system
performance.
The TFP410 also has enhanced PLL noise immunity, an enhancement accomplished with on-chip regulators
and bypass capacitors.
The TFP410 is versatile and highly programmable to provide maximum flexibility for the user. An I2C host
interface is provided to allow enhanced configurations in addition to power on default settings programmed by
pin-strapping resistors.
The TFP410 offers monitor detection through receiver detection, or hot-plug detection when I2C is enabled. The
monitor detection feature allows the user enhanced flexibility when attaching to digital displays or receivers (see
terminal functions, hot plug/unplug, and register descriptions sections).
The TFP410 has a data deskew feature allowing the users to deskew the input data with respect to the IDCK±
(see the data deskew feature section).
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transition minimized differential signaling (TMDS) pixel data and control signal encoding
For TMDS, only one of two possible TMDS characters for a given pixel is transmitted at a given time. The
transmitter keeps a running count of the number of ones and zeros previously sent and transmits the character
that minimizes the number of transitions and approximates a dc balance of the transmission line. Three TMDS
channels are used to transmit RGB pixel data during the active video interval (DE = High). These same three
channels are also used to transmit HSYNC, VSYNC, and the control signals, CTL[2:1], during the inactive
display or blanking interval (DE = Low). The following table maps the transmitted output data to the appropriate
TMDS output channel in a DVI-compliant system.
INPUT PINS
(VALID FOR DE = High)
TMDS OUTPUT CHANNEL
TRANSMITTED PIXEL DATA
ACTIVE DISPLAY (DE = High)
DATA[23:16]
Channel 2 (TX2 ±)
Red[7:0]
DATA[15:8]
Channel 1 (TX1 ±)
Green[7:0]
DATA[7:0]
Channel 0 (TX0 ±)
Blue[7:0]
TMDS OUTPUT CHANNEL
TRANSMITTED CONTROL DATA
BLANKING INTERVAL (DE = Low)
CTL3, CTL2 (see Note 1)
Channel 2 (TX2 ±)
CTL[3:2]
CTL1 (See Note 1)
Channel 1 (TX1 ±)
CTL[1]
HSYNC, VSYNC
Channel 0 (TX0 ±)
HSYNC, VSYNC
INPUT PINS
(VALID FOR DE = Low)
NOTE 1: The TFP410 encodes and transfers the CTL[3:1] inputs during the vertical blanking interval. CTL3 is reserved for HDCP and is
always encoded as 0. The CTL[2:1] inputs are reserved for future use. When DE = high, CTL and SYNC pins must be held
constant.
universal graphics controller interface voltage signal levels
The universal graphics controller interface can operate in the following two distinct voltage modes:
D High-swing mode where standard 3.3-V CMOS signaling levels are used
D Low-swing mode where adjustable 1.1-V to 1.8-V signaling levels are used
To select the high-swing mode, the VREF input pin must be tied to the 3.3-V power supply.
To select the low-swing mode, the VREF must be 0.55 to 0.95 V.
In the low-swing mode, VREF is used to set the midpoint of the adjustable signaling levels. The allowable range
of values for VREF is from 0.55 V to 0.9 V. The typical approach is to provide this from off chip by using a simple
voltage-divider circuit. The minimum allowable input signal swing in the low-swing mode is VREF ± 0.2 V. In
low-swing mode, the VREF input is common to all differential input receivers.
universal graphics controller interface clock inputs
The universal graphics controller interface of the TFP410 supports both fully differential and single-ended clock
input modes. In the differential clock input mode, the universal graphics controller interface uses the crossover
point between the IDCK+ and IDCK− signals as the timing reference for latching incoming data (DATA[23:0],
DE, HSYNC, and VSYNC). Differential clock inputs provide greater common-mode noise rejection. The
differential clock input mode is only available in the low-swing mode. In the single-ended clock input mode, the
IDCK+ input (pin 57) should be connected to the single-ended clock source and the IDCK− input (pin 56) should
be tied to GND.
The universal graphics controller interface of the TFP410 provides selectable 12-bit dual-edge and 24-bit
single-edge input clocking modes. In the 12-bit dual-edge mode, the 12-bit data is latched on each edge of the
input clock. In the 24-bit single-edge mode, the 24-bit data is latched on the rising edge of the input clock when
EDGE = 1 and the falling edge of the input clock when EDGE = 0.
DKEN and DK[3:1] allow the user to compensate the skew between IDCK± and the pixel data and control
signals. See the description of the CTL_3_MODE register for details.
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universal graphics controller interface modes
Table 1 is a tabular representation of the different modes for the universal graphics controller interface. The
12-bit mode is selected when BSEL = 0 and the 24-bit mode when BSEL = 1. The 12-bit mode uses dual-edge
clocking and the 24-bit mode uses single-edge clocking. The EDGE input is used to control the latching edge
in 24-bit mode, or the primary latching edge in 12-bit mode. When EDGE = 1, the data input is latched on the
rising edge of the input clock and when EDGE = 0, the data input is latched on the falling edge of the input clock.
A fully differential input clock is available only in the low-swing mode. Single-ended clocking is not
recommended in the low-swing mode as this decreases common-mode noise rejection.
Note that BSEL, DSEL, and EDGE are determined by register CTL_1_MODE when I2C is enabled (ISEL = 1)
and by input pins when I2C is disabled (ISEL = 0).
Table 1. Universal Graphics Controller Interface Options (Tabular Representation)
VREF
BSEL
EDGE
DSEL
BUS WIDTH
LATCH MODE
CLOCK EDGE
0.55 V to 0.9 V
0
0
0
12 bit
Dual edge
Falling
Differential (see Note 1 and Note 2)
0.55 V to 0.9 V
0
0
1
12 bit
Dual edge
Falling
Single ended
0.55 V to 0.9 V
0
1
0
12 bit
Dual edge
Rising
Differential (see Note 1 and Note 2)
0.55 V to 0.9 V
0
1
1
12 bit
Dual edge
Rising
Single ended
0.55 V to 0.9 V
1
0
0
24 bit
Single edge
Falling
Single ended
0.55 V to 0.9 V
1
0
1
24 bit
Single edge
Falling
Differential (see Note 1 and Note 3)
0.55 V to 0.9 V
1
1
0
24 bit
Single edge
Rising
Single ended
0.55 V to 0.9 V
1
1
1
24 bit
Single edge
Rising
Differential (see Note 1 and Note 3)
DVDD
0
0
X
12 bit
Dual edge
Falling
Single ended (see Note 4)
DVDD
0
1
X
12 bit
Dual edge
Rising
Single ended (see Note 4)
DVDD
1
0
X
24 bit
Single edge
Falling
Single ended (see Note 4)
1
1
X
24 bit
Single edge
Rising
Single ended (see Note 4)
DVDD
NOTES: 1.
2.
3.
4.
12
CLOCK MODE
The differential clock input mode is only available in the low signal swing mode (i.e., VREF ≤ 0.9 V).
The TFP410 does not support a 12-bit dual-clock, single-edge input clocking mode.
The TFP410 does not support a 24-bit single-clock, dual-edge input clocking mode.
In the high-swing mode (VREF = DVDD), DSEL is a don’t care; therefore, the device is always in the single-ended latch mode.
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PanelBus™ DIGITAL TRANSMITTER
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12-Bit, Dual-Edge Input Mode (BSEL = 0)
DE
D[11:0]
P0L
P0H
P1L
P1H
PN−1L
PNH
PNL
PN+1L
L = Low Half Pixel
H = High Half Pixel
IDCK+
DSEL=1
EDGE=0
IDCK+
DSEL=1
EDGE=1
{(IDCK+) − (IDCK−)}
DSEL=0
EDGE=0
{(IDCK+) − (IDCK−)}
DSEL=0
EDGE=1
Single-Ended
Clock Input
Mode
Differential
Clock Input
Mode (Low
Swing Only)
First Latch Edge
Figure 6. Universal Graphics Controller Interface Options for 12-Bit Mode (Graphical Representation)
24-Bit, Single-Edge Input Mode (BSEL = 1)
DE
P0
D[23:0]
P1
PN-1
PN
IDCK+
DSEL=0
EDGE=0
IDCK+
DSEL=0
EDGE=1
{(IDCK+) − (IDCK−)}
DSEL=1
EDGE=0
{(IDCK+) − (IDCK−)}
DSEL=1
EDGE=1
Single-Ended
Clock Input
Mode
Differential
Clock Input
Mode (Low
Swing Only)
First Latch Edge
Figure 7. Universal Graphics Controller Interface Options for 24-Bit Mode (Graphical Representation)
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PanelBus™ DIGITAL TRANSMITTER
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12-bit mode data mapping
PIN
NAME
P0
P1
P2
P0L
P0H
P1L
P1H
P2L
P2H
LOW
HIGH
LOW
HIGH
LOW
HIGH
D11
G0[3]
R0[7]
G1[3]
R1[7]
G2[3]
R2[7]
D10
G0[2]
R0[6]
G1[2]
R1[6]
G2[2]
R2[6]
D9
G0[1]
R0[5]
G1[1]
R1[5]
G2[1]
R2[5]
D8
G0[0]
R0[4]
G1[0]
R1[4]
G2[0]
R2[4]
D7
B0[7]
R0[3]
B1[7]
R1[3]
B2[7]
R2[3]
D6
B0[6]
R0[2]
B1[6]
R1[2]
B2[6]
R2[2]
D5
B0[5]
R0[1]
B1[5]
R1[1]
B2[5]
R2[1]
D4
B0[4]
R0[0]
B1[4]
R1[0]
B2[4]
R2[0]
D3
B0[3]
G0[7]
B1[3]
G1[7]
B2[3]
G2[7]
D2
B0[2]
G0[6]
B1[2]
G1[6]
B2[2]
G2[6]
D1
B0[1]
G0[5]
B1[1]
G1[5]
B2[1]
G2[5]
D0
B0[0]
G0[4]
B1[0]
G1[4]
B2[0]
G2[4]
24-bit mode data mapping
14
PIN NAME
P0
P1
P2
PIN NAME
P0
P1
P2
D23
R0[7]
R1[7]
D22
R0[6]
R1[6]
R2[7]
D11
G0[3]
G1[3]
G2[3]
R2[6]
D10
G0[2]
G1[2]
G2[2]
D21
R0[5]
D20
R0[4]
R1[5]
R2[5]
D9
G0[1]
G1[1]
G2[1]
R1[4]
R2[4]
D8
G0[0]
G1[0]
D19
G2[0]
R0[3]
R1[3]
R2[3]
D7
B0[7]
B1[7]
B2[7]
D18
R0[2]
R1[2]
R2[2]
D6
B0[6]
B1[6]
B2[6]
D17
R0[1]
R1[1]
R2[1]
D5
B0[5]
B1[5]
B2[5]
D16
R0[0]
R1[0]
R2[0]
D4
B0[4]
B1[4]
B2[4]
D15
G0[7]
G1[7]
G2[7]
D3
B0[3]
B1[3]
B2[3]
D14
G0[6]
G1[6]
G2[6]
D2
B0[2]
B1[2]
B2[2]
D13
G0[5]
G1[5]
G2[5]
D1
B0[1]
B1[1]
B2[1]
D12
G0[4]
G1[4]
G2[4]
D0
B0[0]
B1[0]
B2[0]
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data deskew feature
The deskew feature allows adjustment of the input setup/hold time. Specifically, the input data DATA[23:0] can
be latched slightly before or after the latching edge of the clock IDCK± depending on the amount of deskew
desired. When deskew enable (DKEN) is enabled, the amount of deskew is programmable by setting the three
bits DK[3:1]. When disabled, a default deskew setting is used. To allow maximum flexibility and ease of use,
DKEN and DK[3:1] are accessed directly through configuration pins when I2C is disabled, or through registers
of the same name when I2C is enabled. When using I2C mode, DKEN should be tied to ground to avoid a floating
input.
The input setup/hold time can be varied with respect to the input clock by an amount t(CD) given by the formula:
t(CD) = (DK[3:1] – 4) × t(STEP)
Where:
t(STEP) = Adjustment increment amount
DK[3:1] = Number from 0 to 7 represented as a 3-bit binary number
t(CD) = Cumulative deskew amount
(DK[3:1] – 4) is simply a multiplier in the range {–4, –3, –2, –1, 0, 1, 2, 3} for t(STEP). Therefore, data can be
latched in increments from four times the value of t(STEP) before the latching edge of the clock to three times
the value of t(STEP) after the latching edge. Note that the input clock is not changed, only the time when data
is latched with respect to the clock.
DATA[23:0]
IDCK±
−t(CD)
DK[3:1]
t(CD)
000
−4 × t(STEP)
t(CD)
100
0
Default Falling
−t(CD)
111
000
3 × t(STEP) −4 × t(STEP)
t(CD)
100
0
Default Rising
111
3 × t(STEP)
Figure 8. A Graphical Representation of the De-Skew Function
hot plug/unplug (auto connect/disconnect detection)
The TFP410 supports hot plug/unplug (auto connect/disconnect detection) for the DVI link. The receiver sense
(RSEN) input bit indicates if a DVI receiver is connected to TXC+ and TXC–. The HTPLG bit reflects the current
state of the HTPLG pin connected to the monitor via the DVI connector. When I2C is disabled (ISEL = 0), the
RSEN value is available on the MSEN pin. When I2C is enabled, the connection status of the DVI link and
HTPLG sense pins are provided by the CTL_2_MODE register. The MSEL bits of the CTL_2_MODE register
can be used to program the MSEN to output the HTPLG value, the RSEN value, an interrupt, or be disabled.
The source of the interrupt event is selected by TSEL in the CTL_2_MODE register. An interrupt is generated
by a change in status of the selected signal. The interrupt status is indicated in the MDI bit of CTL_2_MODE
and can be output via the MSEN pin. The interrupt continues to be asserted until a 1 is written to the MDI bit,
resetting the bit back to 0. Writing 0 to the MDI bit has no effect.
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TFP410-EP
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device configuration and I2C reset description
The TFP410 device configuration can be programmed by several different methods to allow maximum flexibility
for the user’s application. Device configuration is controlled depending on the state of the ISEL/RST pin,
configuration pins (BSEL, DSEL, EDGE, VREF), and state pins (PD, DKEN). I2C bus select and I2C reset (active
low) are shared functions on the ISEL/RST pin, which operates asynchronously.
Holding ISEL/RST low causes the device configuration to be set by the configuration pins (BSEL, DSEL, EDGE,
and VREF) and state pins (PD, DKEN). The I2C bus is disabled.
Holding ISEL/RST high causes the chip configuration to be set based on the configuration bits (BSEL, DSEL,
EDGE) and state bits (PD, DKEN) in the I2C registers. The I2C bus is enabled.
Momentarily bringing ISEL/RST low and then back high while the device is operating in normal or power-down
mode resets the I2C registers to their default values. The device configuration is changed to the default
power-up state with I2C enabled. After power up, the device must be reset. It is suggested that this pin be tied
to the system reset signal, which is low during power up and is then asserted high after all the power supplies
are fully functional.
DE generator
The TFP410 contains a DE generator that can be used to generate an internal DE signal when the original data
source does not provide one. There are several I2C programmable values that control the DE generator (see
Figure 9). DE_GEN in the DE_CTL register enables this function. When enabled, the DE pin is ignored.
DE_TOP and DE_LIN are line counts used to control the number of lines after VSYNC goes active that DE is
enabled and the total number of lines that DE remains active, respectively. The polarity of VSYNC must be set
by VS_POL in the DE_CTL register.
DE_DLY and DE_CNT are pixel counts used to control the number of pixels after HSYNC goes active that DE
is enabled and the total number of pixels that DE remains active, respectively. The polarity of HSYNC must be
set by HS_POL in the DE_CTL register.
The TFP410 also counts the total number of HSYNC pulses between VSYNC pulses and the total number of
pixels between HSYNC pulses. These values, the total vertical and horizontal resolutions, are available in
V_RES and H_RES, respectively. These values are available at all times, whether or not the DE generator is
enabled.
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TFP410-EP
PanelBus™ DIGITAL TRANSMITTER
SGLS344A − JULY 2006 − REVISED MAY 2011
Full Vertical Frame
DE_TOP
DE_DLY
DE_CNT
V_RES
DE_LIN
Actual Display Area
H_RES
Figure 9. DE Generator Register Functions
register map
The TFP410 is a standard I2C slave device. All the registers can be written and read through the I2C interface
(unless otherwise specified). The TFP410 slave machine supports only byte read and write cycles. Page mode
is not supported. The 8-bit binary address of the I2C machine is 0111 A3A2A1X, where A[3:1] are pin
programmable or set to 000 by default. The I2C base address of the TFP410 is dependent on A[3:1] (pins 6,
7, and 8 respectively) as shown:
A[3:1]
WRITE ADDRESS
(Hex)
READ ADDRESS
(Hex)
000
70
71
001
72
73
010
74
75
011
76
77
100
78
79
101
7A
7B
110
7C
7D
111
7E
7F
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TFP410-EP
PanelBus™ DIGITAL TRANSMITTER
SGLS344A − JULY 2006 − REVISED MAY 2011
register map (continued)
REGISTER
VEN ID
VEN_ID
DEV ID
DEV_ID
RW
SUBADDRESS
R
00
VEN_ID[7:0]
R
01
VEN_ID[15:8]
R
02
DEV_ID[7:0]
BIT7
BIT6
BIT5
BIT4
BIT3
R
03
DEV_ID[15:8]
REV_ID
R
04
REV_ID[7:0]
RESERVED
R
05-07
Reserved
CTL_1_MODE
RW
08
RSVD
CTL_2_MODE
RW
09
VLOW
CTL_3_MODE
RW
0A
CFG
TDIS
VEN
HEN
MSEL
DK
BSEL
EDGE
PD
RSEN
HTPLG
MDI
DKEN
R
0B
CFG
0C-31
Reserved
DE_DLY
RW
32
DE_CTL
RW
33
RSVD
DE_TOP
RW
34
RSVD
RESERVED
RW
35
Reserved
RW
36
DE_CNT[7:0]
RW
37
RW
38
RW
39
R
3A
R
3B
R
3C
H RES
H_RES
V RES
V_RES
RESERVED
BIT0
TSEL
RW
DE LIN
DE_LIN
BIT1
DSEL
RESERVED
DE CNT
DE_CNT
BIT2
CTL
RSVD
RSVD
DE_DLY[8]
DE_DLY[7:0]
DE_GEN
VS_POL
HS_POL
DE_DLY[6:0]
Reserved
DE_CNT[10:8]
DE_LIN[7:0]
Reserved
DE_LIN[10:8]
H_RES[7:0]
Reserved
H_RES[10:8]
V_RES[7:0]
R
3D
R
3E−FF
Reserved
V_RES[10:8]
register descriptions
VEN_ID
7
Sub-Address = 01−00
6
5
Read Only
4
3
Default = 0x014C
2
1
0
VEN_ID[7:0]
VEN_ID[15:8]
These read-only registers contain the 16-bit TI vendor ID. VEN_ID is hardwired to 0x014C.
DEV_ID
7
Sub-Address = 03−02
6
5
Read Only
4
3
Default = 0x0410
2
1
0
DEV_ID[7:0]
DEV_ID[15:8]
These read-only registers contain the 16-bit device ID for the TFP410. DEV_ID is hardwired to 0x0410.
REV_ID
7
Sub-Address = 04
6
5
Read Only
4
3
REV_ID[7:0]
This read-only register contains the revision ID.
18
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Default = 0x00
2
1
0
TFP410-EP
PanelBus™ DIGITAL TRANSMITTER
SGLS344A − JULY 2006 − REVISED MAY 2011
register descriptions (continued)
RESERVED
Sub-Address = 07−05
6
7
5
Read Only
4
Default = 0x641400
3
2
1
0
RESERVED[7:0]
RESERVED[7:0]
RESERVED[15:8]
CTL_1_MODE
Sub-Address = 08
Read/Write
Default = 0xBE
7
6
5
4
3
2
1
0
RSVD
TDIS
VEN
HEN
DSEL
BSEL
EDGE
PD
PD: This read/write register contains the power-down mode.
0: Power down (default after RESET)
1: Normal operation
EDGE: This read/write register contains the edge select mode.
0: Input data latches to the falling edge of IDCK+
1: Input data latches to the rising edge of IDCK+
BSEL: This read/write register contains the input bus select mode.
0: 12-bit operation with dual-edge clock
1: 24-bit operation with single-edge clock
DSEL:This read/write register is used in combination with BSEL and VREF to select the single-ended or differential
input clock mode. In the high-swing mode, DSEL is a don’t care since IDCK is always single-ended.
HEN: This read/write register contains the horizontal sync enable mode.
0: HSYNC input is transmitted as a fixed low.
1: HSYNC input is transmitted in its original state.
VEN: This read/write register contains the vertical sync enable mode.
0: VSYNC input is transmitted as a fixed low.
1: VSYNC input is transmitted in its original state.
TDIS: This read/write register contains the TMDS disable mode.
0: TMDS circuitry enable state is determined by PD.
1: TMDS circuitry is disabled.
CTL_2_MODE
7
Sub-Address = 09
6
VLOW
5
Read/Write
4
MSEL[3:1]
Default = 0x00
3
2
1
0
TSEL
RSEN
HTPLG
MDI
MDI: This read/write register contains the monitor detect interrupt mode.
0: Detected logic level change in detection signal (to clear, write one to this bit)
1: Logic level remains the same.
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register descriptions (continued)
HTPLG: This read only register contains the hot-plug detection input logic state.
0: Logic level detected on EDGE/HTPLG (pin 9)
1: High level detected on EDGE/HTPLG (pin 9)
RSEN: This read-only register contains the receiver sense input logic state, which is valid only for dc-coupled
systems.
0: A powered-on receiver is not detected.
1: A powered-on receiver is detected (i.e., connected to the DVI transmitter outputs).
TSEL: This read/write register contains the interrupt generation source select.
0: Interrupt bit (MDI) is generated by monitoring RSEN.
1: Interrupt bit (MDI) is generated by monitoring HTPLG.
MSEL: This read/write register contains the source select of the monitor sense output pin.
000: Disabled. MSEN output high.
001: Outputs the MDI bit (interrupt)
010: Outputs the RSEN bit (receiver detect)
011: Outputs the HTPLG bit (hot-plug detect)
VLOW: This read-only register indicates the VREF input level.
0: This bit is a logic level 0 if the VREF analog input selects high-swing inputs.
1: This bit is a logic level 1 if the VREF analog input selects low-swing inputs.
CTL_3_MODE
7
Sub-Address = 0A
6
DK[3:1]
5
Read/Write
4
3
DKEN
RSVD
Default = 0x80
2
1
CTL[2:1]
0
RSVD
CTL[2:1]:This read/write register contains the values of the two CTL[2:1] bits that are output on the DVI port during
the blanking interval.
DKEN: This read/write register controls the data deskew enable.
0: Data deskew is disabled, the values in DK[3:1] are not used.
1: Data deskew is enabled, the deskew setting is controlled through DK[3:1].
DK[3:1]: This read/write register contains the deskew setting, each increment adjusts the skew by t(STEP).
000: Step 1 (minimum setup/maximum hold)
001: Step 2
010: Step 3
011: Step 4
100: Step 5 (default)
101: Step 6
110: Step 7
111: Step 8 (maximum setup/minimum hold)
20
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register descriptions (continued)
CFG
Sub-Address = 0B
6
7
Read Only
5
4
3
2
1
0
CFG[7:0] (D[23:16])
This read-only register contains the state of the inputs D[23:16]. These pins can be used to provide the user with
selectable configuration data through the I2C bus.
RESERVED
7
Sub-Address = 0E−0C
6
5
Read/Write
4
3
Default = 0x97D0A9
2
1
2
1
0
RESERVED
RESERVED
RESERVED
These read/write registers have no effect on TFP410 operation.
DE_DLY
Sub-Address = 32
7
6
5
Read/Write
4
3
Default = 0x00
0
DE_DLY[7:0]
This read/write register defines the number of pixels after HSYNC goes active when the DE is generated and when
the DE generator is enabled. The value must be less than or equal to (2047 − DE_CNT).
DE_CTL
Sub-Address = 33
Read/Write
7
6
5
4
3
Reserved
DE_GEN
VS_POL
HS_POL
Default = 0x00
2
1
Reserved
0
DE_DLY[8]
DE_DLY[8]: This read/write register contains the top bit of DE_DLY.
HS_POL: This read/write register sets the HSYNC polarity.
0: HSYNC is considered active low.
1: HSYNC is considered active high.
Pixel counts are reset on the HSYNC active edge.
VS_POL: This read/write register sets the VSYNC polarity.
0: VSYNC is considered active low.
1: VSYNC is considered active high.
Line counts are reset on the VSYNC active edge.
DE_GEN: This read/write register enables the internal DE generator.
0: DE generator is disabled. Signal required on DE pin.
1: DE generator is enabled. DE pin is ignored.
DE_TOP
7
Sub-Address = 34
6
5
Read/Write
4
3
Default = 0x00
2
1
0
DE_TOP[7:0]
This read/write register defines the number of pixels after VSYNC goes active when the DE is generated and when
the DE generator is enabled.
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register descriptions (continued)
DE_CNT
7
Sub-Address = 37−36
6
5
Read/Write
4
3
Default = 0x0000
2
1
0
DE_CNT[7:0]
Reserved
DE_CNT[10:8]
These read/write registers define the width of the active display, in pixels, when the DE generator is enabled. The
value must be less than or equal to (2047 − DE_DLY).
DE_LIN
7
Sub-Address = 39−38
6
5
Read/Write
4
3
Default = 0x0000
2
1
0
DE_LIN[7:0]
Reserved
DE_LIN[10:8]
These read/write registers define the height of the active display, in lines, when the DE generator is enabled.
H_RES
7
Sub-Address = 3B−3A
6
5
Read Only
4
3
2
1
0
H_RES[7:0]
Reserved
H_RES[10:8]
These read-only registers return the number of pixels between consecutive HSYNC pulses.
V_RES
7
Sub-Address = 3D−3C
6
5
Read Only
4
3
2
1
0
V_RES[7:0]
Reserved
V_RES[10:8]
These read-only registers return the number of lines between consecutive VSYNC pulses.
I2C interface
The I2C interface is used to access the internal TFP410 registers. This 2-pin interface consists of the SCL clock
line and the SDA serial data line. The basic I2C access cycles are shown in Figure 10 and Figure 11.
SDA
SCL
Start Condition (S)
Stop Condition (P)
Figure 10. I2C Start and Stop Conditions
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I2C interface (continued)
The basic access write cycle consists of:
D
D
D
D
D
Start condition
Slave address cycle
Sub-address cycle
Any number of data cycles
Stop condition
The basic access read cycle consists of:
D
D
D
D
D
D
D
Start condition
Slave write address cycle
Sub-address cycle
Restart condition
Slave read address cycle
Any number of data cycles
Stop condition
The start and stop conditions are shown in Figure 10. The high-to-low transition of SDA while SCL is high defines
the start condition. The low-to-high transition of SDA while SCL is high defines the stop condition. Each cycle,
data or address, consists of eight bits of serial data followed by one acknowledge bit generated by the receiving
device. Thus, each data/address cycle contains nine bits (see Figure 11).
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SCL
SDA
Slave Address
Sub-Address
Data
Stop
Figure 11. I2C Access Cycles
Following a start condition, each I2C device decodes the slave address. The TFP410 responds with an
acknowledge by pulling the SDA line low during the ninth clock cycle if it decodes the address as its address.
During subsequent sub-address and data cycles, the TFP410 responds with acknowledge (see Figure 12). The
sub-address is auto-incremented after each data cycle.
The transmitting device must not drive the SDA signal during the acknowledge cycle so that the receiving device
may drive the SDA signal low. The master indicates a not acknowledge condition (/A) by keeping the SDA signal
high just before it asserts the stop condition (P). This sequence terminates a read cycle (see Figure 13).
The slave address consists of seven bits of address along with one bit of read/write information (read = 1,
write = 0) (see Figure 11 and Figure 12). For the TFP410, the selectable slave addresses (including the R/W
bit) using A[3:1] are 0x70, 0x72, 0x74, 0x76, 0x78, 0x7A, 0x7C, and 0x7E for write cycles, and 0x71, 0x73, 0x75,
0x77, 0x79, 0x7B, 0x7D, and 0x7F for read cycles.
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S
Slave Address
W
A
Sub-Address
A
Data
A
Data
A
P
Where:
From Master
From Slave
A Acknowledge
S Start condition
P Stop Condition
Figure 12. I2C Write Cycle
S
Slave Address
W
A
Sub-Address
A
Sr
Slave Address
R
A
Data
A
Data
/A
P
Where:
/A
R
W
From Master
From Slave
A Acknowledge
S Start condition
Not acknowledge (SDA high)
Read Condition = 1
Write Condition = 0
P Stop Condition
Sr Restart Condition
Figure 13. I2C Read Cycle
PowerPADt 64-pin TQFP package
The TFP410 is available in TI’s thermally-enhanced 64-pin TQFP PowerPAD package. The PowerPAD package
is a 10-mm × 10-mm × 1-mm TQFP outline with 0,5-mm lead pitch. The PowerPAD package has a specially
designed die-mount pad that offers improved thermal capability over typical TQFP packages of the same
outline. The PowerPAD package also offers a backside solder plane that connects directly to the die-mount pad
for enhanced thermal conduction. For thermal considerations, soldering the back side of the TFP410 to the
application board is not required, as the device power dissipation is well within the package capability when not
soldered. If traces or vias are located under the back-side pad, they should be protected by suitable solder mask
or other assembly technique to prevent inadvertent shorting to the exposed back-side pad.
Soldering the back side of the device to a thermal land connected to the PCB ground plane is recommended
for electrical and EMI considerations. The thermal land may be soldered to the exposed PowerPAD package
using standard reflow soldering techniques.
The recommended pad size for the grounded thermal land is 5,9 mm minimum, centered in the device land
pattern. When vias are required to ground the land, multiple vias are recommended for a low-impedance
connection to the ground plane. Vias in the exposed pad should be small enough or filled to prevent wicking
the solder away from the interface between the package body and the thermal land on the surface of the board
during solder reflow.
24
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PanelBus™ DIGITAL TRANSMITTER
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PowerPADt 64-pin TQFP package (continued)
Thermal vias or other
connection-to-ground vias
5.9 mm
minimum
Figure 14. Recommended Pad Size
More information on this package and other requirements for using thermal lands and thermal vias are detailed
in the TI application report PowerPADt Thermally-Enhanced Package, TI literature number SLMA002,
available at www.ti.com.
Table 2 shows the thermal properties of the 64-pin TQFP PowerPAD package. The 64-pin TQFP
non-PowerPAD package is included only for reference.
Table 2. 64-Pin TQFP (10 mm × 10 mm × 1 mm)/0,5-mm Lead Pitch
PARAMETER
WITHOUT
PowerPAD
PowerPAD
NOT CONNECTED TO
PCB THERMAL PLANE
PowerPAD
CONNECTED TO PCB
THERMAL PLANE
(see Note 1)
75.83°C/W
42.2°C/W
21.47°C/W
RθJA
Thermal resistance, junction to ambient
(see Note 1 and Note 2)
RθJC
Thermal resistance, junction to case
(see Note 1 and Note 2)
7.8°/W
0.38°C/W
0.38°C/W
PD
Power-handling capabilities of package
(see Note 1, Note 2, and Note 3)
0.92 W
1.66 W
3.26 W
NOTES: 1. Specified with the PowerPAD bond pad on the back side of the package soldered to a 2-oz Cu plate PCB thermal plane
2. Airflow is at 0 LFM (no airflow).
3. Specified at 150°C junction temperature and 80°C ambient temperature
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PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
B0 W
Reel
Diameter
Cavity
A0
B0
K0
W
P1
A0
Dimension designed to accommodate the component width
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
TFP410MPAPREP
Package Package Pins
Type Drawing
HTQFP
PAP
64
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
24.4
Pack Materials-Page 1
13.0
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
13.0
1.5
16.0
24.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TFP410MPAPREP
HTQFP
PAP
64
1000
350.0
350.0
43.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
PAP 64
HTQFP - 1.2 mm max height
QUAD FLATPACK
10 x 10, 0.5 mm pitch
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226442/A
www.ti.com
www.ti.com
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