0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
MC9S08PT60AVLH

MC9S08PT60AVLH

  • 厂商:

    NXP(恩智浦)

  • 封装:

    LQFP-64

  • 描述:

    IC MCU 8BIT 60KB FLASH 64LQFP

  • 数据手册
  • 价格&库存
MC9S08PT60AVLH 数据手册
Freescale Semiconductor Data Sheet: Technical Data MC9S08PT60 Series Data Sheet Supports: MC9S08PT60(A) and MC9S08PT32(A) Key features • 8-Bit S08 central processor unit (CPU) – Up to 20 MHz bus at 2.7 V to 5.5 V across temperature range of -40 °C to 105 °C – Supporting up to 40 interrupt/reset sources – Supporting up to four-level nested interrupt – On-chip memory – Up to 60 KB flash read/program/erase over full operating voltage and temperature – Up to 256 byte EEPROM; 2-byte erase sector; program and erase while executing flash – Up to 4096 byte random-access memory (RAM) – Flash and RAM access protection • Power-saving modes – One low-power stop mode; reduced power wait mode – Peripheral clock enable register can disable clocks to unused modules, reducing currents; allows clocks to remain enabled to specific peripherals in stop3 mode • Clocks – Oscillator (XOSC) - loop-controlled Pierce oscillator; crystal or ceramic resonator range of 31.25 kHz to 39.0625 kHz or 4 MHz to 20 MHz – Internal clock source (ICS) - containing a frequencylocked-loop (FLL) controlled by internal or external reference; precision trimming of internal reference allowing 1% deviation across temperature range of 0 °C to 70 °C and 2% deviation across temperature range of -40 °C to 105 °C; up to 20 MHz • System protection – Watchdog with independent clock source – Low-voltage detection with reset or interrupt; selectable trip points – Illegal opcode detection with reset – Illegal address detection with reset © 2011–2015 Freescale Semiconductor, Inc. Document Number MC9S08PT60 Rev. 5, 06/2015 MC9S08PT60 MC9S08PT60A and MC9S08PT32A are recommended for new design • Development support – Single-wire background debug interface – Breakpoint capability to allow three breakpoints setting during in-circuit debugging – On-chip in-circuit emulator (ICE) debug module containing two comparators and nine trigger modes • Peripherals – ACMP - one analog comparator with both positive and negative inputs; separately selectable interrupt on rising and falling comparator output; filtering – ADC - 16-channel, 12-bit resolution; 2.5 µs conversion time; data buffers with optional watermark; automatic compare function; internal bandgap reference channel; operation in stop mode; optional hardware trigger – CRC - programmable cyclic redundancy check module – FTM - three flex timer modulators modules including one 6-channel and two 2-channel ones; 16-bit counter; each channel can be configured for input capture, output compare, edge- or centeraligned PWM mode – IIC - One inter-integrated circuit module; up to 400 kbps; multi-master operation; programmable slave address; supporting broadcast mode and 10-bit addressing; supporting SMBUS and PMBUS – MTIM - Two modulo timers with 8-bit prescaler and overflow interrupt – RTC - 16-bit real timer counter (RTC) – SCI - three serial communication interface (SCI/ UART) modules optional 13-bit break; full duplex non-return to zero (NRZ); LIN extension support – SPI - one 8-bit and one 16-bit serial peripheral interface (SPI) modules; full-duplex or single-wire bidirectional; master or slave mode – TSI - supporting up to 16 external electrodes; configurable software or hardware scan trigger; fully support freescale touch sensing software library; capability to wake MCU from stop3 mode • Input/Output – Up to 57 GPIOs including one output-only pin – Two 8-bit keyboard interrupt modules (KBI) – Two true open-drain output pins – Eight, ultra-high current sink pins supporting 20 mA source/sink current • Package options – 64-pin LQFP; 64-pin QFP – 48-pin LQFP – 44-pin LQFP – 32-pin LQFP MC9S08PT60 Series Data Sheet, Rev. 5, 06/2015 2 Freescale Semiconductor, Inc. Table of Contents 1 Ordering parts.......................................................................................4 1.1 Determining valid orderable parts............................................... 4 5.2.3 FTM module timing....................................................... 18 5.3 Thermal specifications................................................................. 19 2 Part identification................................................................................. 4 5.3.1 Thermal operating requirements.................................... 19 2.1 Description...................................................................................4 5.3.2 Thermal characteristics.................................................. 19 2.2 Format.......................................................................................... 4 6 Peripheral operating requirements and behaviors................................ 20 2.3 Fields............................................................................................4 6.1 External oscillator (XOSC) and ICS characteristics....................20 2.4 Example....................................................................................... 5 6.2 NVM specifications..................................................................... 22 3 Parameter Classification.......................................................................5 6.3 Analog..........................................................................................23 4 Ratings..................................................................................................6 6.3.1 ADC characteristics....................................................... 23 4.1 Thermal handling ratings............................................................. 6 6.3.2 Analog comparator (ACMP) electricals.........................26 4.2 Moisture handling ratings............................................................ 6 4.3 ESD handling ratings................................................................... 6 4.4 Voltage and current operating ratings..........................................6 5 General................................................................................................. 7 5.1 Nonswitching electrical specifications........................................ 7 6.4 Communication interfaces........................................................... 26 6.4.1 SPI switching specifications.......................................... 26 6.5 Human-machine interfaces (HMI)...............................................29 6.5.1 TSI electrical specifications........................................... 29 7 Dimensions...........................................................................................30 5.1.1 DC characteristics.......................................................... 7 5.1.2 Supply current characteristics........................................ 14 8 Pinout................................................................................................... 30 5.1.3 EMC performance..........................................................15 8.1 Signal multiplexing and pin assignments.................................... 30 5.2 Switching specifications.............................................................. 16 8.2 Device pin assignment................................................................. 33 5.2.1 Control timing................................................................ 16 5.2.2 Debug trace timing specifications..................................17 7.1 Obtaining package dimensions.................................................... 30 9 Revision history....................................................................................36 MC9S08PT60 Series Data Sheet, Rev. 5, 06/2015 Freescale Semiconductor, Inc. 3 Ordering parts 1 Ordering parts 1.1 Determining valid orderable parts Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to freescale.com and perform a part number search for the following device numbers: PT60 and PT32. 2 Part identification 2.1 Description Part numbers for the chip have fields that identify the specific part. You can use the values of these fields to determine the specific part you have received. 2.2 Format Part numbers for this device have the following format: MC 9 S08 PT AA (V) B CC 2.3 Fields This table lists the possible values for each field in the part number (not all combinations are valid): Field Description Values MC Qualification status • MC = fully qualified, general market flow 9 Memory • 9 = flash based S08 Core • S08 = 8-bit CPU PT Device family • PT AA Approximate flash size in KB • 60 = 60 KB • 32 = 32 KB (V) Mask set version • (blank) = Any version • A = Rev. 2 or later version, this is recommended for new design Table continues on the next page... MC9S08PT60 Series Data Sheet, Rev. 5, 06/2015 4 Freescale Semiconductor, Inc. Parameter Classification Field Description Values B Operating temperature range (°C) • V = –40 to 105 CC Package designator • • • • • QH = 64-pin QFP LH = 64-pin LQFP LF = 48-pin LQFP LD = 44-pin LQFP LC = 32-pin LQFP 2.4 Example This is an example part number: MC9S08PT60VQH 3 Parameter Classification The electrical parameters shown in this supplement are guaranteed by various methods. To give the customer a better understanding, the following classification is used and the parameters are tagged accordingly in the tables where appropriate: Table 1. Parameter Classifications P Those parameters are guaranteed during production testing on each individual device. C Those parameters are achieved by the design characterization by measuring a statistically relevant sample size across process variations. T Those parameters are achieved by design characterization on a small sample size from typical devices under typical conditions unless otherwise noted. All values shown in the typical column are within this category. D Those parameters are derived mainly from simulations. NOTE The classification is shown in the column labeled “C” in the parameter tables where appropriate. MC9S08PT60 Series Data Sheet, Rev. 5, 06/2015 Freescale Semiconductor, Inc. 5 Ratings 4 Ratings 4.1 Thermal handling ratings Symbol Description Min. Max. Unit Notes TSTG Storage temperature –55 150 °C 1 TSDR Solder temperature, lead-free — 260 °C 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.2 Moisture handling ratings Symbol MSL Description Moisture sensitivity level Min. Max. Unit Notes — 3 — 1 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.3 ESD handling ratings Symbol Description Min. Max. Unit Notes VHBM Electrostatic discharge voltage, human body model -6000 +6000 V 1 VCDM Electrostatic discharge voltage, charged-device model -500 +500 V 2 Latch-up current at ambient temperature of 105°C -100 +100 mA ILAT 1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. 4.4 Voltage and current operating ratings Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond the limits specified in below table may affect device reliability or cause permanent damage to the device. For functional operating conditions, refer to the remaining tables in this document. MC9S08PT60 Series Data Sheet, Rev. 5, 06/2015 6 Freescale Semiconductor, Inc. General This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for instance, either VSS or VDD) or the programmable pullup resistor associated with the pin is enabled. Symbol Description Min. VDD Supply voltage –0.3 6.0 V IDD Maximum current into VDD — 120 mA Digital input voltage (except RESET, EXTAL, XTAL, or true open drain pin PTA2 and PTA3) –0.3 VDD + 0.3 V Digital input voltage (true open drain pin PTA2 and PTA3) -0.3 6 V Analog1, –0.3 VDD + 0.3 V –25 25 mA VDD – 0.3 VDD + 0.3 V VDIO VAIO ID VDDA RESET, EXTAL, and XTAL input voltage Instantaneous maximum current single pin limit (applies to all port pins) Analog supply voltage Max. Unit 1. All digital I/O pins, except open-drain pin PTA2 and PTA3, are internally clamped to VSS and VDD. PTA2 and PTA3 is only clamped to VSS. 5 General 5.1 Nonswitching electrical specifications 5.1.1 DC characteristics This section includes information about power supply requirements and I/O pin characteristics. Table 2. DC characteristics Symbol C — — VOH P Min Typical1 Max Unit — 2.7 — 5.5 V 5 V, Iload = -5 mA VDD - 0.8 — — V 3 V, Iload = -2.5 mA VDD - 0.8 — — V 5 V, Iload = -20 mA VDD - 0.8 — — V 3 V, Iload = -10 mA VDD - 0.8 — — V Descriptions Operating voltage Output high voltage All I/O pins, standarddrive strength C P C High current drive pins, high-drive strength2 Table continues on the next page... MC9S08PT60 Series Data Sheet, Rev. 5, 06/2015 Freescale Semiconductor, Inc. 7 Nonswitching electrical specifications Table 2. DC characteristics (continued) Symbol C IOHT D VOL P Min Typical1 Max Unit 5V — — -100 mA 3V — — -50 — — 0.8 V 3 V, Iload = 2.5 mA — — 0.8 V 5 V, Iload =20 mA — — 0.8 V 3 V, Iload = 10 mA — — 0.8 V — — 100 mA Descriptions Output high current Max total IOH for all ports Output low voltage All I/O pins, standard- 5 V, Iload = 5 drive strength mA C P High current drive pins, high-drive strength2 C IOLT D Output low current Max total IOL for all ports 5V 3V — — 50 VIH P Input high voltage All digital inputs VDD>4.5V 0.70 × VDD — — VDD>2.7V 0.75 × VDD — — Input low voltage All digital inputs VDD>4.5V — — 0.30 × VDD VDD>2.7V — — 0.35 × VDD C VIL P C V V Vhys C Input hysteresis All digital inputs — 0.06 × VDD — — mV |IIn| P Input leakage current All input only pins (per pin) VIN = VDD or VSS — 0.1 1 µA |IOZ| P Hi-Z (offstate) leakage current All input/output (per pin) VIN = VDD or VSS — 0.1 1 µA |IOZTOT| C Total leakage All input only and I/O VIN = VDD or combined for VSS all inputs and Hi-Z pins — — 2 µA RPU P Pullup resistors All digital inputs, when enabled (all I/O pins other than PTA2 and PTA3) — 30.0 — 50.0 kΩ RPU3 P Pullup resistors PTA2 and PTA3 pin — 30.0 — 60.0 kΩ IIC D DC injection current4, 5, 6 Single pin limit VIN < VSS, VIN > VDD -0.2 — 2 mA -5 — 25 Total MCU limit, includes sum of all stressed pins CIn C Input capacitance, all pins — — — 7 pF VRAM C RAM retention voltage — 2.0 — — V 1. Typical values are measured at 25 °C. Characterized, not tested. 2. Only PTB4, PTB5, PTD0, PTD1, PTE0, PTE1, PTH0, and PTH1 support ultra high current output. 3. The specified resistor value is the actual value internal to the device. The pullup value may appear higher when measured externally on the pin. 4. All functional non-supply pins, except for PTA2 and PTA3, are internally clamped to VSS and VDD. 5. Input must be current-limited to the value specified. To determine the value of the required current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use the large one. MC9S08PT60 Series Data Sheet, Rev. 5, 06/2015 8 Freescale Semiconductor, Inc. Nonswitching electrical specifications 6. Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current conditions. If the positive injection current (VIn > VDD) is higher than IDD, the injection current may flow out of VDD and could result in external power supply going out of regulation. Ensure that external VDD load will shunt current higher than maximum injection current when the MCU is not consuming power, such as no system clock is present, or clock rate is very low (which would reduce overall power consumption). Table 3. LVD and POR Specification Symbol 1. 2. 3. 4. C Description POR re-arm Min Typ Max Unit 1.5 1.75 2.0 V 4.2 4.3 4.4 V Level 1 falling (LVWV = 00) 4.3 4.4 4.5 V Level 2 falling (LVWV = 01) 4.5 4.5 4.6 V Level 3 falling (LVWV = 10) 4.6 4.6 4.7 V Level 4 falling (LVWV = 11) 4.7 4.7 4.8 V voltage1, 2 VPOR D VLVDH C VLVW1H C VLVW2H C VLVW3H C VLVW4H C VHYSH C High range low-voltage detect/warning hysteresis — 100 — mV VLVDL C Falling low-voltage detect threshold - low range (LVDV = 0) 2.56 2.61 2.66 V VLVDW1L C Level 1 falling (LVWV = 00) 2.62 2.7 2.78 V VLVDW2L C Level 2 falling (LVWV = 01) 2.72 2.8 2.88 V VLVDW3L C Level 3 falling (LVWV = 10) 2.82 2.9 2.98 V VLVDW4L C Level 4 falling (LVWV = 11) 2.92 3.0 3.08 V VHYSDL C Low range low-voltage detect hysteresis — 40 — mV VHYSWL C Low range low-voltage warning hysteresis — 80 — mV VBG P Buffered bandgap output 4 1.14 1.16 1.18 V Falling low-voltage detect threshold - high range (LVDV = 1)3 Falling lowvoltage warning threshold high range Falling lowvoltage warning threshold low range Maximum is highest voltage that POR is guaranteed. POR ramp time must be longer than 20us/V to get a stable startup. Rising thresholds are falling threshold + hysteresis. Voltage factory trimmed at VDD = 5.0 V, Temp = 25 °C MC9S08PT60 Series Data Sheet, Rev. 5, 06/2015 Freescale Semiconductor, Inc. 9 Nonswitching electrical specifications VDD-VOH(V) IOH(mA) Figure 1. Typical IOH Vs. VDD-VOH (standard drive strength) (VDD = 5 V) VDD-VOH(V) IOH(mA) Figure 2. Typical IOH Vs. VDD-VOH (standard drive strength) (VDD = 3 V) MC9S08PT60 Series Data Sheet, Rev. 5, 06/2015 10 Freescale Semiconductor, Inc. Nonswitching electrical specifications VDD-VOH(V) IOH(mA) Figure 3. Typical IOH Vs. VDD-VOH (high drive strength) (VDD = 5 V) VDD-VOH(V) IOH(mA) Figure 4. Typical IOH Vs. VDD-VOH (high drive strength) (VDD = 3 V) MC9S08PT60 Series Data Sheet, Rev. 5, 06/2015 Freescale Semiconductor, Inc. 11 Nonswitching electrical specifications VOL(V) IOL(mA) Figure 5. Typical IOL Vs. VOL (standard drive strength) (VDD = 5 V) VOL(V) IOL(mA) Figure 6. Typical IOL Vs. VOL (standard drive strength) (VDD = 3 V) MC9S08PT60 Series Data Sheet, Rev. 5, 06/2015 12 Freescale Semiconductor, Inc. Nonswitching electrical specifications VOL(V) IOL(mA) Figure 7. Typical IOL Vs. VOL (high drive strength) (VDD = 5 V) VOL(V) IOL(mA) Figure 8. Typical IOL Vs. VOL (high drive strength) (VDD = 3 V) MC9S08PT60 Series Data Sheet, Rev. 5, 06/2015 Freescale Semiconductor, Inc. 13 Nonswitching electrical specifications 5.1.2 Supply current characteristics This section includes information about power supply current in various operating modes. Table 4. Supply current characteristics Num C Parameter Symbol Bus Freq VDD (V) Typical1 Max Unit Temp 1 C Run supply current FEI mode, all modules on; run from flash RIDD 20 MHz 5 12.6 — mA -40 to 105 °C 10 MHz 7.2 — 1 MHz 2.4 — 9.6 — mA -40 to 105 °C mA -40 to 105 °C mA -40 to 105 °C mA -40 to 105 °C µA -40 to 105 °C C 2 C 20 MHz C 10 MHz 6.1 — 1 MHz 2.1 — 10.5 — 10 MHz 6.2 — 1 MHz 2.3 — 7.4 — C C 3 10 MHz 5.0 — 1 MHz 2.0 — P Run supply current FBE mode, all modules on; run from RAM RIDD 20 MHz 3 12.1 14.8 10 MHz 5 6.5 — 1 MHz 1.8 — 9.1 11.8 P 20 MHz C 10 MHz 5.5 — 1 MHz 1.5 — 9.8 12.3 5.4 — P Run supply current FBE mode, all modules off & gated; run from RAM RIDD 20 MHz 1.6 — 6.9 9.2 10 MHz 4.4 — 1 MHz 1.4 — 7.8 — 10 MHz 4.5 — 1 MHz 1.3 — 5.1 — 10 MHz 3.5 — 1 MHz 1.2 — 20 MHz C Wait mode current FEI mode, all modules on C 5 1 MHz P C 3 10 MHz WIDD C 7 5 C C 6 20 MHz 20 MHz C 5 RIDD C C 4 Run supply current FEI mode, all modules off & gated; run from flash 3 20 MHz 20 MHz S3IDD C Stop3 mode supply current no clocks active (except 1 kHz LPO clock)2, 3 C ADC adder to stop3 — 3 5 3 — 5 3.8 — — 3 3 — — 5 44 — -40 to 105 °C µA -40 to 105 °C Table continues on the next page... MC9S08PT60 Series Data Sheet, Rev. 5, 06/2015 14 Freescale Semiconductor, Inc. Nonswitching electrical specifications Table 4. Supply current characteristics (continued) Num C Parameter C ADLPC = 1 Symbol Bus Freq VDD (V) Typical1 Max 3 40 — 5 111 — 3 110 — 5 130 — 3 125 — Unit Temp µA -40 to 105 °C µA -40 to 105 °C ADLSMP = 1 ADCO = 1 MODE = 10B ADICLK = 11B 8 C TSI adder to stop34 C PS = 010B — — NSCN =0x0F EXTCHRG = 0 REFCHRG = 0 DVOLT = 01B 9 C LVD adder to stop35 — C 1. 2. 3. 4. 5. — Data in Typical column was characterized at 5.0 V, 25 °C or is typical recommended value. RTC adder cause
MC9S08PT60AVLH 价格&库存

很抱歉,暂时无法提供与“MC9S08PT60AVLH”相匹配的价格&库存,您可以联系我们找货

免费人工找货