Freescale Semiconductor
Technical Data
Document Number: MC33880
Rev. 8.0, 5/2012
Configurable Octal Serial Switch
with Serial Peripheral Interface
I/O
33880
The 33880 device is an 8-output hardware configurable high side/
low side switch with 8-bit serial input control using the serial peripheral
interface (SPI). Two of the outputs can be controlled directly via
microcontroller for pulse-width modulation (PWM) applications.
The 33880 controls various inductive or incandescent loads by
directly interfacing with a microcontroller.
The circuit's innovative monitoring and protection features include
very low standby currents, “cascadable” fault reporting, internal 40 V
output clamping for low side configurations, internal -20 V output
clamping for high side configurations, output specific diagnostics, and
independent shutdown of outputs.
HIGH/LOW SIDE SWITCH
EG SUFFIX (PB-FREE)
98ASB42345B
28-PIN SOICW
Features
• Designed to operate 5.5 V < VPWR < 24.5 V
• 8-bit SPI for control and fault reporting, 3.3/ 5.0 V compatible
• Outputs are current limited (0.8 A to 2.0 A) to drive incandescent
lamps
• Output voltage clamp is +45 V (typical) (low side drive) and -20 V
(typical) (high side drive) during inductive switching
• Internal reverse battery protection on VPWR
• Loss of ground or supply will not energize loads or damage IC
• Maximum 5.0 μA IPWR standby current at 13 V VPWR up to 95 °C
• RDS(ON) of 0.55 Ω at 25 °C typical
• Short circuit detect and current limit with autoretry
• Independent over-temperature protection
• 32-pin SOICW has pins 8, 9, 24, and 25 grounded for thermal
performance
V PWR
5.0 V
VDD
5.0 V
EN
MCU
SPI I/O
PWM
ORDERING INFORMATION
Device
(For Tape and Reel, add
an R2 Suffix)
MC33880PEG
MC33880PEW
VS
33880
VPWR
CS
SCLK
DI
DO
IN5
IN6
GND
D1
D2
D3
D4
D5
D6
D7
D8
S1
S2
S3
S4
S5
S6
S7
S8
High-Side
MOT
H-Bridge
Low-Side
All Output Switches are High- or Low-Side Configurable
Figure 1. 33880 Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications,
as may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2009-2012. All rights reserved.
EW SUFFIX (PB-FREE)
98ARH99137A
32-PIN SOICW
Temperature
Range (TA)
-40°C to 125°C
Package
28 SOICW
32 SOICW
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VDD
__
CS
VPWR
~50 μA
Internal
Bias
SCLK
Overvoltage
Shutdown/POR
Sleep State
Charge
Pump
DI
GND
DO
OV, POR, SLEEP
EN
~50 μA
SPI and
Interface
Logic
Typical of All 8 Output Drivers
TLIM
SPI Bit 0
IN5
~50 μA
IN6
Enable
Gate
Drive
Control
SPI Bit 4
Current
Limit
IN5
+
–
~50 μA
+
–
Open/Short Comparator
Open
Load
Detect
Current
~650 μA
+
S1
S2
S3
S4
S7
S8
_
~1.5 V Open/Short Threshold
TLIM
Open
Load
Detect
Current
~650 μA
Gate
Drive
Control
D1
D2
D3
D4
D7
D8
Drain
Outputs
Source
Outputs
D5
D6
Drain
Outputs
S5
Source
Outputs
Current
Limit
+
–
+
–
Open/Short Comparator
S6
+ _
~1.5 V Open/Short Threshold
Figure 2. 33880 Simplified Internal Block Diagram
33880
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
GND
VDD
S8
S8
D8
S2
D2
S1
D1
D6
S6
IN6
EN
SCLK
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
DO
VPWR
S7
S7
D7
S4
D4
S3
D3
D5
S5
IN5
CS
DI
Figure 3. 28-Pin Connections
Table 1. SOICW 28-Pin Definitions
Pin
Number
Pin Name
1
GND
Digital ground.
2
VDD
Logic supply voltage. Logic supply must be switched off for low current mode (VDD below 3.9 V).
3, 4
S8
Output 8 MOSFET source pins.
5
D8
Output 8 MOSFET drain pin.
6
S2
Output 2 MOSFET source pin.
7
D2
Output 2 MOSFET drain pin.
8
S1
Output 1 MOSFET source pin.
9
D1
Output 1 MOSFET drain pin.
10
D6
Output 6 MOSFET drain pin.
11
S6
Output 6 MOSFET source pin.
12
IN6
PWM direct control input pin for output 6. IN6 is “OR” with SPI bit.
13
EN
Enable input. Allows control of outputs. Active high.
14
SCLK
15
DI
SPI control data input pin from MCU to the 33880. Logic [1] activates output.
16
CS
SPI control chip select input pin from MCU to the 33880. Logic [0] allows data to be transferred in.
17
IN5
PWM direct control input pin for output 5. IN5 is “OR” with SPI bit.
18
S5
Output 5 MOSFET source pin.
19
D5
Output 5 MOSFET drain pin.
20
D3
Output 3 MOSFET drain pin.
21
S3
Output 3 MOSFET source pin.
22
D4
Output 4 MOSFET drain pin.
23
S4
Output 4 MOSFET source pin.
24
D7
Output 7 MOSFET drain pin.
25, 26
S7
Output 7 MOSFET source pins.
27
VPWR
28
DO
Definition
SPI control clock input pin.
Power supply pin to the 33880. VPWR has internal reverse battery protection.
SPI control data output pin from the 33880 to the MCU. DO = 0 no fault, DO = 1 specific output has fault.
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PIN CONNECTIONS
GND
VDD
S8
S8
D8
S2
D2
TGND
TGND
S1
D1
D6
S6
IN6
EN
SCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
DO
VPWR
S7
S7
D7
S4
D4
TGND
TGND
S3
D3
D5
S5
IN5
CS
DI
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Figure 4. 32-Pin Connections
Table 2. SOICW 32-Pin Definitions
Pin
Number
Pin Name
1
GND
Digital ground.
2
VDD
Logic supply voltage. Logic supply must be switched off for low current mode (VDD below 3.9 V).
3, 4
S8
Output 8 MOSFET source pins.
5
D8
Output 8 MOSFETdrain pin.
6
S2
Output 2 MOSFET source pin.
7
D2
Output 2 MOSFET drain pin.
8, 9, 24, 25
TGND
10
S1
Output 1 MOSFET source pin.
11
D1
Output 1 MOSFET drain pin.
12
D6
Output 6 MOSFETdrain pin.
13
S6
Output 6 MOSFET source pin.
14
IN6
PWM direct control input pin for output 6. IN6 is “OR” with SPI bit.
15
EN
Enable input. Allows control of outputs. Active high.
16
SCLK
17
DI
SPI control data input pin from MCU to the 33880. Logic [1] activates output.
18
CS
SPI control chip select input pin from MCU to the 33880. Logic [0] allows data to be transferred in.
19
IN5
PWM direct control input pin for output 5. IN5 is “OR” with SPI bit.
20
S5
Output 5 MOSFET source pin.
21
D5
Output 5 MOSFET drain pin.
22
D3
Output 3 MOSFET drain pin.
23
S3
Output 3 MOSFET source pin.
26
D4
Output 4 MOSFET drain pin.
27
S4
Output 4 MOSFET source pin.
Definition
Thermal Ground pins are connected internally to the substrate of the die and are used for heat transfer.
Connect thermal ground pins to the PCB ground and ground plane for heat sinking.
SPI control clock input pin.
28
D7
Output 7 MOSFET drain pin.
29, 30
S7
Output 7 MOSFET source pins.
31
VPWR
32
DO
Power supply pin to the 33880. VPWR has internal reverse battery protection.
SPI control data output pin from the 33880 to the MCU. DO = 0 no fault, DO = 1 specific output has fault.
33880
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
VDD Supply Voltage
(1)
CS, DI, DO, SCLK, IN5, IN6, and EN (1)
VPWR Supply Voltage (1)
Symbol
Value
Unit
VDD
-0.3 to 7.0
VDC
–
-0.3 to 7.0
VDC
VPWR
-16 to 50
VDC
–
Drain 1 – 8 (2)
5.0 mA ≤ IOUT ≤ 0.3 A
VDC
-18 to 40
–
Source 1 – 8 (3)
5.0 mA ≤ IOUT ≤ 0.3 A
VDC
-28 to 40
Output Voltage Clamp Low-Side Drive (4)
VOC
40 to 55
VDC
Output Voltage Clamp High-Side Drive (4)
VOC
-15 to -25
VDC
ECLAMP
50
mJ
Human Body Model
VESD1
±2000
Machine Model
VESD2
±200
Storage Temperature
Output Clamp Energy (5)
V
ESD Voltage (6)
TSTG
-55 to 150
°C
Operating Case Temperature
TC
-40 to 125
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Maximum Junction Temperature
–
-40 to 150
°C
Power Dissipation (TA = 25°C)
(7)
PD
W
28 SOIC, Case 751F-05
1.3
32 SOIC, Case 1324-02
1.7
Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05
RθJA
94
°C/W
Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02
RθJA
70
°C/W
Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02
Peak Package Reflow Temperature During Reflow (8), (9)
Notes
1.
2.
3.
4.
5.
6.
7.
8.
9.
RθJL
18
TPPRT
Note 9
°C
Exceeding these limits may cause malfunction or permanent damage to the device.
Configured as low-side driver with 300 mA load as current limit.
Configured as high-side driver with 300 mA load as current limit.
With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver.
Maximum output clamp energy capability at 150°C junction temperature using single non-repetitive pulse method.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), and ESD2 testing is performed
in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
Maximum power dissipation with no heatsink used.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics
Characteristics noted under conditions 4.75 V ≤ VDD ≤ 5.25 V, 9.0 V ≤ VPWR ≤ 16 V, -40°C ≤ TC ≤ 125°C unless otherwise
noted. Typical values, where applicable, reflect the parameter’s approximate average value with VPWR = 13 V, TA = 25°C.
Characteristic
Symbol
Min
Typ
Max
Unit
5.5
–
24.5
–
8.0
14
Temperature = -40°C to 95°C
–
2.0
5.0
Temperature = 95°C to 125°C
–
5.0
20
VOV
25
27
30
V
VOV(HYS)
0.15
0.8
2.5
V
Logic Supply Voltage
VDD
4.75
–
5.25
V
Logic Supply Current
IDD
0.5
2.6
4.0
mA
VDD(UNVOL)
3.9
4.3
4.7
V
VDD(UNVOL-HYS)
100
150
300
mV
POWER INPUT
Supply Voltage Range
VPWR(FO)
Fully Operational
Supply Current
IPWR(ON)
Sleep State Supply Current (VDD and EN = 0 V, VPWR = 16 V)
IPWR(SS)
Overvoltage Shutdown
Overvoltage Shutdown Hysteresis
Logic Supply Undervoltage Lockout Threshold
Logic Supply Undervoltage Hysteresis
V
mA
μA
POWER OUTPUT
Drain-to-Source ON Resistance (VPWR = 16 V)
Ω
RDS(ON)
IOUT = 0.25 A, TJ = 125°C
–
0.75
1.1
IOUT = 0.25 A, TJ = 25°C
–
0.55
0.85
IOUT = 0.25 A, TJ = -40°C
–
0.45
0.80
Output Self-Limiting Current High-Side and Low-Side Configurations
IOUT(LIM)
VPWR = 16 V
Output Fault Detect Threshold (10), (11)
0.8
1.4
2.0
1.0
–
3.0
0.30
0.55
1.0
40
45
55
-15
-20
-25
–
1.0
7.0
TLIM
155
–
185
°C
TLIM(HYST)
5.0
10
15
°C
VOUTth(F)
Outputs Programmed OFF
Output Off Open Load Detect Current (10)
Overtemperature Shutdown Hysteresis (11)
V
μA
IOUT(LKG)
VDD = 0 V, VDS = 16 V
Overtemperature Shutdown (11)
V
VOC(HSD)
IS = -30 mA
Output Leakage Current High-Side and Low-Side Configuration
mA
VOC(LSD)
ID = 10 mA
Output Clamp Voltage High-Side Drive
V
IOCO
Outputs Programmed OFF
Output Clamp Voltage Low-Side Drive
A
Notes
10. Output Fault Detect Thresholds with outputs programmed OFF. Output fault detect threshold are the same for output open and shorts.
11. This parameter is guaranteed by design but is not production tested.
33880
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.75 V ≤ VDD ≤ 5.25 V, 9.0 V ≤ VPWR ≤ 16 V, -40°C ≤ TC ≤ 125°C unless otherwise
noted. Typical values, where applicable, reflect the parameter’s approximate average value with VPWR = 13 V, TA = 25°C.
Characteristic
Symbol
Min
Typ
Max
Unit
VINLOGIC
0.8
–
2.2
V
DIGITAL INTERFACE
Input Logic Voltage Thresholds (12)
IN5, IN6, and EN Input Logic Current
μA
IIN5, IN6, EN
-10
–
10
30
45
100
-10
–
10
-10
–
10
-30
–
-100
VDD - 0.8
–
VDD
–
–
0.4
–
–
20
IN5, IN6, EN = 0 V
IN5, IN6, and EN Pull-Down Current
μA
IIN5, IN6, EN
0.8 V to VDD
SCLK, DI, and Tri-State DO Input
μA
ISCK, SI, TriSO
0 V to VDD
CS Input Current
μA
IICS
CS = VDD
CS Pull-Up Current
μA
IICS
CS = 0 V
DO High-State Output Voltage
VDOHIGH
IDO-HIGH = -200 μA
DO Low-State Output Voltage
V
VDOLOW
IDO-HIGH = 1.6 mA
Input Capacitance on SCLK, DI, Tri-State DO, IN5, IN6, EN (13)
CIN
V
pF
Notes
12. Upper and lower logic threshold voltage levels apply to DI, CS, SCLK, IN5, IN6, and EN.
13. This parameter is guaranteed by design but is not production tested.
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics
Characteristics noted under conditions 4.75 V ≤ VDD ≤ 5.25 V, 9.0 V ≤ VPWR ≤ 16 V, -40°C ≤ TC ≤ 125°C unless otherwise
noted. Typical values, where applicable, reflect the parameter’s approximate average value with VPWR = 13 V, TA = 25°C.
Characteristic
Symbol
Min
Typ
Max
0.1
0.5
1.2
0.1
0.5
1.2
Unit
POWER OUTPUT TIMING
Output Slew Rate Low-Side Configuration (14)
tR
RL = 620 Ω
Output Slew Rate Low-Side Configuration (14)
tF
RL = 620 Ω
Output Slew Rate High-Side Configuration (14)
(14)
V/μs
0.1
0.3
1.2
0.1
0.3
1.2
tDLY(ON)
1.0
15
50
μs
tDLY(OFF)
1.0
30
100
μs
tFAULT
100
–
300
μs
–
–
4.0
6.0
MHz
–
4.0
10
tF
RL = 620 Ω
Output Turn ON Delay Time, High-Side and Low-Side Configuration (15)
Output Turn OFF Delay Time, High-Side and Low-Side Configuration
Output Fault Delay Time
V/μs
tR
RL = 620 Ω
Output Slew Rate High-Side Configuration
V/μs
(16)
(15)
V/μs
DIGITAL INTERFACE TIMING
Recommended Frequency of SPI Operation
Required Low State Duration on VDD for Reset
(17)
μs
tRESET
VDD ≤ 0.2 V
Falling Edge of CS to Rising Edge of SCLK (Required Setup Time)
tLEAD
100
–
–
ns
Falling Edge of SCLK to Rising Edge of CS (Required Setup Time)
tLAG
50
–
–
ns
DI to Falling Edge of SCLK (Required Setup Time)
tDI(su)
16
–
–
ns
Falling Edge of SCLK to DI (Required Hold Time)
tDI(HOLD)
20
–
–
ns
tR(DI)
–
5.0
–
ns
DI, CS, SCLK Signal Rise Time
DI, CS, SCLK Signal Fall Time
(18)
(18)
tF(DI)
–
5.0
–
ns
(19)
tDO(EN)
–
–
60
ns
Time from Rising Edge of CS to DO High Impedance (20)
tDO(DIS)
–
–
60
ns
tVALID
–
25
60
ns
Time from Falling Edge of CS to DO Low Impedance
Time from Rising Edge of SCLK to DO Data Valid (21)
Notes
14.
15.
16.
17.
18.
19.
20.
21.
Output Rise and Fall time respectively measured across a 620 Ω resistive load at 10 to 90 percent and 90 to 10 percent voltage points.
Output turn ON and OFF delay time measured from 50 percent rising edge of CS to 90 and 10 percent of initial voltage.
Duration of fault before fault bit is set. Duration between access times must be greater than 300 μs to read faults.
This parameter is guaranteed by design but is not production tested.
Rise and Fall time of incoming DI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing.
Time required for output status data to be available for use at DO pin.
Time required for output status data to be terminated at DO pin
Time required to obtain valid data out from DO following the rise of SCLK.
33880
8
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
CS
0.2 VDD
tLEAD
tLAG
0.7 VDD
SCLK
0.2 VDD
tDI(SU) tDI(HOLD)
0.7 VDD
0.2 VDD
DI
MSB in
tDO(EN)
tVALID
0.7 VDD
0.2 VDD
DO
tDO(DIS)
MSB out
LSB out
Figure 5. SPI Timing Diagram
VDD = 5.0 V
VDD = 5.0 V
VPWR = 13 V
33880
SCLK
DO
Under
Test
CL = 200 pF
CS
33880
Under
Test
RL = 620 Ω
Output
CL
NOTE: CL represents the total capacitance of the test
fixture and probe.
Figure 6. Valid Data Delay Time
and Valid Time Test Circuit
NOTE: CL represents the total capacitance of the test
fixture and probe.
Figure 8. Switching Time Test Circuit
VDD = 5.0 V
VPull-Up = 2.5 V
33880
CS
Under
Test
RL = 1.0 kΩ
DO
CL = 200 pF
NOTE: CL represents the total capacitance of the test
fixture and probe.
Figure 7. Enable and Disable Time Test Circuit
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
tR(DI)
< 50 ns
0.7 VDD (2.5 V)
50%
0.2 VDD
0.7 VDD
0.2 VDD
(Low-to-High)
tVALID
tr(DO)
tDLY(HL)
DO
(Tri-State to Low)
90%
10%
tDO(EN)
0.2 VDD
tSO(DIS)
tDO(DIS)
VOH
90%
VOH
0.7 VDD
0
tDO(DIS)
VTri-State
tDO(EN)
VOH
5.0 V
0.7 VDD
10%
0.2 VDD (2.5 V)
0
VOL
DO
(High-to-Low)
< 50 ns
90%
CS
5.0 V
tDLY(LH)
tF(DI)
< 50 ns
< 50 ns
SCLK
DO
tR(DI)
tF(DI)
DO
(Tri-State to High)
VOL
VTri-State
10%
Figure 10. Enable and Disable Time Waveforms
Figure 9. Valid Data Delay Time and Valid Time
Waveforms
tR(DI)
tF(DI)
< 50 ns
< 50 ns
90%
CS
0.2 VDD (2.5 V)
10%
0
tDO(EN)
DO
(Tri-State to Low)
5.0 V
0.7 VDD
tDO(DIS)
VTri-State
90%
10% t
SO(DIS)
tDO(EN)
tDO(DIS)
VOH
90%
DO
10%
VTri-State
(Tri-State to High)
Figure 11. Turn-ON/OFF Waveforms
33880
10
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TYPICAL ELECTRICAL CHARACTERISTICS
14
VPWR @ 16 V
12
10
All Outputs ON
8
All Outputs OFF
6
4
2
-40 -25
0
25
50
75
100
125
IPWR
IPWR
Current
Current
into
into
VPWR
VPWR
Pin
Pin
(μA)
(uA)
IPWR Current into VPWR Pin (mA)
TYPICAL ELECTRICAL CHARACTERISTICS
14
14
12
12
10
10
8
8
6
6
4
4
2
2
VPWR @ 16 V
-40 -25
-40 -25
TA, Ambient Temperature (°C)
70
125
125
1.4
TA = 25°C
VPWR @ 16 V
60
1.2
50
1.0
RDS(ON) (Ω)
IPWR Current into VPWR Pin (μA)
25
50
75 100
25
50
75
100
TA, Ambient Temperature
TA, Ambient Temperature (°C)
Figure 13. Sleep State IPWR vs. Temperature
Figure 12. IPWR vs. Temperature
40
30
20
10
0.8
0.6
0.4
0.2
0
5.0
10
15
20
25
-40 -25
0
25
50
75
100
125
TA, Ambient Temperature (°C)
VPWR
Figure 14. Sleep State IPWR vs. VPWR
Figure 15. RDS(ON) vs. Temperature @ 250 mA
1.4
1.6
VPWR @ 16 V
VPWR @ 16 V
IOUT(LIM), Current Limit (A)
1.2
RDS(ON) (Ω)
0
0
1.0
0.8
0.6
0.4
0.2
0
5.0
10
15
20
VPWR (V)
Figure 16. RDS(ON) vs. VPWR @ 250 mA
25
1.5
1.4
1.3
1.2
1.1
1.0
-40 -25
0
25
50
75
100
125
TA, Ambient Temperature (°C)
Figure 17. Current Limit IOUT(LIM) vs. Temperature
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
ELECTRICAL CHARACTERISTICS
TYPICAL ELECTRICAL CHARACTERISTICS
1.2
1.4
VPWR @ 16 V
High-Side Configuration
TA = 25°C
IOCO Open Load (mA)
IOCO, Open Load (mA)
1.4
1.0
0.8
0.6
0.4
0.2
-40 -25
0
25
50
75
100
1.2
1.0
0.8
0.6
0.4
0.2
0
125
5.0
10
TA, Ambient Temperature (°C)
20
25
VPWR (V)
Figure 19. Open Load Detect Current vs. VPWR
Figure 18. Open Load Detect Current vs. Temperature
IOUT(LKG), Leakage Current (μA)
15
1.4
TA = 25°C
1.2
1.0
0.8
0.6
0.4
0.2
0
5.0
10
15
20
25
VPWR (V)
Figure 20. Sleep State Output Leakage vs. VPWR
33880
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 33880 is an eight-output hardware configurable power
switch with 8-bit serial control. The 33880 incorporates
SMARTMOS™ 5 technology with CMOS logic, bipolar/MOS
analog circuitry, and independent double diffused DMOS
power output transistors. Many benefits are realized as a
direct result of using this mixed technology. A simplified
internal block diagram of the 33880 is shown in Figure 2,
page 2.
The 33880 device uses high-efficiency updrain power
DMOS output transistors exhibiting low drain-to-source ON
resistance values (RDS(ON) ≤ 0.55 Ω at 25°C) and dense
CMOS control logic. All outputs have independent voltage
clamps to provide fast inductive turn-off and transient
protection. Operational bias currents of less than 4.0 mA on
VDD and 12 mA on VPWR with any combination of outputs ON
are a direct result of using SMARTMOS™ 5 technology.
FUNCTIONAL PIN DESCRIPTION
CHIP SELECT (CS)
The system MCU selects the 33880 to communicate
through the use of the CS pin. Whenever the pin is in a logic
low state, data can be transferred from the MCU to the 33880
device and vice versa. Clocked-in data from the MCU is
transferred from the 33880 shift register and latched into the
power outputs on the rising edge of the CS signal. On the
falling edge of the CS signal, output status information is
transferred from the power outputs status register into the
device's shift register. The falling edge of CS enables the DO
output driver. Whenever the CS pin goes to a logic low state,
the DO pin output is enabled, thereby allowing information to
be transferred from the 33880 to the MCU. To avoid any
spurious data, it is essential the high-to-low transition of the
CS signal occurs only when SCLK is in a logic low state.
SYSTEM CLOCK (SCLK)
The system clock pin (SCLK) clocks the internal shift
registers of the 33880. The serial data input (DI) is latched
into the input shift register on the falling edge of the SCLK.
The serial data output pin (DO) shifts data out of the shift
register on the rising edge of the SCLK signal. False clocking
of the shift register must be avoided to guarantee validity of
data. It is essential the SCLK pin be in a logic low state
whenever chip select pin (CS) makes any transition. For this
reason, it is recommended the SCLK pin is commanded to a
logic low state when the device is not accessed (CS in logic
high state). When the CS is in a logic high state, any signal at
the SCLK and DI pin is ignored and the DO is tri-stated (high
impedance).
the DI pin beginning with Output 8, followed by Output 7,
Output 6, and so on to Output 1. For each falling edge of the
SCLK while CS is logic low, a data bit instruction (on or off) is
loaded into the shift register per the data bit DI state. Eight
bits of entered information fills the shift register. To preserve
data integrity, do not transition DI as SCLK transitions from a
high to low logic state.
DATA OUTPUT (DO)
The serial data output (DO) pin is the output from the shift
register. The DO pin remains tri-state until the CS pin goes to
a logic low state. All faults on the 33880 device are reported
as logic [1] through the DO data pin. Regardless of the
configuration of the driver, open loads and shorted loads are
reported as logic [1]. Conversely, normal operating outputs
with non-faulted loads are reported as logic [0]. The first
positive transition of SCLK will make output eight status
available on DO pin. Each successive positive clock will
make the next output status available. The DI/DO shifting of
data follows a first-in-first-out protocol with both input and
output words transferring the most significant bit (MSB) first.
ENABLE (EN)
The EN pin on the 33880 device either enables or disables
the internal charge pump. The EN pin must be high for this
device to enhance the gates of the output drivers, perform
fault detection, and reporting. Active outputs during a low
transition of the EN pin will become active again when the EN
transitions high. If this feature is not required, it is
recommended the EN pin be connected to VDD.
DATA INPUT (DI)
COMMAND INPUT (IN5 AND IN6)
This pin is used for serial instruction data input. DI
information is latched into the input register on the falling
edge of SCLK. A logic high state present on DI will program
a specific output on. The specific output will turn on with the
rising edge of the CS signal. Conversely, a logic low state
present on the DI pin will program the output off. The specific
output will turn off with the rising edge of the CS signal. To
program the eight outputs of the 33880 device on or off, enter
The IN5 and IN6 pins command inputs allowing outputs
five and six to be used in PWM applications. IN5 and IN6 pins
are ORed with the SPI communication input. For SPI control
of outputs five and six, the IN5 and IN6 pins should be
grounded or held low by the microprocessor. In the same
manner, when using the PWM feature the SPI port must
command the outputs off. Maximum PWM frequency for each
output is 2.0 kHz.
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
FUNCTIONAL DESCRIPTION
LOGIC POWER (VDD)
The VDD pin supplies logic power to the 33880 device and
is used for power-on reset (POR). To achieve low standby
current on VPWR supply, power must be removed from the
VDD pin. The device will be in reset with all drivers off when
VDD is below 3.9 VDC.
OPEN DRAIN OUTPUT (D1 – D8)
The D1 – D8 pins are the open drain outputs of the 33880.
For High-Side Drive configurations, the drain pins are
connected to battery supply. In Low-Side Drive
configurations, the drain pins are connected to the low side of
the load. All outputs may be configured individually as
desired. When Low-Side Drive is used, the 33880 limits the
positive transient for inductive loads to 45 V.
SOURCE OUTPUT (S1 – S8)
The S1 – S8 pins are the source outputs of the 33880. For
High-Side Drive configurations, the source pins are
connected directly to the load. In Low-Side Drive
configurations the source is connected to ground. All outputs
may be configured individually as desired. When High-Side
drive is used, the 33880 will limit the negative transient for
inductive loads to -20 V.
33880
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
MCU INTERFACE DESCRIPTION
In operation, the 33880 functions as an eight-output serial
switch serving as a microcontroller (MCU) bus expander and
buffer, with fault management and fault reporting features. In
doing so, the device directly relieves the MCU of the fault
management functions. This device directly interfaces to an
MCU using a Serial Peripheral Interface (SPI) for control and
diagnostic readout. Figure 21 and Figure 24, page 16,
illustrate the basic SPI configuration between an MCU and
one 33880.
MC68HCxx
Microcontroller
33880
Master In Slave Out (MISO) line. On rising edge of CS data
stored in the input register is then transferred to the output
driver.
SCLK
Parallel Port
MC68xx
MCU
with
SPI
Interface
DO
DI
MOSI
Shift Register
DI
DO
DI
CS SCLK
DO
DI
33880
33880
33880
8 Outputs
8 Outputs
8 Outputs
MOSI
Shift Register
MISO
CS SCLK
CS
MISO
DO
Figure 22. 33880 SPI System Daisy Chain
SCLK
Receive
Buffer
Parallel
Ports
To
Logic
CS
Multiple 33880 devices can be controlled in a parallel input
fashion using the SPI. Figure 23 illustrates 24 loads being
controlled by three dedicated parallel MCU ports used for
chip select.
MOSI
SCLK
Figure 21. SPI Interface with Microcontroller
All inputs are compatible with 5.0 V and 3.3 V CMOS logic
levels and incorporate positive logic. Whenever an input is
programmed to a logic low state (2.2 V), the output being
controlled will be ON. Diagnostics are treated in a similar
manner. Outputs with a fault will feedback (via DO) to the
microcontroller as a logic [1] while normal operating outputs
will provide a logic [0].
Figure 22 illustrates the Daisy Chain configuration using
the 33880. Data from the MCU is clocked daisy chain through
each device while the Chip Select (CS) bit is commanded low
by the MCU. During each clock cycle output status from the
daisy chain, the 33880 is being transferred to the MCU via the
MISO
DI
SCLK
DO
8 Outputs
CS
MC68xx
Microcontroller
SPI
DI
SCLK
DO
8 Outputs
CS
Parallel
Ports
A
B
C
DI
SCLK
DO
8 Outputs
CS
Figure 23. Parallel Input SPI Control
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
Figure 24. Data Transfer Timing
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
33880
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
POWER CONSUMPTION
The 33880 device has been designed with one sleep and
one operational mode. In the sleep mode (VDD ≤ 2.0 V), the
current consumed by the VPWR pin is less than 25 μA. To
place the 33880 in the sleep mode, turn all outputs off, then
remove power from VDD and the EN (enable) input pin. Prior
to removing power from the device, it is recommended all
control inputs from the microcontroller are low. During normal
operation, 4.0 mA will be drawn from the VDD supply and
12 mA from the VPWR supply.
PARALLELING OF OUTPUTS
sent. Please note that the second byte the MCU sends to the
device is the command byte and will be transferred to the
outputs with rising edge of CS.
OVERTEMPERATURE FAULT
Overtemperature detect and shutdown circuits are
specifically incorporated for each individual output. The
shutdown following an overtemperature condition is
independent of the system clock or any other logic signal.
Each independent output shuts down at 155°C to 185°C.
When an output shuts down due to an overtemperature fault,
no other outputs are affected. The MCU recognizes the fault
by a one in the fault status register. After the 33880 device
has cooled below the switch point temperature and 15°C
hysteresis, the output will activate unless told otherwise by
the MCU via SPI to shut down.
Using MOSFETs as output switches allows the connection
of any combination of outputs together. RDS(ON) of MOSFETs
have an inherent positive temperature coefficient, providing
balanced current sharing between outputs without
destructive operation. The device can even be operated with
all outputs tied together. This mode of operation may be
desirable in the event the application requires lower power
dissipation or the added capability of switching higher
currents. Performance of parallel operation results in a
corresponding decrease in RDS(ON) while the outputs OFF
open load detect currents and the output current limits
increase correspondingly (by a factor of eight if all outputs are
paralleled). Paralleling outputs from two or more different IC
devices are possible but not recommended.
An overvoltage condition on the VPWR pin will cause the
device to shut down all outputs until the overvoltage condition
is removed. When the overvoltage condition is removed, the
outputs will resume their previous state. This device does not
detect an overvoltage on the VDD pin. The overvoltage
threshold on the VPWR pin is specified as 25 V to 30 V with
1.0 V typical hysteresis. A VPWR overvoltage detect is
global, causing all outputs to be turned OFF.
FAULT LOGIC OPERATION
OUTPUT OFF OPEN LOAD FAULT
Fault logic of the 33880 device has been greatly simplified
over other devices using SPI communications. As command
word one is being written into the shift register, a fault status
word is being simultaneously written out and received by the
MCU. Regardless of the configuration, with no outputs
faulted, all status bits being received by the MCU will be zero.
When outputs are faulted (off state open circuit or on state
short circuit / overtemperature), the status bits being received
by the MCU will be one. The distinction between open circuit
fault and short circuit / overtemperature is completed via the
command word. For example, when a zero command bit is
sent and a one fault is received in the following word, the fault
is open / short-to-battery for high-side drive or open / short to
ground for low-side drive. In the same manner, when a one
command bit is sent and a one fault is received in the
following word the fault is a short-to-ground / overtemperature
for high-side drive or short-to-battery / overtemperature for
low-side drive. The timing between two write words must be
greater than 300 μs to allow adequate time to sense and
report the proper fault status.
An output OFF open load fault is the detection and
reporting of an open load when the corresponding output is
disabled (input bit programmed to a logic low state). The
output OFF open load fault is detected by comparing the
drain-to-source voltage of the specific MOSFET output to an
internally generated reference. Each output has one
dedicated comparator for this purpose.
An output off open load fault is indicated when the drainto-source voltage is less than the output threshold voltage
(VTHRES) of 1.0 V to 3.0 V. Hence, the 33880 will declare the
load open in the OFF state when the VDS is less than 1.0 V.
This device has an internal 650 μA current source
connected from drain to source of the output MOSFET. This
prevents either configuration of the driver from having a
floating output. To achieve low sleep mode quiescent
currents, the open load detect current source of each driver
is switched off when VDD is removed.
During output switching, especially with capacitive loads,
a false output OFF open load fault may be triggered. To
prevent this false fault from being reported, an internal fault
filter of 100 μs to 300 μs is incorporated. A false fault
reporting is a function of the load impedance, RDS(ON) , COUT
of the MOSFET, as well as the supply voltage, VPWR. The
rising edge of CS triggers the built-in fault delay timer. The
timer will time out before the fault comparator is enabled and
the fault is detected. Once the condition causing the open
load fault is removed, the device will resume normal
operation. The open load fault however, will be latched in the
output DO register for the MCU to read.
SPI INTEGRITY CHECK
It is recommended that one check the integrity of the SPI
communication with the initial power-up of the VDD and EN
pins. After initial system start-up or reset, the MCU will write
one 16-bit pattern to the 33880. The first eight bits read by the
MCU will be the fault status of the outputs, while the second
eight bits will be the first byte of the bit pattern. Bus integrity
is confirmed by the MCU receiving the same bit pattern it
OVERVOLTAGE FAULT
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
SHORTED LOAD FAULT
A shorted load (overcurrent) fault can be caused by any
output being shorted directly to supply or an output causing
the device to current limit (linear short).
There are two safety circuits progressively in operation
during load short conditions providing system protection:
1. The device’s output current is monitored in an analog
fashion using SENSEFET™ approach and current
limited.
2. The device’s output thermal limit is sensed and when
attained causes only the specific faulted output to shut
down. The output will remain off until cooled. The
device will then reassert the output automatically. The
cycle will continue until the fault is remove or the
command bit instructs the output off.
Drain-to-Source Clamp
Voltage (VCL = 45 V)
Drain Voltage
Drain Current
(ID = 0.3 A)
Clamp Energy
(EJ = IA x VCL)
Drain-to-Source ON
Voltage (VDS(ON))
Current
Area (IA)
VBAT
Drain-to-Source ON
Voltage (VDS(ON))
GND
OUTPUT VOLTAGE CLAMP
Each output of the 33880 incorporates an internal voltage
clamp to provide fast turn-off and transient protection of each
output. Each clamp independently limits the drain-to-source
voltage to 45 V for low-side drive configurations and -20 V for
high-side drive configurations (see Figure 25). The total
energy clamped (EJ ) can be calculated by multiplying the
current area under the current curve (IA) times the clamp
voltage (VCL).
Characterization of the output clamps, using a single pulse
non-repetitive method at 0.3 A, indicates the maximum
energy to be 50 mJ at 150°C junction temperature per output.
Time
Current
Area (IA)
Clamp Energy
(EJ = IA x VCL)
UNDERVOLTAGE SHUTDOWN
An undervoltage VDD condition will result in the global
shutdown of all outputs. The undervoltage threshold is
between 3.9 V and 4.6 V. When VDD goes below the
threshold, all outputs are turned OFF and the Fault Status
(FS) register is cleared. As VDD returns to normal levels, the
FS register will resume normal operation.
An undervoltage condition at the VPWR pin will not cause
output shutdown and reset. When VPWR is between 5.5 V
and 9.0 V, the output will operate per the command word.
However, the status as reported by the serial data output
(DO) pin may not be accurate below 9.0 V VPWR. Proper
operation at VPWR voltages below 5.5 V cannot be
guaranteed.
Time
GND
Source Current
(IS = 0.3 A)
Source Clamp Voltage
(VCL = -20 V)
Source Voltage
Figure 25. Output Voltage Clamping
SPI CONFIGURATIONS
The SPI configuration on the 33880 device is consistent
with other devices in the OSS family. This device may be
used in serial SPI or parallel SPI with the 33291 and 33298.
Different SPI configurations may be provided. For more
information, contact Analog Products Division.
REVERSE BATTERY
The 33880 has been designed with reverse battery
protection on the VPWR pin. However, the device does not
protect the load from reverse battery. During the reverse
battery condition, current will flow through the load via the
output MOSFET substrate diode. Under this circumstance
relays may energize and lamps will turn on. If load reverse
battery protection is desired, a diode must be placed in series
with the load.
33880
18
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
LOGIC COMMANDS AND REGISTERS
On each SPI communication, an 8-bit command word is sent to the 33880 and an 8-bit fault word is received from the 33880.
The Most Significant Bit (MSB) is sent and received first (see below).
MSB
OUT8
LSB
OUT7
OUT6
OUT5
OUT4
OUT3
OUT2
OUT1
Command Register Definition:
0 = Output Command Off
1 = Output Command On
Fault Register Definition:
0 = No fault
1 = Fault.
Table 6. Fault Operation
SERIAL OUTPUT (SO) PINS REPORTS
Overtemperature
Fault reported by Serial Output (DO) pin.
Overcurrent
DO pin reports short to battery/supply or overcurrent condition.
Output ON Open Load Fault
Not reported.
Output OFF Open Load Fault
DO pin reports output OFF open load condition.
DEVICE SHUTDOWNS
Overvoltage
Total device shutdown at VPWR = 25 V to 30 V. Resumes normal operation with proper voltage.
All outputs assuming the previous state upon recovery from overvoltage.
Overtemperature
Only the output experiencing an overtemperature fault shuts down. Output assumes previous state
upon recovery from overtemperature.
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using “98ASB42345B”. Dimensions shown
are provided for reference ONLY.
EG SUFFIX (PB-FREE)
28-PIN
PLASTIC PACKAGE
98ASB42345B
REV G
33880
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
PACKAGE DIMENSIONS
PACKAGE DIMENSIONS (CONTINUED)
EG SUFFIX (PB-FREE)
28-PIN
PLASTIC PACKAGE
98ASB42345B
REV G
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
PACKAGING
PACKAGE DIMENSIONS
PACKAGE DIMENSIONS (CONTINUED)
EW SUFFIX (PB-FREE)
32-PIN
PLASTIC PACKAGE
98ASB42345B
REV B
33880
22
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
PACKAGE DIMENSIONS
PACKAGE DIMENSIONS (CONTINUED)
EW SUFFIX (PB-FREE)
32-PIN
PLASTIC PACKAGE
98ASB42345B
REV B
33880
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
REVISION HISTORY
REVISION HISTORY
REVISION
DATE
DESCRIPTION OF CHANGES
4.0
6/2006
•
•
Implemented Revision History page
Converted to Freescale format and adjusted content to prevailing form and style
5.0
6/2007
•
•
•
Removed MC33880EG/R2 and MC33880EK/R2 from the ordering information and added
MCZ33880EG/R2 and MCZ33880EW/R2.
Added Peak Package Reflow Temperature During Reflow (8), (9)
Updated data sheet to current format.
6.0
5/2008
•
Changed 32 pin SOICW, pins 8, 9, 24, 25 from GND to TGND on page 4.
7.0
1/2009
•
Corrected Notes for Peak Package Reflow in Maximum Rating Table.
8.0
5/2012
•
•
•
•
•
Removed MCZ33880EG from the ordering information and added MC33880PEG
Removed MCZ33880EW from the ordering information added MC33880PEW
Removed MC33880DW and MC33880DWB
Removed DW and DWB suffix
Updated Freescale form and style
33880
24
Analog Integrated Circuit Device Data
Freescale Semiconductor
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© 2012 Freescale Semiconductor, Inc.
Document Number: MC33880
Rev. 8.0
5/2012
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