SLOS362A − JUNE 2001 − REVISED JANUARY 2005
FEATURES
D Rail-To-Rail Output
D VICR Includes Ground
D Gain-Bandwidth Product . . . 9 MHz
D Supply Current . . . 730 µA/Channel
D Single, Duals, and Quad Versions
D Ultralow Power Down Mode
D
D
D
D
DESCRIPTION
The TLV263x single supply operational amplifiers
provide rail-to-rail output with an input range that
includes ground. The TLV263x takes the minimum
operating supply voltage down to 2.7 V over the
extended industrial temperature range (−40°C to
125°C) while adding the rail-to-rail output swing feature.
The TLV263x also provides a 9 MHz gain-bandwidth
product from only 730 µA of supply current. The
maximum recommended supply voltage is 5.5 V, which,
when coupled with a 2.7-V minimum, allows the devices
to be operated from lithium ion cells.
IDD(SHDN) = 4 µA/Channel
Specified Temperature Range
−40°C to 125°C . . . Industrial Grade
Supply Voltage Range . . . 2.7 V to 5.5 V
Ultrasmall Packaging
5 or 6 Pin SOT-23 (TLV2630/1)
8 or 10 Pin MSOP (TLV2632/3)
Universal Op-Amp EVM (See SLOU060
for More Information)
The combination of wide bandwidth, low noise, and low
distortion makes it ideal for high speed and high
resolution data converter applications. The ground
input range allows it to directly interface to ground rail
referred systems.
All members are available in PDIP and SOIC with the
singles in the small SOT-23 package, duals in the
MSOP, and quads in the TSSOP package.
Operational Amplifier
+
The 2.7-V operation makes it compatible with Li-Ion
powered systems and the operating supply voltage
range of many micro-power microcontrollers available
today including TI’s MSP430.
−
AMPLIFIER SELECTION TABLE
VDD
[V]
IDD/ch
[µA]
VICR
[V]
GBW
[MHz]
SLEW RATE
[V/µs]
Vn, 1 kHz
[nV/√Hz]
IO
[mA]
2.5−5.5
850
−0.3 to VDD + 0.3
5.5
6
25
40
OPAx743
3.5−12
1100
−0.1 to VDD + 0.1
7
10
30
20
TLV278x
1.8−3.6
650
−0.2 to VDD + 0.2
8
5
9
10
TLV263x
2.7−5.5
730
GND to VDD − 1
9
9.5
50
28
TLV262x
2.7−5.5
750
1 V to VDD + 0.2
11
10
27
28
OPAx353
2.7−5.5
8000
−0.1 to VDD + 0.1
44
22
7
40
DEVICE
OPAx343
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
!"#$%&' #! ( )*$$+!' &( #" ,*-. )&' #! /&'+0
$#/*)'( )#!"#$% '# (,+) " )&' #!( ,+$ '1+ '+$%( #" +2&( !('$*%+!'(
('&!/&$/ 3&$$&!'40 $#/*)' #! ,$#)+(( !5 /#+( !#' !+)+((&$ .4 !).*/+
'+(' !5 #" &.. ,&$&%+'+$(0
Copyright 2001−2005, Texas Instruments Incorporated
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1
SLOS362A − JUNE 2001 − REVISED JANUARY 2005
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
PACKAGE
CODE
SYMBOL
SOIC−8
D
—
SOT−23−6
DBV
VAYI
DIP−8
P
SOIC−8
PACKAGE
SPECIFIED
TEMPERATURE RANGE
ORDER NUMBER
TRANSPORT MEDIA
TLV2630ID
TLV2630IDR
Tube
Tape and Reel
TLV2630IDBVR†
TLV2630IDBVT‡
Tape and Reel
—
TLV2630IP
Tube
D
—
TLV2631ID
TLV2631IDR
Tube
Tape and Reel
SOT−23−5
DBV
VAZI
TLV2631IDBVR†
TLV2631IDBVT‡
Tape and Reel
DIP−8
P
—
TLV2631IP
Tube
TLV2632ID
TLV2632IDR
Tube
Tape and Reel
TLV2632IDGK
TLV2632IDGKR
Tube
Tape and Reel
Single with Shutdown
TLV2630ID
TLV2630IDBV
TLV2630IP
−40°C to 125°C
Single without Shutdown
TLV2631ID
TLV2631IDBV
TLV2631IP
−40°C to 125°C
Dual without Shutdown
TLV2632ID
SOIC−8
D
—
TLV2632IDGK
MSOP−8
DGK
AKG
DIP−8
P
—
TLV2632IP
Tube
TLV2633ID
TLV2633IDR
Tube
Tape and Reel
TLV2633IDGS
TLV2633IDGSR
Tube
Tape and Reel
TLV2632IP
−40°C to 125°C
Dual with Shutdown
TLV2633ID
SOIC−14
D
—
TLV2633IDGS
MSOP−10
DGS
AKK
DIP−14
N
—
TLV2633IN
Tube
TLV2634ID
TLV2634IDR
Tube
Tape and Reel
TLV2633IN
−40°C to 125°C
Quad without Shutdown
TLV2634ID
SOIC−14
D
—
TLV2634IN
DIP−14
N
—
TLV2634IPW
TSSOP−14
−40°C
125°C
−40 C to 125
C
TLV2634IN
Tube
Tube
Tape and Reel
PW
—
TLV2634IPW
TLV2634IPWR
TLV2635ID
TLV2635IDR
Tube
Tape and Reel
TLV2635IN
Tube
TLV2635IPW
TLV2635IPWR
Tube
Tape and Reel
Quad with Shutdown
TLV2635ID
SOIC−16
D
—
TLV2635IN
DIP−16
N
—
TLV2635IPW
TSSOP−16
PW
−40°C
−40
C to 125
125°C
C
—
† The SOT23 package devices are only available taped and reeled. The R Suffix denotes quantities (3,000 pieces per reel).
‡ The T Suffix denotes smaller quantities (250 pieces per mini-reel).
1. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
2
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SLOS362A − JUNE 2001 − REVISED JANUARY 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±VDD
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND to VDD − 1 V
Input current, II (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 10 mA
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 40 mA
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, TA: I-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C
Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 2: All voltage values, except differential voltages, are with respect to GND.
recommended operating conditions
MIN
MAX
2.7
5.5
±1.35
±2.75
GND
VDD−1
125
Single supply
Supply voltage, VDD
Split supply
Common-mode input voltage range, VICR
Operating free-air temperature, TA
I-suffix
Shutdown on/off voltage level‡
VIL
VIH
−40
0.4
2
UNIT
V
V
°C
V
‡ Relative to GND.
electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V (unless otherwise noted)
dc performance
PARAMETER
TEST CONDITIONS
TA
25°C
MIN
TYP
MAX
250
3500
Full range
VIO
αVIO
Input offset voltage
VIC = VDD/2,
VO = VDD/2
25°C
TLV2634/5
Temperature coefficient of input offset
voltage
VIC = GND to VDD−1 V
VDD = 5 V
AVD
Large-signal differential voltage
amplification
250
Full range
RL = 2 kΩ, VO(PP) = VDD−1 V
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4200
5200
25°C
VDD = 2.7 V
CMRR Common-mode rejection ratio
4500
3
25°C
76
Full range
67
25°C
77
Full range
74
25°C
90
Full range
82
UNIT
µV
V
V
µV
µV/°C
100
100
dB
100
dB
3
SLOS362A − JUNE 2001 − REVISED JANUARY 2005
electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V (unless otherwise noted)
(continued)
input characteristics
PARAMETER
TEST CONDITIONS
TA†
MIN
25°C
IIO
Input offset current
IIB
Input bias current
ri(d)
Differential input resistance
TYP
MAX
1
50
Full range
VIC = VDD/2,
VO = VDD/2
100
25°C
1
Full range
Ci(c)
Common-mode input capacitance
† Full range is −40°C to 125°C for the I-suffix.
f = 1 kHz
UNIT
50
pA
200
25°C
1000
GΩ
25°C
12
pF
output characteristics
PARAMETER
TEST CONDITIONS
MIN
TYP
2.67
25°C
2.6
VDD = 2.7 V
Full range
2.55
25°C
4.92
VDD = 5 V
Full range
4.9
25°C
2.25
Full range
2.15
VIC = VDD/2, IOH = − 1 mA
VOH
TA†
High-level output voltage
VDD = 2.7 V
VIC = VDD/2, IOH = − 10 mA
25°C
4.7
VDD = 5 V
Full range
4.65
VDD = 2.7 V
Full range
VDD = 5 V
Full range
25°C
VIC = VDD/2, IOL = 1 mA
VOL
VIC = VDD/2, IOL = 10 mA
IO
IOS
Output current
VDD = 2.7 V,
VO = 0.5 V from rail
Sourcing
VDD = 5 V,
VO = 0.5 V from rail
Sourcing
4.8
0.025
0.08
0.26
0.45
Full range
mV
0.47
0.2
Full range
0.3
0.35
14
Sinking
19
25°C
mA
28
Sinking
28
50
Sourcing
VDD = 2.7 V
VDD = 5 V
Sinking
VDD = 2.7 V
VDD = 5 V
Short-circuit output current
0.1
0.1
25°C
VDD = 5 V
V
2.43
0.15
25°C
VDD = 2.7 V
UNIT
4.98
0.03
25°C
Low-level output voltage
MAX
95
25°C
mA
50
95
† Full range is −40°C to 125°C for the I-suffix.
power supply
PARAMETER
TEST CONDITIONS
IDD
Supply current (per channel)
VO = VDD/2,
SHDN = VDD
PSRR
Supply voltage rejection ratio
(∆VDD /∆VIO)
VDD = 2.7 V to 5.5 V,
VIC = VDD /2
No load
† Full range is −40°C to 125°C for the I-suffix.
4
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TA†
25°C
MIN
TYP
MAX
730
1000
Full range
1350
25°C
70
Full range
65
UNIT
A
µA
90
dB
SLOS362A − JUNE 2001 − REVISED JANUARY 2005
electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V (unless otherwise noted)
(continued)
dynamic performance
PARAMETER
GBWP
SR+
SR−
φm
Gain-bandwidth product
Positive slew rate at unity gain
Negative slew rate at unity gain
TA†
TEST CONDITIONS
RL = 2 kΩ,
CL = 10 pF,
RL = 2 kΩ
kΩ, CL = 50 pF
RL = 2 kΩ
kΩ, CL = 50 pF
MIN
9
VDD = 2.7 V,
VO(PP) = 1.7 V
6
VDD = 5 V,
VO(PP) = 3.5 V
6
VDD = 2.7 V,
VO(PP) = 1.7 V
RL = 2 kΩ,
MAX
UNIT
MHz
V/ s
V/µs
25°C
VDD = 5 V,
VO(PP) = 3.5 V
Phase margin
Gain margin
TYP
f = 10 kHz
CL = 10 pF
10
V/µs
9.5
V/µs
50
°
20
dB
† Full range is −40°C to 125°C for the I-suffix.
noise/distortion performance
PARAMETER
THD + N
Total harmonic distortion plus noise
TEST CONDITIONS
VO(PP) = VDD/2,
RL = 2 kΩ, f = 10 kHz
Equivalent input noise voltage
In
Equivalent input noise current
MIN
TYP
0.003%
AV = 100
0.095%
f = 1 kHz
Vn
TA
AV = 1
AV = 10
MAX
UNIT
0.02%
25°C
50
f = 10 kHz
30
f = 1 kHz
0.9
nV/√Hz
fA /√Hz
shutdown characteristics
PARAMETER
IDD(SHDN)
Supply current, per channel in shutdown
mode (TLV2630, TLV2633, TLV2635)
t(on)
Amplifier turnon time‡
TEST CONDITIONS
SHDN = 0.4 V
kΩ
RL = 2 kΩ,
CL = 10 pF
TA†
25°C
MIN
TYP
MAX
4
17
Full range
VDD = 2.7 V
VDD = 5 V
19
4.5
25°C
25
C
1.5
UNIT
µA
A
µss
t(off)
Amplifier turnoff time‡
200
ns
† Full range is −40°C to 125°C for the I-suffix.
‡ Disable time and enable time are defined as the interval between application of the logic signal to SHDN and the point at which the supply current
has reached half its final value.
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5
SLOS362A − JUNE 2001 − REVISED JANUARY 2005
DISSIPATION RATING TABLE
PACKAGE
ΘJC
(°C/W)
ΘJA
(°C/W)
TA ≤ 25°C
25 C
POWER RATING
D (8)
38.3
176
710 mW
142 mW
D (14)
26.9
122.3
1022 mW
204.4 mW
D (16)
25.7
114.7
1090 mW
218 mW
DBV (5)
55
324.1
385 mW
77.1 mW
125°C
TA = 125
C
POWER RATING
DBV (6)
55
294.3
425 mW
85 mW
DGK (8)
54.2
259.9
481 mW
96.1 mW
DGS (10)
54.1
259.7
485 mW
97 mW
N (14, 16)
32
78
1600 mW
320.5 mW
P (8)
41
104
1200 mW
240.4 mW
PW (14)
29.3
173.6
720 mW
144 mW
PW (16)
28.7
161.4
774 mW
154.9 mW
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
VIO
CMRR
Input offset voltage
vs Common-mode input voltage
Common-mode rejection ratio
vs Frequency
VOH
VOL
High-level output voltage
vs High-level output current
4, 6
Low-level output voltage
vs Low-level output current
5, 7
IDD
IDD
Supply current
vs Supply voltage
8
Supply current
vs Free-air temperature
9
PSRR
Power supply rejection ratio
vs Frequency
10
AVD
Differential voltage amplification & phase
vs Frequency
11
vs Supply voltage
12
vs Free-air temperature
13
vs Supply voltage
14
Gain-bandwidth product
1, 2
3
SR
Slew rate
φm
Vn
Phase margin
vs Load capacitance
17
Equivalent input noise voltage
vs Frequency
18
Crosstalk
vs Frequency
19
vs Free-air temperature
Voltage-follower large-signal pulse response
15, 16
20
Voltage-follower small-signal pulse response
21
IDD(SHDN)
IDD(SHDN)
Shutdown supply current
vs Free-air temperature
22
Shutdown supply current
vs Supply voltage
23
IDD(SHDN)
Shutdown supply current/output voltage
vs Time
24
6
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SLOS362A − JUNE 2001 − REVISED JANUARY 2005
INPUT OFFSET VOLTAGE
vs
COMMON-MODE INPUT VOLTAGE
INPUT OFFSET VOLTAGE
vs
COMMON-MODE INPUT VOLTAGE
1200
VDD = 2.7 V
TA = 25° C
1000
VIO − Input Offset Voltage − µ V
800
600
400
200
0
−200
−0.3 0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
VDD = 5 V
TA = 25° C
1000
800
600
400
200
0
−200
−0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
VICR − Common-Mode Input Voltage − V
Figure 1
1.8
TA = 125°C
TA = 70°C
0.9
TA = 25°C
TA = 0°C
TA = −40°C
0.3
0.0
5
10
15
20
25
2.1
TA = 125°C
1.8
TA = 70°C
1.5
0.9
0.6
0.3
30
35
40
45
1100
TA = 125°C
TA = 70°C
TA = 25°C
TA = 0°C
TA = −40°C
2.0
1.5
1.0
0.5
I DD − Supply Current − µ A/ch
1000
4.0
5
10
15
20
25
30
35
40
45
20
10
0
10
900
10 20 30 40 50 60 70 80 90 100
IOL − Low-Level Output Current − mA
1k
10k
100k
f − Frequency − Hz
1M
VDD = 5 V
4.5
4.0
3.5
TA = 125°C
3.0
TA = 70°C
2.5
2.0
TA = 25°C
TA = 0°C
TA = −40°C
1.5
1.0
0.5
TA = 25°C
700
600
500
TA = −40°C
TA = 0°C
300
200
10 20 30 40 50 60 70 80 90 100
1100
AV= 1
VIC = VDD/2
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
VDD − Supply Voltage − V
Figure 8
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SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
1000
TA = 70°C
800
400
100
Figure 6
0
0.0
Figure 7
30
IOH − High-Level Output Current − mA
TA = 125°C
100
0
40
0
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
VDD = 5 V
2.5
50
Figure 5
5.0
3.0
60
IOL − Low-Level Output Current − mA
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
3.5
70
0.0
0
Figure 4
VOL − Low-Level Output Voltage − V
TA = 25°C
TA = 0°C
TA = −40°C
1.2
IOH − High-Level Output Current − mA
4.5
80
5.0
VDD = 2.7 V
2.4
0.0
0
90
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
V OH − High-Level Output Voltage − V
VOL − Low-Level Output Voltage − V
V OH − High-Level Output Voltage − V
2.1
0.6
100
Figure 3
2.7
VDD = 2.7 V
1.2
VDD = 2.7 V and 5 V
TA = 25° C
110
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
2.7
1.5
120
Figure 2
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
2.4
COMMON-MODE REJECTION RATIO
vs
FREQUENCY
VICR − Common-Mode Input Voltage − V
I DD − Supply Current − µ A/ch
VIO − Input Offset Voltage − µ V
1200
CMRR − Common-Mode Rejection Ratio − dB
TYPICAL CHARACTERISTICS
900
800
VDD = 5 V
700
VDD = 2.7 V
600
500
400
300
200
AV= 1
VIC = VDD/2
100
0
−40 −25 −10 5
20 35 50 65 80 95 110 125
TA − Free-Air Temperature − °C
Figure 9
7
SLOS362A − JUNE 2001 − REVISED JANUARY 2005
TYPICAL CHARACTERISTICS
POWER SUPPLY REJECTION RATIO
vs
FREQUENCY
DIFFERENTIAL VOLTAGE AMPLIFICATION AND PHASE
vs
FREQUENCY
VDD = 2.7 V and 5 V
TA = 25° C
80
PSSR−
70
60
50
40
30
20
10
0
10
100
1k
10k
100k
f − Frequency − Hz
1M
10M
100
VDD = 2.7 V
RL= 2 kΩ
CL = 10 pF
TA = 25° C
90
80
70
60
120
Phase
50
90
40
60
30
30
20
−30
0
−60
−10
1k
10 k
100 k
Figure 11
10
6
5
4
3
RL = 2 kΩ
CL = 10 pF
f = 10 kHz
2.5
3
3.5
4
4.5
5
5.5
7
6
5
4
3
2
1
SLEW RATE
vs
FREE-AIR TEMPERATURE
Figure 15
7
SR+
6
5
4
AV = 1
RL = 2 kΩ
CL = 50 pF
V(step) = 1 Vpp
TA = 25° C
3
2
1
0
2.5
20 35 50 65 80 95 110 125
55
12
50
11
SR − Slew Rate − V/µs
8
SR+
6
5
3
2
1
4.5
5
5.5
6
45
SR−
9
4
4
PHASE MARGIN
vs
LOAD CAPACITANCE
13
7
3.5
Figure 14
SLEW RATE
vs
FREE-AIR TEMPERATURE
10
3
VDD − Supply Voltage − V
Figure 13
Figure 12
TA − Free-Air Temperature − °C
8
TA − Free-Air Temperature − °C
VDD − Supply Voltage − V
14
13
12
11
SR−
10
9
8
7
SR+
6
5
VDD = 2.7 V
4
AV = 1
3
RL = 2 kΩ
2
CL = 50 pF
1
V(step) = 1 Vpp
0
−40 −25 −10 5 20 35 50 65 80 95 110 125
VDD = 2.7 and 5 V
RL = 2 kΩ
CL = 10 pF
f = 10 kHz
0
−40 −25 −10 5
6
SR−
9
8
SR − Slew Rate − V/µs
7
2
SR − Slew Rate − V/µs
11
10
VDD = 5 V
AV = 1
V(step) = 1 Vpp
RL = 2 kΩ
CL = 50 pF
0
−40 −25 −10 5 20 35 50 65 80 95 110 125
TA − Free-Air Temperature − °C
Figure 16
www.ti.com
φ m − Phase Margin − °
8
0
8
SLEW RATE
vs
SUPPLY VOLTAGE
GAIN-BANDWIDTH PRODUCT
vs
FREE-AIR TEMPERATURE
9
Gain-Bandwidth Product − MHz
Gain-Bandwidth Product − MHz
9
1
−90
10 M
1M
f − Frequency − Hz
GAIN-BANDWIDTH PRODUCT
vs
SUPPLY VOLTAGE
2
0
Gain
10
Figure 10
10
Phase − °
PSSR+
90
A VD − Differential Voltage Amplification − dB
PSRR − Power Supply Rejection Ratio − dB
100
Rnull = 100 Ω
40
35
30
Rnull = 20 Ω
25
Rnull = 0 Ω
20
15
VDD = 2.7 V and 5 V
RL = 2 kΩ
AV = 1
TA = 25°C
10
5
0
10
100
CL − Load Capacitance − pF
Figure 17
1k
SLOS362A − JUNE 2001 − REVISED JANUARY 2005
TYPICAL CHARACTERISTICS
CROSSTALK
vs
FREQUENCY
0
VDD = 2.7 V and 5 V
TA = 25° C
450
VDD = 2.7 V and 5 V
RL = 2 kΩ
CL = 10 pF
AV = 1
VO(PP) = VDD/2
TA = 25°C
All Channels
−20
400
−40
350
Crosstalk − dB
V n − Equivalent Input Noise Voltage − nV/
500
300
250
200
150
−60
−80
Shutdown Crosstalk
−100
100
−120
50
Crosstalk
0
10
100
1k
10k
f − Frequency − Hz
−140
10
100k
100
1k
10k
f − Frequency − Hz
Figure 18
Figure 19
VOLTAGE-FOLLOWER LARGE-SIGNAL
PULSE RESPONSE
6
0
5
−1
4
−2
VDD = 5 V
VIC = VDD/2
RL = 2 kΩ
CL = 10 pF
AV = 1
TA = 25°C
VO
2
1
2.60
2.75
V O − Output Voltage − V
VIC
2.80
V IC − Common-Mode Input Voltage − V
1
7
V O − Output Voltage − V
VOLTAGE-FOLLOWER SMALL-SIGNAL
PULSE RESPONSE
2
8
3
2.55
2.70
VDD = 5 V
VIC = 100 mV
RL = 2 kΩ
CL = 10 pF
AV = 1
TA = 25°C
VIC
2.65
2.60
2.45
2.40
2.55
2.50
VO
2.40
0
1
2
3
4
5
6
0
0.2
t − Time − µs
0.4
0.6
0.8
1
1.2
Figure 20
Figure 21
SHUTDOWN SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
SHUTDOWN SUPPLY CURRENT
vs
SUPPLY VOLTAGE
8
Shutdown = 0 V
AV = 1
VIC = VDD/2
7
6
VDD = 5 V
5
4
3
VDD = 3.6 V
VDD = 2.7 V
1
0
−40 −25 −10 5
20 35 50 65 80 95 110 125
1.4
t − Time − µs
I DD(SD) − Shutdown Supply Current − µ A/ch
I DD(SD) − Shutdown Supply Current − µ A/ch
2.50
2.45
0
2
100k
V IC − Common-Mode Input Voltage − V
Hz
EQUIVALENT INPUT NOISE VOLTAGE
vs
FREQUENCY
11
10
9
Shutdown = 0 V
AV = 1
VIC = VDD/2
8
TA = 25°C
7
6
5
TA = 0°C
TA = −40°C
4
3
TA = 70°C
2
1
TA = 125°C
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
VDD − Supply Voltage − V
TA − Free-Air Temperature − °C
Figure 22
Figure 23
www.ti.com
9
SLOS362A − JUNE 2001 − REVISED JANUARY 2005
TYPICAL CHARACTERISTICS
SD − Shutdown Pulse − V
2.5
2.0
1.5
1.0
0.5
0.0
I DD(SD) − Shutdown Supply Current − µ A
5.0
4.0
3.0
2.0
1.0
0.0
V O − Output Voltage − mV
SHUTDOWN SUPPLY CURRENT / OUTPUT VOLTAGE
vs
TIME
SD
VDD = 5 V
AV = 1
RL = 2 kΩ
CL = 10 pF
VIC = VDD/2
TA = 25° C
VO
0.0
0.5
1.0
IDD(SD)
1.5
2.0
0
1
2
3
4
t − Time − µs
Figure 24
10
5
www.ti.com
6
7
8
9
SLOS362A − JUNE 2001 − REVISED JANUARY 2005
TLV263x PACKAGE PINOUTS
TLV2630
D OR P PACKAGE
(TOP VIEW)
TLV2630
DBV PACKAGE
(TOP VIEW)
1
OUT
6
VDD
GND
2
5
SHDN
IN+
3
4
IN −
TLV2631
D OR P PACKAGE
(TOP VIEW)
NC
IN −
IN +
GND
1OUT
1IN −
1IN+
GND
NC
1SHDN
NC
1
8
2
7
3
6
4
5
NC
IN −
IN +
GND
1
8
2
7
3
6
4
5
TLV2631
DBV PACKAGE
(TOP VIEW)
SHDN
VDD
OUT
NC
OUT
1
GND
2
IN+
3
1OUT
1IN −
1IN +
GND
1
8
2
7
3
6
4
5
VDD
2OUT
2IN −
2IN+
VDD
4
IN −
TLV2633
DGS PACKAGE
(TOP VIEW)
TLV2632
D, DGK, OR P PACKAGE
(TOP VIEW)
NC
VDD
OUT
NC
5
1OUT
1IN −
1IN+
GND
1SHDN
1
2
3
4
5
10
9
8
7
6
VDD
2OUT
2IN −
2IN+
2SHDN
TLV2633
D OR N PACKAGE
TLV2634
D, N, OR PW PACKAGE
TLV2635
D, N, OR PW PACKAGE
(TOP VIEW)
(TOP VIEW)
(TOP VIEW)
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VDD
2OUT
2IN −
2IN+
NC
2SHDN
NC
1OUT
1IN −
1IN+
VDD
2IN+
2IN −
2OUT
1
14
2
13
3
12
4
11
5
10
6
9
7
8
4OUT
4IN −
4IN+
GND
3IN+
3IN −
3OUT
1OUT
1IN −
1IN+
VDD
2IN+
2IN −
2OUT
1/2SHDN
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
4OUT
4IN −
4IN+
GND
3IN +
3IN−
3OUT
3/4SHDN
NC − No internal connection
www.ti.com
11
PACKAGE OPTION ADDENDUM
www.ti.com
19-Nov-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Samples
(3)
(Requires Login)
TLV2630IDBVR
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2630IDBVRG4
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2631IDBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2631IDBVRG4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2631IDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2631IDBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2632ID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2632IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2632IDGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2632IDGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2632IDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2632IDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2633IDGSR
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2633IDGSRG4
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2634ID
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2634IDG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2634IPWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
19-Nov-2012
Orderable Device
Status
(1)
TLV2634IPWRG4
ACTIVE
Package Type Package Pins Package Qty
Drawing
TSSOP
PW
14
2000
Eco Plan
Lead/Ball Finish
(2)
Green (RoHS
& no Sb/Br)
CU NIPDAU
MSL Peak Temp
Samples
(3)
(Requires Login)
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Nov-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
TLV2630IDBVR
SOT-23
DBV
6
3000
180.0
9.0
TLV2631IDBVR
SOT-23
DBV
5
3000
180.0
TLV2631IDBVT
SOT-23
DBV
5
250
180.0
TLV2632IDGKR
VSSOP
DGK
8
2500
TLV2632IDR
SOIC
D
8
TLV2633IDGSR
VSSOP
DGS
TLV2634IPWR
TSSOP
PW
3.15
3.2
1.4
4.0
8.0
Q3
9.0
3.15
3.2
1.4
4.0
8.0
Q3
9.0
3.15
3.2
1.4
4.0
8.0
Q3
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
10
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Nov-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLV2630IDBVR
SOT-23
DBV
6
3000
182.0
182.0
20.0
TLV2631IDBVR
SOT-23
DBV
5
3000
182.0
182.0
20.0
TLV2631IDBVT
SOT-23
DBV
5
250
182.0
182.0
20.0
TLV2632IDGKR
VSSOP
DGK
8
2500
358.0
335.0
35.0
TLV2632IDR
SOIC
D
8
2500
340.5
338.1
20.6
TLV2633IDGSR
VSSOP
DGS
10
2500
358.0
335.0
35.0
TLV2634IPWR
TSSOP
PW
14
2000
367.0
367.0
35.0
Pack Materials-Page 2
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