MC145010EGR2

Freescale Semiconductor Technical Data MC145010 Rev 7.0, 05/2006 Photoelectric Smoke Detector IC with I/O MC145010 The CMOS MC145010 is an advanced smoke detector component containing sophisticated very-low-power analog and digital circuitry. The IC is used with an infrared photoelectric chamber. Detection is accomplished by sensing scattered light from minute smoke particles or other aerosols. When detection occurs, a pulsating alarm is sounded via on-chip push-pull drivers and an external piezoelectric transducer. The variable-gain photo amplifier allows direct interface to IR detectors (photodiodes). Two external capacitors, C1 and C2, C1 being the larger, determine the gain settings. Low gain is selected by the IC during most of the standby state. Medium gain is selected during a local-smoke condition. High gain is used during push button test. During standby, the special monitor circuit which periodically checks for degraded chamber sensitivity uses high gain, also. The I/O pin, in combination with VSS, can be used to interconnect up to 40 units for common signaling. An on-chip current sink provides noise immunity when the I/ O is an input. A local-smoke condition activates the short-circuit-protected I/O driver, thereby signaling remote smoke to the interconnected units. Additionally, the I/O pin can be used to activate escape lights, enable auxiliary or remote alarms, and/or initiate auto-dialers. While in standby, the low-supply detection circuitry conducts periodic checks using a pulsed load current from the LED pin. The trip point is set using two external resistors. The supply for the MC145010 can be a 9 V battery. A visible LED flash accompanying a pulsating audible alarm indicates a localsmoke condition. A pulsating audible alarm with no LED flash indicates a remotesmoke condition. A beep or chirp occurring virtually simultaneously with an LED flash indicates a low-supply condition. A beep occurring half-way between LED flashes indicates degraded chamber sensitivity. A low-supply condition does not affect the smoke detection capability if VDD ≥ 6 V. Therefore, the low-supply condition and degraded chamber sensitivity can be further distinguished by performing a push button (chamber) test. Features • • • • • • • • Circuit is designed to operate in smoke detector systems that comply with UL217 and UL268 Specifications Operating Voltage Range: 6 to 12 V Operating Temperature Range: - 10 to 60°C Average Supply Current: 12 µA Power-On Reset Places IC in Standby Mode (Non-Alarm State) Electrostatic Discharge (ESD) and Latch Up Protection Circuitry on All Pins Chip Complexity: 2000 FETs, 12 NPNs, 16 Resistors, and 10 Capacitors Ideal for battery powered applications. ORDERING INFORMATION Device Temp. Range MC145010P MC145010ED MC145010DW MCZ145010EG/EGR2 Case No. Package 648-08 16 Lead Plastic Dip 751G-04 16 Lead SOICW -55 to +125°C © Freescale Semiconductor, Inc., 2006. All rights reserved. PHOTOELECTRIC SMOKE DETECTOR IC WITH I/O P SUFFIX ED SUFFIX (PB-FREE) PLASTIC DIP CASE 648-08 DW SUFFIX EG SUFFIX (PB-FREE) SOICW CASE 751G-04 C1 1 16 Test C2 2 15 Detect 3 14 Low-Supply Trip VSS Strobe 4 13 R1 VDD 5 12 OSC IRED 6 11 LED I/O 7 10 Feedback Brass 8 9 Silver Figure 1. Pin Connections C1 C2 1 2 AMP OSC 12 R1 Test Gain Zero VDD - 3.5 V REF OSC Gate On/off Strobe 4 Low-supply Trip 15 Smoke Gate On/off Timing Logic 13 16 Comp + 7 Alarm Logic Low Supply 3 Detect Horn Modulator And Driver VDD - 5.0 VREF I/O 8 9 Brass Silver 10 6 Feedback IRED 11 Comp + LED PIN 5 = VDD PIN 14 = VSS Figure 2. Block Diagram Table 1. Maximum Ratings(1) (Voltages referenced to VSS) Rating Symbol Value Unit DC Supply Voltage VDD -0.5 to +15 V DC Input Voltage C1, C2, Detect OSC, Low-Supply Trip I/O Feedback Test VIN DC Input Current per Pin IIN V -0.25 to VDD +0.25 -0.25 to VDD +0.25 -0.25 to VDD +10 -15 to +25 -1.0 to VDD +0.25 ±10 mA DC Output Current per Pin IOUT ±25 mA DC Supply Current, VDD and VSS Pins IDD +25 / -150 mA Power Dissipation in Still Air 5 Seconds Continuous PD Storage Temperature Range TSTG -55 to +125 °C TL 5.0 °C Lead Temperature, 1 mm From Case for 10 Seconds 1200(2) 350(3) mW 1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits in the Electrical Characteristics tables. 2. Derating: -12 mW/°C from 25° to 60°C. 3. Derating -3.5 mW/°C from 25° to 60°C. This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation, it is recommended VIN and VOUT be constrained to the range VSS ≤ (VIN or VOUT) ≤ VDD. MC145010 2 Sensors Freescale Semiconductor Table 2. Electrical Characteristics (TA = -10 to 60°C unless otherwise indicated. Voltages referenced to VSS.) Symbol VDD/VDC Min Typ Max Unit Operating Voltage VDD — 6.0 — 12.0 V Supply Threshold voltage, Low-Supply Alarm Low-Supply Trip: VIN = VDD/3 VTH — 6.5 — 7.8 Average Operating Supply Current (per Package) Standby Configured per Figure 8 IDD 12.0 — — 12.0 Peak Supply Current (per Package) During Strobe ON, IRED OFF Configured per Figure 8 During Strobe ON, IRED ON Configured per Figure 8 iDD 12.0 12.0 — — — — 2.0 3.0 Low-Level Input Voltage I/O Feedback Test VIL 9.0 9.0 9.0 — — — — — — 1.5 2.7 7.0 High-Level Input Voltage I/O Feedback Test VIH 9.0 9.0 9.0 3.2 6.3 8.5 — — — — — — Input Current OSC, Detect – VIN = VSS or VDD Low-Supply Trip – VIN = VSS or VDD Feedback – VIN = VSS or VDD IIN 12.0 12.0 12.0 — — — — — — ±100 ±100 ±100 Low -Level Input Current Test – VIN = VSS or VDD IIL 12.0 — — -1.0 Pull-Down Current Test – VIN = VDD I/O – No Local Smoke, VIN = VDD I/O – No Local Smoke, VIN = 17 V IIH 9.0 9.0 12.0 0.5 25.0 — — — — 10 100 140 6.5 6.5 — — — — 0.6 1.0 6.5 5.5 — — — 9.0 — 9.0 VDD – 0.1 VDD – 4.40 — 2.25(1) — VDD – 5.30 0.1 3.751 6.5 12.0 -4 — — -16 12.0 — — ±1.0 — VDD – 4 — VDD – 2 — VDD – 3.08 — VDD – 3.92 Characteristics Low-Level Output Voltage LED – IOUT = 10 mA Silver, Brass – IOUT = 16 mA VOL High-Level Output Voltage Silver, Brass – IOUT = 16 mA VOH Output Voltage (For Line Regulations, See Pin Descriptions) Strobe – Inactive, IOUT = -1 µA Active, IOUT = 100 µA to 500 µA (Load Regulation) IRED – Inactive, IOUT = 1 µA Active, IOUT = 6 µA (Load Regulation) VOUT High-Level Output Current I/O – Local Smoke, VOUT = 4.5 V I/O – Local Smoke, VOUT = VSS (Short Circuit Current) IOH Off-State Output Leakage Current LED – VOUT = VSS or VDD IOZ Common Mode C1, C2, Detect, Voltage Range – Local Smoke, Push Button Test, or Chamber Sensitivity Test VIC Smoke Comparator Internal Reference Voltage – Local Smoke, Push Button Test, or Chamber Sensitivity Test VREF V µA mA V V nA µA µA V V V mA ΧA V V 1. TA = 25°C only. MC145010 Sensors Freescale Semiconductor 3 Table 3. AC Electrical Characteristics Reference Timing Diagram Figure 6 and Figure 7. (TA = 25°C, VDD = 9.0 V, Component values from Figure 8: R1 = 100.0 KΩ, C3 = 1500.0 pF, R2 = 10.0 MΩ.) No. 1 Characteristics Oscillator Period(1) Free-Running Sawtooth Measured at Pin 12 2 3 4 LED Pulse Period No Local Smoke, and No Remote Smoke Remote Smoke, but No Local Smoke Local Smoke or Push Button Test 5 LED Pulse Width and Strobe Pulse Width 6 7 8 IRED Pulse Period Smoke Test Chamber Sensitivity Test without Local Smoke Push Button Test 9 IRED Pulse Width 10 IRED Rise Time IRED Fall Time 11 Silver and Brass Modulation Period Local or Remote Smoke Symbol Clocks Min Max Unit 1/fOSC 1 9.5 11.5 ms 4096 — 64 38.9 — 0.60 47.1 — 0.74 1 9.5 11.5 1024 4096 32 9.67 38.9 0.302 11.83 47.1 0.370 tw(IRED) Tf1 94 116 µs tr tf — — — — 30 200 µs — 297 363 — 73 77 4096 38.9 47.1 1 9.5 11.5 — — 800 1024 4096 4096 — 9.67 38.9 38.9 0.302 11.83 47.1 47.1 0.370 tLED tw(LED), tw(STB) tIRED tMOD 11 12 Silver and Brass Duty Cycle Local or Remote Smoke 13 Silver and Brass Chirp Pulse Period Low Supply or Degraded Chamber Sensitivity tCH Silver and Brass Chirp Pulse Width Low Supply or Degraded Chamber Sensitivity tw(CH) 14 15 16 17 18 19 tON/tMOD Rising Edge on I/O to Smoke Alarm Response Time Remote Smoke, No Local Smoke tRR Strobe Out Pulse Period Smoke Test Chamber Sensitivity Test without Local Smoke Low Supply Test without Local Smoke Push Button Test tSTB s ms s ms % s ms ms s 1. Oscillator Period T (= Tr + Tf) is determined by the external components R1, R2, and C3 where Tr = (0.6931) R2 x C3 and Tf = (0.6031) R1 x C3. The other timing characteristics are some multiple of the oscillator timing shown in the table. MC145010 4 Sensors Freescale Semiconductor Table 4. Pin Description Pin Symbol Description 1 C1 A capacitor connected to this pin, shown in Figure 8, determines the gain of the on-chip photo amplifier during push button test and chamber sensitivity test (high gain). The capacitor value is chosen such that the alarm is tripped from background reflections in the chamber during push button test. Av ª 1 + (C1/10) where C1 is in pF. CAUTION: The value of the closed-loop gain should not exceed 10,000. 2 C2 A capacitor connected to this pin as shown in Figure 8 determines the gain of the on-chip photo amplifier except during push button or chamber sensitivity tests. Av ≈ 1 + (C2/10) where C2 is in pF. This gain increases about 10% during the IRED pulse, after two consecutive local smoke detections. Resistor R14 must be installed in series with C2. R14 ≈ [1/(12√C2)] - 680 where R14 is in ohms and C2 is in farads. 3 DETECT This input to the high-gain pulse amplifier is tied to the cathode of an external photodiodes. The photodiodes should have low capacitance and low dark leakage current. The diode must be shunted by a load resistor and is operated at zero bias. The Detect input must be ac/dc decoupled from all other signals, VDD, and VSS. Lead length and/or foil traces to this pin must be minimized, also. See Figure 9. 4 STROBE This output provides a strobed, regulated voltage referenced to VDD. The temperature coefficient of this voltage is ± 0.2%/ °C maximum from - 10° to 60°C. The supply-voltage coefficient (line regulation) is ± 0.2%/V maximum from 6 to 12 V. Strobe is tied to external resistor string R8, R9, and R10. 5 VDD This pin is connected to the positive supply potential and may range from +6 to +12 V with respect to VSS. CAUTION: In battery-powered applications, reverse-polarity protection must be provided externally. 6 IRED This output provides pulsed base current for external NPN transistor Q1 used as the infrared emitter driver. Q1 must have β ≥ 100. At 10 mA, the temperature coefficient of the output voltage is typically + 0.5%/°C from - 10° to 60°C. The supplyvoltage coefficient (line regulation) is ± 0.2%/V maximum from 6 to 12 V. The IRED pulse width (active-high) is determined by external components R1 and C3. With a 100 kΩ/1500 pF combination, the nominal width is 105 µs. To minimize noise impact, IRED is not active when the visible LED and horn outputs are active. IRED is active near the end of Strobe pulses for Smoke Tests, Chamber Sensitivity Test, and Push button Test. 7 I/O This pin can be used to connect up to 40 units together in a wired-OR configuration for common signaling. VSS is used as the return. An on-chip current sink minimizes noise pick up during non-smoke conditions and eliminates the need for an external pull-down resistor to complete the wired-OR. Remote units at lower supply voltages do not draw excessive current from a sending unit at a higher supply voltage. I/O can also be used to activate escape lights, auxiliary alarms, remote alarms, and/or auto-dialers. As an input, this pin feeds a positive-edge-triggered flip-flop whose output is sampled nominally every 625 ms during standby (using the recommended component values). A local-smoke condition or the push button-test mode forces this current-limited output to source current. All input signals are ignored when I/O is sourcing current. I/O is disabled by the on-chip power-on reset to eliminate nuisance signaling during battery changes or system power-up. If unused, I/O must be left unconnected. 8 BRASS This half of the push-pull driver output is connected to the metal support electrode of a piezoelectric audio transducer and to the horn-starting resistor. A continuous modulated tone from the transducer is a smoke alarm indicating either local or remote smoke. A short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity. 9 SILVER This half of the push-pull driver output is connected to the ceramic electrode of a piezoelectric transducer and to the hornstarting capacitor. 10 FEEDBA This input is connected to both the feedback electrode of a self-resonating piezoelectric transducer and the horn-starting CK resistor and capacitor through current-limiting resistor R4. If unused, this pin must be tied to VSS or VDD. 11 LED This active-low open-drain output directly drives an external visible LED at the pulse rates indicated below. The pulse width is equal to the OSC period. The load for the low-supply test is applied by this output. This low-supply test is non-coincident with the smoke tests, chamber sensitivity test, push button test, or any alarm signals. The LED also provides a visual indication of the detector status as follows, assuming the component values shown in Figure 8: Standby (includes low-supply and chamber sensitivity tests) - Pulses every 43 seconds (nominal) Local Smoke - Pulses every 0.67 seconds (nominal) Remote Smoke - No pulses Push button Test - Pulses every 0.67 seconds (nominal) 12 OSC This pin is used in conjunction with external resistor R2 (10 MΩ) to VDD and external capacitor C3 (1500 pF) to VDD to form an oscillator with a nominal period of 10.5 ms. 13 R1 14 VSS 15 This pin is used in conjunction with resistor R1 (100 kΩ) to pin 12 and C3 (1500 pF, see pin 12 description) to determine the IRED pulse width. With this RC combination, the nominal pulse width is 105 µs. This pin is the negative supply potential and the return for the I/O pin. Pin 14 is usually tied to ground. LOWThis pin is connected to an external voltage which determines the low-supply alarm threshold. The trip voltage is obtained SUPPLY through a resistor divider connected between the VDD and LED pins. The low-supply alarm threshold voltage (in volts) ≈ TRIP (5R7/R6) + 5 where R6 and R7 are in the same units. MC145010 Sensors Freescale Semiconductor 5 Table 4. Pin Description (Continued) Symbol Description 16 TEST This input has an on-chip pull-down device and is used to manually invoke a test mode. The Push Button Test mode is initiated by a high level at pin 16 (usually depression of a S.P.S.T. normally-open push button switch to VDD). After one oscillator cycle, IRED pulses approximately every 336 ms, regardless of the presence of smoke. Additionally, the amplifier gain is increased by automatic selection of C1. Therefore, the background reflections in the smoke chamber may be interpreted as smoke, generating a simulated-smoke condition. After the second IRED pulse, a successful test activates the horn-driver and I/O circuits. The active I/O allows remote signaling for system testing. When the Push Button Test switch is released, the Test input returns to VSS due to the on-chip pull-down device. After one oscillator cycle, the amplifier gain returns to normal, thereby removing the simulated-smoke condition. After two additional IRED pulses, less than a second, the IC exits the alarm mode and returns to standby timing. AC Parameter (Normalized To 9.0 V Value) Pin 1.04 1.02 Pulse width of IRED 1.00 Period or pulse width of other parameters 0.98 0.96 6.0 7.0 8.0 9.0 10.0 VDD, Power Supply Voltage (V) 11.0 12.0 Figure 3. AC Characteristics vs. Supply AC Parameter (Normalized To 25°C Value) 1.02 1.01 Pulse width of IRED 1.00 Period or pulse width of other parameters 0.99 VDD = 9.0 V 0.98 -10 0 10 20 30 40 50 60 TA, Ambient Temperature (°C) Figure 4. AC Characteristics vs. Temperature Component Value (Normalized To 25°C Value) 1.03 1.02 1.01 10 MΩ Carbon composition 1.00 100 kΩ Metal Film 1500 pF Dipped MICA 0.99 0.98 -10 0 10 20 30 40 TA, Ambient Temperature (°C) 50 60 Note: These components were used to generate Figure 3. Figure 5. RC Component Variation Overtemperature MC145010 6 Sensors Freescale Semiconductor Figure 6. Standby Timing Diagram MC145010 Sensors Freescale Semiconductor 7 16 6 Power-on Reset 2 17 No Low Supply Chamber Sensitivity OK 6 7 Notes: Numbers refer to the AC Electrical Characteristics Table. Illustration is not to scale. Silver, Brass Enable (Internal) LED (Pin 11) Strobe (Pin 4) (Pin 6) IRED Smoke Test (Internal) Chamber Test (Internal) Low Supply Test (Internal) OSC (Pin 12) 1 9 5 Chirps Indicate Low Supply 13 18 14 Chirps Indicate Degraded Chamber Sensitivity 13 Figure 7. Smoke Timing Diagram MC145010 8 Sensors Freescale Semiconductor 5 12 90% 10% 11 11 Local Smoke (Remote Smoke = Don't Care) 5 6 10 Notes: Numbers refer to the AC Electrical Characteristics Table. Illustration is not to scale. No Smoke Silver, Brass Enable (Internal) I/O (Pin 7) LED (Pin 11) Strobe (Pin 4) IRED (Pin 6) Chamber Test (Internal) Low Supply Test (Internal) IRED 9 (As Output) (Not Performed) (Not Performed) 4 No Smoke 15 Pushbutton Test (As Output) Remote Smoke 4 (No Local Smoke) (As Input) (No Pulses) 3 19 8 C1 0.047 µF + 1 TO 22 µF C4** 9.0 V B1 D1 Reverse Polarity Protection Circuit SW1 C2* 4700 pF 1 R6 100 k R14 560 Ω R8 8.2 k 2 R11 250 k R9† 5.0 k 3 R10 4.7 k D2 IR Detector 4 Low-supply 15 Trip C2 VSS Detect MC145010 Strobe R1 R7 47 k 14 13 R1 100 k R12 1.0 k C5 100 µF Test C1 Pushbutton Test 16 D3 IR EMITTER + 6 Q1 IR CURRENT To Other MC145010(s), Escape Light(S), Auxiliary Alarm(S), Remote Alarm(S), And/or Auto-dialer 5 R13* 4.7 TO 22 7 8 VDD OSC IRED LED I/O Brass Feedback Silver 12 R2 10 M C3 1500 pF D4 Visible LED R3 11 470 10 R4! 9 100 k 0.01 µF C6 ! Horn X1 2.2 M R5 ! !Values for R4, R5, and C6 may differ depending on type of piezoelectric horn used. * C2 and R13 are used for coarse sensitivity adjustment. Typical values are shown. † R9 is for fine sensitivity adjustment (optional). If fixed resistors are used, R8 = 12 k, R10 is 5.6 k to 10 k, and R9 is eliminated. When R9 is used, noise pickup is increased due to antenna effects. Shielding may be required. **C4 should be 22 µF if B1 is a carbon battery. C4 could be reduced to 1 µF when an alkaline battery is used. Figure 8. Typical Battery-Powered Application CALIBRATION To facilitate checking the sensitivity and calibrating smoke detectors, the MC145010 can be placed in a calibration mode. In this mode, certain device pins are controlled/ reconfigured as shown in Table 5. To place the part in the calibration mode, pin 16 (Test) must be pulled below the VSS pin with 100 µA continuously drawn out of the pin for at least one cycle on the OSC pin. To exit this mode, the Test pin is floated for at least one OSC cycle. In the calibration mode, the IRED pulse happens at every clock cycle and strobe is always on (active low). Also, Low Battery and supervisory tests are disabled in this mode. MC145010 Sensors Freescale Semiconductor 9 Table 5. Configuration of Pins in the Calibration Mode Description Pin Comment I/O 7 Disabled as an output. Forcing this pin high places the photo amp output on pin 1 or 2, as determined by Low-Supply Trip. The amp's output appears as pulses and is referenced to VDD. Low-Supply Trip 15 If the I/O pin is high, pin 15 controls which gain capacitor is used. Low: normal gain, amp output on pin 1. High: supervisory gain, amp output on pin 2. Feedback 10 Driving this input high enables hysteresis (10% gain increase) in the photo amp; pin 15 must be low. OSC 12 Driving this input high brings the internal clock high. Driving the input low brings the internal clock low. If desired, the RC network for the oscillator may be left intact; this allows the oscillator to run similar to the normal mode of operation. Silver 9 This pin becomes the smoke comparator output. When the OSC pin is toggling, positive pulses indicate that smoke has been detected. A static low level indicates no smoke. Brass 8 This pin becomes the smoke integrator output. That is, two consecutive smoke detections are required for ON (static high level) and two consecutive no-detections for “off” (static low level). Do Not Run Any Additional Traces In This Region C2 R14 C2 Pin 16 C1 Pin 1 R8 R11 MOUNTED IN CHAMBER Pin 9 R10 D2 Pin 8 NOTES: Illustration is bottom view of layout using a Dip. Top view for SOIC layout is mirror image. Optional potentionmeter R9 is not illustrated. Drawing is not to scale. Leads on D2, R11, R8, and R10 and their associated traces must be kept as short as possible. This practice minimizes noise pick-up. Pin 3 must be decoupled from all other traces. Figure 9. Recommended PCB Layout MC145010 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. -A16 9 1 8 B F C L S SEATING PLANE -TK H G D M J 16 PL 0.25 (0.010) M T A STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. M CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. INCHES MILLIMETERS MIN MAX MIN MAX 0.740 0.770 18.80 19.55 0.250 0.270 6.35 6.85 0.145 0.175 3.69 4.44 0.015 0.021 0.39 0.53 0.040 0.70 1.02 1.77 0.100 BSC 2.54 BSC 0.050 BSC 1.27 BSC 0.008 0.015 0.21 0.38 0.110 0.130 2.80 3.30 0.295 0.305 7.50 7.74 0 10 0 10 0.020 0.040 0.51 1.01 DIM A B C D F G H J K L M S COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN GATE SOURCE GATE SOURCE GATE SOURCE GATE SOURCE CASE 648-08 ISSUE R 16-LEAD PLASTIC DIP 0.25 8X PIN'S NUMBER M B A 10.55 10.05 2.65 2.35 0.25 0.10 16X 16 1 0.49 0.35 0.25 6 M T A B PIN 1 INDEX 14X 10.45 4 10.15 A A 8 1.27 9 7.6 7.4 SEATING PLANE T B 16X 0.1 T 5 0.75 0.25 X45˚ 0.32 0.23 1.0 0.4 SECTION A-A NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 3. DATUMS A AND B TO BE DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. 4. THIS DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURRS. MOLD FLASH, PROTRUSTION OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. THIS DIMENSION IS DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. 5. THIS DIMENSION DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSIONS SHALL NOT EXCEED 0.25mm PER SIDE. THIS DIMENSION IS DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. 6. THIS DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.62mm. 7˚ 0˚ CASE 751G-04 ISSUE D 16-LEAD SOIC MC145010 Sensors Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MC145010 Rev. 7.0 04/2006 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. 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