Document Number: MC145012
Rev 9.0, 11/2006
Freescale Semiconductor
Technical Data
Photoelectric Smoke Detector IC with
I/O and Temporal Pattern Horn Driver
The CMOS MC145012 is an advanced smoke detector component containing
sophisticated very-low-power analog and digital circuitry. The IC is used with an
infrared photoelectric chamber. Detection is accomplished by sensing scattered
light from minute smoke particles or other aerosols. When detection occurs, a
pulsating alarm is sounded via on-chip push-pull drivers and an external
piezoelectric transducer.
The variable-gain photo amplifier allows direct interface to IR detectors
(photodiodes). Two external capacitors, C1 and C2, C1 being the larger, determine
the gain settings. Low gain is selected by the IC during most of the standby state.
Medium gain is selected during a local-smoke condition. High gain is used during
push-button test. During standby, the special monitor circuit which periodically
checks for degraded chamber sensitivity uses high gain also.
The I/O pin, in combination with VSS, can be used to interconnect up to 40 units
for common signaling. An on-chip current sink provides noise immunity when the I/
O is an input. A local-smoke condition activates the short-circuit-protected I/O
driver, thereby signaling remote smoke to the interconnected units. Additionally, the
I/O pin can be used to activate escape lights, enable auxiliary or remote alarms,
and/or initiate auto-dialers.
While in standby, the low-supply detection circuitry conducts periodic checks
using a pulsed load current from the LED pin. The trip point is set using two external
resistors. The supply for the MC145012 can be a 9.0 V battery.
A visible LED flash accompanying a pulsating audible alarm indicates a localsmoke condition. A pulsating audible alarm with no LED flash indicates a remotesmoke condition. A beep or chirp occurring virtually simultaneously with an LED
flash indicates a low-supply condition. A beep or chirp occurring halfway between
LED flashes indicates degraded chamber sensitivity. A low-supply condition does
not affect the smoke detection capability if VDD ≥ 6.0 V. Therefore, the low-supply
condition and degraded chamber sensitivity can be further distinguished by
performing a push-button (chamber) test.
Features
•
•
•
•
•
•
•
•
•
•
Circuit is designed to operate in smoke detector systems that comply with
UL217 and UL268 Specifications
Operating Voltage Range: 6.0 V to 12 V, Average Supply Current: 8 µA
Operating Temperature Range: -10 to 60°C
I/O Pin Allows Units to be Interconnected for Common Signalling
Power-On Reset Places IC in Standby Mode (Non-Alarm State)
Electrostatic Discharge (ESD) and Latch Up Protection Circuitry on All Pins
Chip Complexity: 2000 FETs, 12 NPNs, 16 Resistors, and 10 Capacitors
Supports NFPA 72, ANSI S3.41, and ISO 8201 Audible Emergency Evacuation
Signals
Ideal for battery-powered applications
Pb-Free Packaging Designated by Suffix Codes ED and EG
ORDERING INFORMATION
Device
Temp. Range
Case No.
MC145012P
Package
16 Lead Plastic Dip
648-08
MC145012ED
16 PDIP (Pb-Free)
-55 to +125°C
MC145012DW
16 Lead SOICW
751G-04
MCZ145012EG/R2
© Freescale Semiconductor, Inc., 2006. All rights reserved.
16 SOICW (Pb-Free)
MC145012
PHOTOELECTRIC SMOKE
DETECTOR IC WITH I/O AND
TEMPORAL PATTERN
HORN DRIVER
P SUFFIX
ED SUFFIX (PB-FREE)
PLASTIC DIP
CASE 648-08
DW SUFFIX
EG SUFFIX (PB-FREE)
SOIC PACKAGE
CASE 751G-04
C1 1
16
C2 2
15
DETECT 3
14
TEST
LOW-SUPPLY
TRIP
VSS
STROBE 4
13
R1
VDD 5
12
OSC
IRED 6
11
LED
I/O 7
10
FEEDBACK
BRASS 8
9
SILVER
Figure 1. Pin Connections
C1 C2
1 2
3
-
AMP
Zero
12 OSC
OSC
13
R1
16
TEST
STROBE
4
LOW-SUPPLY 15
TRIP
Gain
VDD - 3.5 V
REF
Timing
Logic
Smoke
COMP
+
Gate
On/off
GATE
ON/OFF
7
Alarm
Logic
Low Supply
DETECT
Temporal Pattern Horn
Modulator
And Driver
VDD - 5 V
REF
8
9
I/O
BRASS
SILVER
10
6
FEEDBACK
IRED
11
LED
COMP
+
Pin 5 = VDD
Pin 14 = VSS
Figure 2. Block Diagram
MC145012
2
Sensors
Freescale Semiconductor
Table 1. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the
device. (Voltages referenced to VSS)
Rating
Symbol
Value
Unit
DC Supply Voltage
VDD
-0.5 to +12
V
DC Input Voltage
C1, C2, Detect
Osc, Low-Supply Trip
I/O
Feedback
Test
VIN
DC Input Current, per Pin
IIN
±10
mA
DC Output Current, per Pin
IOUT
±25
mA
DC Supply Current, VDD and VSS Pins
IDD
+25 / -150
mA
Power Dissipation in Still Air
5 Seconds
Continuous
PD
Storage Temperature
Lead Temperature, 1 mm from Case for 10 Seconds
Peak Package Reflow Temperature During Reflow (3) , (4)
V
-0.25 to VDD +0.25
-0.25 to VDD +0.25
-0.25 to VDD +10
-15 to +25
-1.0 to VDD +0.25
mW
1200 (1)
350 (2)
TSTG
-55 to +125
°C
TL
260
°C
TPPRT
Note 4
°C
Note:
1. Derating: -12 mW/°C from 25° to 60°C
2. Derating: -3.5 mW/×C from 25° to 60°C.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must
be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin
and Vout should be constrained to the range VSS £ (Vin or Vout) £ VDD except for the I/O, which can exceed VDD, and the Test input, which
can go below VSS.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs and/or an unused I/O
must be left open.
3. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
4. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standerd J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
> Go to www.freescale.com
> Search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (ie. MC33xxxD enter 33xxx)]
> Locate your Part Number and in the Details column, select “View”
> Select “Environmental and Compliance Information”
MC145012
Sensors
Freescale Semiconductor
3
Table 2. Electrical Characteristics
(Voltages Referenced to VSS, TA = - 10 to 60°C Unless Otherwise Indicated).
Characteristic
Symbol
Test Condition
VDD
V
Min
Max
Unit
—
6.0
12
V
—
6.5
7.8
V
Power Supply Voltage Range
VDD
Supply Threshold Voltage, Low-Supply Alarm
VTH
Low-Supply Trip: Vin = VDD/3
Average Operating Supply Current (per Package)
(Does Not Include Current through D3-IR Emitter)
IDD
Standby
Configured per Figure 8
12.0
—
8.0
µA
Peak Supply Current (per Package)
(Does Not Include IRED Current into Base of Q1)
IDD
During Strobe On, IRED Off
Configured per Figure 8
12.0
—
2.0
mA
During Strobe On, IRED On
Configured per Figure 8
12.0
—
3.0
Low-Level Input Voltage
I/O
Feedback
Test
VIL
9.0
9.0
9.0
—
—
—
1.5
2.7
7.0
V
High-Level Input Voltage
I/O
Feedback
Test
VIH
9.0
9.0
9.0
3.2
6.3
8.5
—
—
—
V
OSC, Detect
Low-Supply Trip
Feedback
IIN
Vin = VSS or VDD
Vin = VSS or VDD
Vin = VSS or VDD
12.0
12.0
12.0
—
—
—
± 100
± 100
± 100
nA
Low-Level Input Current
Test
IIL
Vin = VSS
12.0
- 100
- 1.0
µA
Pull-Down Current
Test
I/O
IIH
Vin = VDD
No Local Smoke, Vin = VDD
No Local Smoke, Vin = 17 V
9.0
9.0
12.0
0.5
25
—
10
100
140
µA
Input Current
Low-Level Output Voltage
LED
Silver, Brass
VOL
Iout = 10 mA
Iout = 16 mA
6.5
6.5
—
—
0.6
1.0
V
High-Level Output Voltage
Silver, Brass
VOH
Iout = - 16 mA
6.5
5.5
—
V
Strobe
VOUT
Inactive, Iout = 1 µA
Active, Iout = 100 µA to 500 µA
(Load Regulation)
—
9.0
VDD - 0.1
VDD - 4.40
—
VDD - 5.30
V
Inactive, Iout = 1 µA
Active, Iout = 6 mA
(Load Regulation)
—
9.0
—
2.25 (5)
0.1
3.75 (5)
Local Smoke, Vout = 4.5 V
6.5
-4.0
—
Local Smoke, Vout = VSS
(Short Circuit Current)
12.0
—
-16
12.0
—
±1.0
µA
Output Voltage
(For Line Regulation, See
Pin Descriptions)
IRED
High-Level Output Current
Off-State Output Leakage Current
Common Mode
Voltage Range
Smoke Comparator
Reference Voltage
I/O
IOH
mA
LED
IOZ
Vout = VSS or VDD
C1, C2, Detect
VIC
Local Smoke, Push-button Test,
or Chamber Sensitivity Test
—
VDD - 4.0
VDD - 2.0
V
VREF
Local Smoke, Push-button Test,
or Chamber Sensitivity Test
—
VDD - 3.08
VDD - 3.92
V
Internal
Notes
5. TA = 25°C only.
MC145012
4
Sensors
Freescale Semiconductor
Table 3. AC Electrical Characteristics
(Reference Timing Diagram Figure 6 and Figure 7)
(TA = 25°C, VDD = 9.0 V, Component Values from Figure 8: R1 = 100.0 KΩ, C3 = 1500.0 pF, R2 = 7.5 MΩ).
No.
Parameter
Symbol
Test Condition
Free-Running Sawtooth
Measured at Pin 12
1
Oscillator Period
1/FOSC
2
LED Pulse Period
TLED
No Local Smoke, and
No Remote Smoke
Clocks
Min (6)
Typ (7)
Max(6)
Unit
1.0
7.0
7.9
8.6
ms
4096
28.8
32.4
35.2
s
3
Remote Smoke, but
No Local Smoke
—
4
Local Smoke
64
0.45
—
—
5
Push-button Test
64
0.45
—
—
1.0
7.0
—
8.6
ms
TW(LED),
TW(STB)
Extinguished
6
LED Pulse Width and Strobe
Pulse Width
7
IRED Pulse Period
TIRED
Smoke Test
1024
7.2
8.1
8.8
s
8
IRED Pulse Period
TIRED
Chamber Sensitivity Test,
without Local Smoke
4096
28.8
32.4
35.2
s
Push-button Test
128
0.9
1.0
1.1
TW(IRED)
TF*
94
—
116
9
µs
10
IRED Pulse Width
11
IRED Rise Time
TR
—
—
—
30
12
IRED Fall Time
TF
—
—
—
200
µs
13
Silver and Brass Temporal
Modulation Pulse Width
TON
64
0.45
0.5
0.55
s
0.45
0.5
0.55
192
1.35
1.52
1.65
4096
28.8
32.4
35.2
s
1
7.0
7.9
8.6
ms
—
—
2.0 (8)
—
s
s
14
15
TOFF
TOFFD
16
Silver and Brass Chirp Pulse
Period
TCH
Low Supply or Degraded
Chamber Sensitivity
17
Silver and Brass Chirp Pulse
Width
TWCH
18
Rising Edge on I/O to Smoke
Alarm Response Time
TRR
Remote Smoke,
No Local Smoke
19
Strobe Out Pulse Period
TSTB
Smoke Test
1024
7.2
8.1
8.8
20
Chamber Sensitivity Test,
without Local Smoke
4096
28.8
32.4
35.2
21
Low Supply Test,
without Local Smoke
4096
28.8
32.4
35.2
22
Push-button Test
—
—
1.0
—
Notes
6. Oscillator period T (= Tr + Tf) is determined by the external components R1, R2, and C3 where TR = (0.6931) R2 C3 and TF = (0.6931) R1 *
C3. The other timing characteristics are some multiple of the oscillator timing as shown in the table. The timing shown should accommodate
the NFPA 72, ANSI S3.41, and ISO 8201 audible emergency evacuation signals.
7. Typicals are not guaranteed.
8. Time is typical - depends on what point in cycle signal is applied.
MC145012
Sensors
Freescale Semiconductor
5
AC Parameter (Normalized To 9.0 V Value)
1.04
1.02
Pulse Width Of IRED
1.00
Period Or Pulse Width
Of Other Parameters
0.98
TA = 25°C
0.96
6.0
7.0
8.0
9.0
10.0
11.0
12.0
VDD, Power Supply Voltage (V)
AC Parameter (Normalized To 25°C Value)
Figure 3. AC Characteristics versus Supply
1.02
1.01
Pulse Width Of IRED
1.00
Period Or Pulse Width
Of Other Parameters
0.99
VDD = 9.0 V
0.98
- 10
0
10
20
30
40
50
60
NOTE: Includes external component
variations. See Figure 5.
TA, Ambient Temperature (°C)
Figure 4. AC Characteristics versus Temperature
Component Value (Normalized To
25°C Value)
1.03
1.02
7.5 MΩ Carbon Composition
1.01
100 kΩ Metal Film
1.00
1500 Pf DIPPED MICA
0.99
0.98
- 10
0
10
20
30
40
50
60
TA, Ambient Temperature (°C)
NOTE: These components were used to
generate Figure 4.
Figure 5. RC Component Variation Over Temperature
MC145012
6
Sensors
Freescale Semiconductor
Figure 6. Typical Standby Timing
MC145012
Sensors
Freescale Semiconductor
7
19
7
Power-on Reset
2
21
7
No Low Supply
Chamber Sensitivity Ok
20
8
NOTES: Numbers refer to the AC Electrical Characteristics Table.
Illustration is not to scale.
Silver, Brass
Enable
(Internal)
LED
(Pin 11)
Strobe
(Pin 4)
IRED
(Pin 6)
Photo Sample
(Internal)
Chamber Test
(Internal)
Low Supply Test
(Internal)
OSC
(Pin 12)
1
6
Chirps
Indicate
Low Supply
16
21
17
Chirps
Indicate
Degraded
Chamber
Sensitivity
16
Figure 7. Typical Local Smoke Timing
MC145012
8
Sensors
Freescale Semiconductor
No
Smoke
6
6
14
13
90%
10%
12
Local Smoke
(Remote Smoke = Don't Care)
18
7
11
4
15
(As Output)
(Not Performed)
(Not Performed)
NOTES: Numbers refer to the AC Electrical Characteristics Table.
Illustration is not to scale.
Silver, Brass
Enable (Internal)
I/O
(Pin 7)
LED
(Pin 11)
Strobe
(Pin 4)
IRED
(Pin 6)
Chamber Test
(Internal)
Low Supply Test
(Internal)
IRED
10
No Smoke
18
Remote Smoke
(No Local Smoke)
(As Input)
3
(No Pulses)
22
9
5
Pushbutton Test
(As Output)
C1
0.047 µF
1 TO 22 µF
C4(12)
+
9V
B1
D1
C2(10)
4700 pF
1
TEST
SW1
Pushbutton
Test
16
R6
100 k
R14
560 Ω
R8
8.2 k
2
R11 250 k
R9(11)
5k
3
R10
4.7 k
D2
IR Detector
LOW-SUPPLY 15
TRIP
C2
DETECT
VSS
R7
47 k
14
MC145012
4
STROBE
R1
13
R1
100 k
R12
1k
C5
100 µF
C1
Reverse
Polarity
Protection
Circuit
D3
IR Emitter
+
6
Q1
IR
Current
To Other
MC145012(s),
Escape Light(S),
Auxiliary Alarm(S),
Remote Alarm(S),
And/or Auto-dialer
5
R13(10)
4.7 TO 22
7
8
VDD
OSC
IRED
LED
I/O
BRASS
FEEDBACK
SILVER
12
R2
7.5 M
C3
1500 pF
D4
Visible
LED
R3
11
470
R4 (9)
10
9
0.01 µF
C6 (9)
100 k
Horn
X1
2.2 M
R5(9)
9. Values for R4, R5, and C6 may differ depending on type of piezoelectric horn used.
10.C2 and R13 are used for coarse sensitivity adjustment. Typical values are shown.
11.R9 is for fine sensitivity adjustment (optional). If fixed resistors are used, R8 = 12 k, R10 is 5.6 k to 10 k, and R9 is eliminated.
When R9 is used, noise pickup is increased due to antenna effects. Shielding may be required.
12.C4 should be 22 µF if B1 is a carbon battery. C4 could be reduced to 1 µF when an alkaline battery is used.
Figure 8. Typical Battery-Powered Application
Table 4. Pin Description
Pin No.
Pin Name
Description
1
C1
A capacitor connected to this pin as shown in Figure 8 determines the gain of the on-chip photo amplifier during pushbutton test and chamber sensitivity test (high gain). The capacitor value is chosen such that the alarm is tripped from
background reflections in the chamber during push-button test.
Av ≈ 1 + (C1/10) where C1 is in pF. CAUTION: The value of the closed-loop gain should not exceed 10,000.
2
C2
A capacitor connected to this pin as shown in Figure 8 determines the gain of the on-chip photo amplifier except during
push-button or chamber sensitivity tests.
Av ≈ 1 + (C2/10) where C2 is in pF. This gain increases about 10% during the IRED pulse, after two consecutive local
smoke detections.
Resistor R14 must be installed in series with C2. R14 ≈ [1/(12√C2)] - 680 where R14 is in ohms and C2 is in farads.
3
DETECT
This input to the high-gain pulse amplifier is tied to the cathode of an external photodiode. The photodiode should have
low capacitance and low dark leakage current. The diode must be shunted by a load resistor and is operated at zero
bias.
The Detect input must be AC/DC decoupled from all other signals, VDD, and VSS. Lead length and/or foil traces to this
pin must be minimized, also. See Figure 9.
MC145012
Sensors
Freescale Semiconductor
9
Table 4. Pin Description
(Continued)
Pin No.
Pin Name
Description
4
STROBE
This output provides a strobed, regulated voltage referenced to VDD. The temperature coefficient of this voltage is
± 0.2%/°C maximum from - 10° to 60°C. The supply-voltage coefficient (line regulation) is ± 0.2%/V maximum from 6.0 V
to 12 V. Strobe is tied to external resistor string R8, R9, and R10.
5
VDD
This pin is connected to the positive supply potential and may range from + 6.0 V to + 12 V with respect to VSS
CAUTION: In battery-powered applications, reverse-polarity protection must be provided externally.
6
IRED
This output provides pulsed base current for external NPN transistor Q1 used as the infrared emitter driver. Q1 must
have β ≥ 100. At 10 mA, the temperature coefficient of the output voltage is typically + 0.5%/°C from - 10° to 60°C. The
supply-voltage coefficient (line regulation) is ± 0.2%/V maximum from 6.0 V to 12 V. The IRED pulse width (active-high)
is determined by external components R1 and C3. With a 100 kΩ/1500 pF combination, the nominal width is 105 µs.
To minimize noise impact, IRED is not active when the visible LED and horn outputs are active. IRED is active near the
end of strobe pulses for smoke tests, chamber sensitivity test, and push-button test.
7
I/O
This pin can be used to connect up to 40 units together in a wired-OR configuration for common signaling. VSS is used
as the return. An on-chip current sink minimizes noise pick up during non-smoke conditions and eliminates the need for
an external pull-down resistor to complete the wired-OR. Remote units at lower supply voltages do not draw excessive
current from a sending unit at a higher supply voltage.
I/O can also be used to activate escape lights, auxiliary alarms, remote alarms, and/or auto-dialers.
As an input, this pin feeds a positive-edge-triggered flip-flop whose output is sampled nominally every 1 second during
standby (using the recommended component values). A local-smoke condition or the push-button-test mode forces this
current-limited output to source current. All input signals are ignored when I/O is sourcing current.
I/O is disabled by the on-chip power-on reset to eliminate nuisance signaling during battery changes or system power-up.
If unused, I/O must be left unconnected.
8
BRASS
This half of the push-pull driver output is connected to the metal support electrode of a piezoelectric audio transducer
and to the horn-starting resistor. A continuous modulated tone from the transducer is a smoke alarm indicating either
local or remote smoke. A short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity.
9
SILVER
This half of the push-pull driver output is connected to the metal support electrode of a piezoelectric audio transducer
and to the horn-starting resistor. A continuous modulated tone from the transducer is a smoke alarm indicating either
local or remote smoke. A short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity.
10
FEEDBACK
This input is connected to both the feedback electrode of a self-resonating piezoelectric transducer and the horn-starting
resistor and capacitor through current-limiting resistor R4. If unused, this pin must be tied to VSS or VDD.
11
LED
This active-low open-drain output directly drives an external visible LED at the pulse rates indicated below. The pulse
width is equal to the OSC period.
The load for the low-supply test is applied by this output. This low-supply test is non-coincident with the smoke tests,
chamber sensitivity test, push-button test, or any alarm signals.
The LED also provides a visual indication of the detector status as follows, assuming the component values shown in
Figure 8:
Standby (includes low-supply and chamber sensitivity tests) — Pulses every 32.4 seconds (typical)
Standby (includes low-supply and chamber sensitivity tests) — Pulses every 32.4 seconds (typical)
Local Smoke — Pulses every 0.51 seconds (typical)
Remote Smoke — No pulses
Push-button Test — Pulses every 0.51 seconds (typical)
12
OSC
This pin is used in conjunction with external resistor R2 (7.5 MΩ) to VDD and external capacitor C3 (1500 pF) to VDD to
form an oscillator with a nominal period of 7.9 ms (typical).
13
R1
This pin is used in conjunction with resistor R1 (100 kΩ) to Pin 12 and C3 (1500 pF, see Pin 12 description) to determine
the IRED pulse width. With this RC combination, the nominal pulse width is 105 µs.
14
VSS
15
LOWSUPPLY
TRIP
This pin is connected to an external voltage which determines the low-supply alarm threshold. The trip voltage is
obtained through a resistor divider connected between the VDD and LED pins. The low-supply alarm threshold voltage
(in volts) ≈ (5R7/R6) + 5 where R6 and R7 are in the same units.
16
TEST
This input has an on-chip pull-down device and is used to manually invoke a test mode.
The Push-button Test mode is initiated by a high level at Pin 16 (usually depression of a S.P.S.T. normally-open pushbutton switch to VDD). After one oscillator cycle, IRED pulses approximately every 1.0 second, regardless of the presence
of smoke. Additionally, the amplifier gain is increased by automatic selection of C1. Therefore, the background reflections
in the smoke chamber may be interpreted as smoke, generating a simulated-smoke condition. After the second IRED
pulse, a successful test activates the horn-driver and I/O circuits. The active I/O allows remote signaling for system
testing. When the Push-button Test switch is released, the Test input returns to VSS due to the on-chip pull-down device.
After one oscillator cycle, the amplifier gain returns to normal, thereby removing the simulated-smoke condition. After two
additional IRED pulses, less than three seconds, the IC exits the alarm mode and returns to standby timing.
This pin is the negative supply potential and the return for the I/O pin. Pin 14 is usually tied to ground.
MC145012
10
Sensors
Freescale Semiconductor
CALIBRATION
To facilitate checking the sensitivity and calibrating smoke
detectors, the MC145012 can be placed in a calibration
mode. In this mode, certain device pins are controlled/
reconfigured as shown in Table 5. To place the part in the
calibration mode, Pin 16 (Test) must be pulled below the VSS
pin with 100 µA continuously drawn out of the pin for at least
one cycle on the OSC pin. To exit this mode, the Test pin is
floated for at least one OSC cycle.
In the calibration mode, the IRED pulse rate is increased
to one for every OSC cycle. Also, Strobe is always active low.
Table 5. Configuration of Pins in the Calibration Mode
Description
Pin
Comment
I/O
7
Disabled as an output. Forcing this pin high places the photo amp output on Pin 1 or 2, as determined by LowSupply Trip. The amp's output appears as pulses and is referenced to VDD etc.
Low-Supply Trip
15
If the I/O pin is high, Pin 15 controls which gain capacitor is used. Low: normal gain, amp output on Pin 1. High:
supervisory gain, amp output on Pin 2.
Feedback
10
Driving this input high enables hysteresis (10% gain increase) in the photo amp; Pin 15 must be low.
OSC
12
Driving this input high brings the internal clock high. Driving the input low brings the internal clock low. If
desired, the RC network for the oscillator may be left intact; this allows the oscillator to run similar to the normal
mode of operation.
Silver
9
This pin becomes the smoke comparator output. When the OSC pin is toggling, positive pulses indicate that
smoke has been detected. A static low level indicates no smoke.
Brass
8
This pin becomes the smoke integrator output. That is, 2 consecutive smoke detections are required for “on”
(static high level) and 2 consecutive no-detections for “off” (static low level).
Do Not Run Any
Additional Traces
In This Region
Pin 16
Pin 1
C1
C2
R14
R11
MOUNTED IN
CHAMBER
Pin 9
R8
R100
D2
PIN 8
NOTES: Illustration is bottom view of layout using a DIP. Top view for SOIC layout is mirror image.
Optional potentiometer R9 is not included.
Drawing is not to scale.
Leads on D2, R11, R8, and R10 and their associated traces must be kept as short as possible. This practice minimizes noise
pick up.
Pin 3 must be decoupled from all other traces.
Figure 9. Recommended PCB Layout
MC145012
Sensors
Freescale Semiconductor
11
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
-A16
9
1
8
B
F
C
L
S
SEATING
PLANE
-TK
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
M
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
ANODE
ANODE
ANODE
ANODE
ANODE
ANODE
ANODE
ANODE
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
INCHES
MILLIMETERS
MIN
MAX MIN MAX
0.740
0.770 18.80 19.55
0.250
0.270
6.35
6.85
0.145
0.175
3.69
4.44
0.015
0.021
0.39
0.53
0.040
0.70
1.02
1.77
0.100 BSC
2.54 BSC
0.050 BSC
1.27 BSC
0.008
0.015
0.21
0.38
0.110
0.130
2.80
3.30
0.295
0.305
7.50
7.74
0
10
0
10
0.020
0.040
0.51
1.01
DIM
A
B
C
D
F
G
H
J
K
L
M
S
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
GATE
SOURCE
GATE
SOURCE
GATE
SOURCE
GATE
SOURCE
CASE 648-08
ISSUE R
16-LEAD PLASTIC DIP
0.25
8X
PIN'S
NUMBER
M
B
A
10.55
10.05
2.65
2.35
0.25
0.10
16X
16
1
0.49
0.35
0.25
6
M
T A B
PIN 1 INDEX
14X
10.45
4 10.15
A
A
8
1.27
9
7.6
7.4
SEATING
PLANE
T
B
16X
0.1 T
5
0.75
0.25
X45˚
0.32
0.23
1.0
0.4
SECTION A-A
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. DATUMS A AND B TO BE DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
4. THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURRS. MOLD
FLASH, PROTRUSTION OR GATE BURRS SHALL
NOT EXCEED 0.15mm PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
5. THIS DIMENSION DOES NOT INCLUDE
INTER-LEAD FLASH OR PROTRUSIONS.
INTER-LEAD FLASH AND PROTRUSIONS
SHALL NOT EXCEED 0.25mm PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
6. THIS DIMENSION DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL NOT CAUSE
THE LEAD WIDTH TO EXCEED 0.62mm.
7˚
0˚
CASE 751G-04
ISSUE D
16-LEAD SOIC
MC145012
Sensors
Freescale Semiconductor
12
REVISION HISTORY
REVISION
9.0
DATE
11/2006
DESCRIPTION OF CHANGES
•
•
•
Implemented Revision History page
Updated to the current Freescale format and style
Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from
Maximum Ratings on page 3. Added note with instructions from www.freescale.com.
MC145012
Sensors
Freescale Semiconductor
13
How to Reach Us:
Home Page:
www.freescale.com
E-mail:
support@freescale.com
RoHS-compliant and/or Pb-free versions of Freescale products have the functionality
and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free
counterparts. For further information, see http://www.freescale.com or contact your
Freescale sales representative.
For information on Freescale’s Environmental Products program, go to http://
www.freescale.com/epp.
USA/Europe or Locations Not Listed:
Freescale Semiconductor
Technical Information Center, CH370
1300 N. Alma School Road
Chandler, Arizona 85224
+1-800-521-6274 or +1-480-768-2130
support@freescale.com
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
support@freescale.com
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
support.japan@freescale.com
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
+800 2666 8080
support.asia@freescale.com
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-441-2447 or 303-675-2140
Fax: 303-675-2150
LDCForFreescaleSemiconductor@hibbertgroup.com
MC145012
Rev. 8.0
11/2006
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2006. All rights reserved.
工商网监
湘ICP备2023018690号
