AN1111C

□□1111C Surface Mount IRED/1608 ( t = 0.7 mm) Type Features Package Product features 1608 ( h = 0.7 mm) type, Water clear epoxy ・Outer Dimension 1.6 x 0.8 x 0.7mm ( L x W x H ) ・Small Size ・Total Output Power DNK ： 6.5mW TYP. (IF=20mA) TAN ： 4.3mW TYP. (IF=20mA) AN ： 2.0mW TYP. (IF=20mA) ・Lead–free soldering compatible ・RoHS compliant Peak Wavelength DNK TAN AN : 865nm : 940nm : 950nm : θx = 145 deg., θy =145 deg. : θx = 145 deg.,θy = 145 deg. : θx = 125 deg.,θy = 150 deg. GaAs（TAN,AN） Half Intensity Angle DNK TAN AN Die materials Rank grouping parameter Assembly method Soldering methods Taping and reel ESD-withstand voltage GaAlAs（DNK） Sorted by radiant intensity per rank taping Auto pick & place machine (Auto Mounter) Reflow soldering ※Please refer to Soldering Conditions about soldering. 4,000pcs per reel in a 8mm width tape. (Standard) Reel diameter:φ180mm 2kV (HBM) Recommended Applications Car Audio, Electric Household Appliances, OA/FA, PC/Peripheral Equipment, Other General Applications 2010.03.30 Page 1 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Color and Luminous Intensity Peak Wavelength λ ｐ (nm) (Ta=25℃) Part No. Material Lens Color Radiant Intensity IE (ｍ W/sr) TYP. DNK1111C TAN1111C AN1111C GaAlAs GaAs GaAs Water Clear 865 940 950 I F (mA) 20 20 20 MIN. 0.7 0.3 0.2 TYP. 1.4 0.6 0.28 I F (mA) 20 20 20 2010.03.30 Page 2 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Absolute Maximum Ratings Item Power Dissipation Forward Current Pulse Forward Current Derating (Ta=25℃ or higher) Reverse Voltage Operating Temperature Storage Temperature ※1 (Ta=25℃) Absolute Maximum Ratings DNK 80 50 300 0.67 4.00 5 TAN 70 50 300 0.67 4.00 5 -30～ +85 -40～ +100 AN 75 50 300 0.67 4.00 5 Symbol Pd IF IFRM ⊿ IF ⊿ IFRM VR Topr Tstg Unit mW mA mA mA/℃ mA/℃ V ℃ ℃ ※1 IFRM Measurement condition : Pulse Width≦100μs, Duty≦1/100 Electro-Optical Characteristics Item Conditions IF =20mA VR =5V IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mADC ±5mA, -3db from 0.1MHz IF =20mA Symbol (Ta=25℃) Characteristics DNK TYP. MAX. MAX. MIN. TYP. TYP. TYP. TYP. TYP. MIN. TYP. TYP. 1.40 1.65 100 0.7 1.4 6.5 865 45 TAN 1.20 1.40 10 0.3 0.6 4.3 940 50 AN 1.22 1.40 10 0.2 0.28 2 950 45 Unit Forward Voltage Reverse Current Radiant Intensity Total Output Power Peak Wavelength Spectral Half-width Half Intensity Angle VF IR IE Po λp ⊿λ 2θ1/2 V μA mW/sr mW nm nm deg. 145(θx) 145(θx) 125(θx) 145(θy) 50 7 145(θy) 1000 150(θy) 0.5 700 Cut-off Frequency Response Time fc tr/tf MHz ns ※ θx：Product long side axis,θｙ：Product short side axis 2010.03.30 Page 3 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Radiant Intensity Rank (Ta=25℃) R a nk DNK IF=20mA MIN. MAX. 1.4 2.0 2.8 4.0 5.6 0.7 1.0 1.4 2.0 2.8 IE(mW/sr) TAN IF=20mA MIN. 0.3 0.4 0.6 0.8 1.2 MAX. 0.6 0.8 1.2 1.6 2.4 AN IF=20mA MIN. 0.20 0.28 0.40 MAX. 0.40 0.56 0.80 - A B C D E ※Please contact our sales staff concerning rank designation. 2010.03.30 Page 4 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（DNK） Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Spatial Distribution Example 条件/Condition : Ta = 25℃ y 1.2 1.0 Relative Intensity x 0.8 １ 0.6 0.4 0.2 0.0 700 800 Wavelength [nm] 900 1000 Forward Voltage vs. Forward Current Condition : Ta = 25℃ Duty Ratio vs. Pulse Forward Current Condition : Ta = 25℃, tw ≦ 100μs 100 1000 Pulse Forward Current IFRM(mA) Forward Current IF(mA) 10 100 1 1.2 1.3 1.4 1.5 1.6 Forward Voltage : VF(V) 10 0.001 0.01 Duty Ratio 0.1 1 2010.03.30 Page 5 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（DNK） Power Dissipation vs. Ambient Temperature 90 80 Derating 350 300 Ambient Temperature vs. Maximum Forward Curren Pulse Width tw≦100μsec Duty=1% Maximum Forward Current : IF MAX. (mA) Power Dissipation : Pd (mW) 70 60 50 40 30 20 10 0 250 200 Duty=5% 150 100 50 0 Duty=10% Duty=20% Duty=50% DC -30 -10 10 30 50 70 90 -30 -10 10 30 50 70 90 Ambient Temperature : Ta(℃) Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Condition : IF = 20mA Pulse Forward Voltage vs. Pulse Forward Current Condition : Ta=25℃, tw≦100μs, Duty≦1/100 1.8 1000 Pulse Forward Current IFRM(mA) 1.6 Forward Voltage VF(V) 100 1.4 10 1.2 1.0 -40 -20 0 20 40 60 80 100 1 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 Ambient Temperature : Ta (℃) Pulse Forward Voltage : VFM(V) 2010.03.30 Page 6 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（DNK） Forward Current vs. Relative Total Power Condition : Ta = 25℃ Forward Current vs. Relative Total Power Condition : tw≦100μs, Duty≦1/100, Ta = 25℃ 10.0 100.0 Relative Total Power 1.0 Relative Total Power 10.0 1.0 0.1 1 10 Forward Current : IF (mA) 0.1 100 1 10 100 1000 Forward Current : IF (mA) Ambient Temperature vs. Relative Total Power Condition : IF = 20mA 10 Relative Total Power 1 0.1 -40 -20 0 20 40 60 80 100 Ambient Temperature : Ta (℃) 2010.03.30 Page 7 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（TAN） Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Spatial Distribution Example 条件/Condition : Ta = 25℃ y 1.2 1.0 Relative Intensity x 0.8 １ 0.6 0.4 0.2 0.0 700 800 900 1000 1100 Wavelength [nm] Forward Voltage vs. Forward Current Condition : Ta = 25℃ Duty Ratio vs. Pulse Forward Current Condition : Ta = 25℃, tw ≦ 100μs 100 1000 Pulse Forward Current IFRM(mA) Forward Current IF(mA) 10 100 1 1.0 1.1 1.2 1.3 Forward Voltage : VF(V) 10 0.001 0.01 Duty Ratio 0.1 1 2010.03.30 Page 8 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（TAN） Power Dissipation vs. Ambient Temperature 90 80 70 60 50 40 30 20 10 0 -30 -10 10 30 50 70 90 Maximum Forward Current : IF MAX. (mA) Derating Ambient Temperature vs. Maximum Forward Curren Pulse Width tw≦100μsec 350 Duty=1% 300 250 200 150 100 50 0 Duty=5% Duty=10% Duty=20% Duty=50% DC Power Dissipation : Pd (mW) -30 -10 10 30 50 70 90 Ambient Temperature : Ta(℃) Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Condition : IF = 20mA Pulse Forward Voltage vs. Pulse Forward Current Condition : Ta=25℃, tw≦100μs, Duty≦1/100 1.4 Pulse Forward Current IFRM(mA) 1000 1.3 Forward Voltage VF(V) 100 1.2 10 1.1 1.0 -40 -20 0 20 40 60 80 100 1 1.0 1.2 1.4 1.6 1.8 2.0 Ambient Temperature : Ta (℃) Pulse Forward Voltage : VFM(V) 2010.03.30 Page 9 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（TAN） Forward Current vs. Relative Total Power Condition : Ta = 25℃ Forward Current vs. Relative Total Power Condition : tw≦100μs, Duty≦1/100, Ta = 25℃ 10 100 10 Relative Total Power Relative Total Power 1 1 0.1 0.1 0.01 1 10 Forward Current : IF (mA) 0.01 100 1 10 100 1000 Forward Current : IF (mA) Ambient Temperature vs. Relative Total Power Condition : IF = 20mA 10 Relative Total Power 1 0.1 -40 -20 0 20 40 60 80 100 Ambient Temperature : Ta (℃) 2010.03.30 Page 10 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（AN） Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Spatial Distribution Example 条件/Condition : Ta = 25℃ y x Relative Intensity １ Wavelength [nm] Forward Voltage vs. Forward Current Condition : Ta = 25℃ Duty Ratio vs. Pulse Forward Current Condition : Ta = 25℃, tw ≦ 100μs Forward Voltage : VF(V) Pulse Forward Current IFRM(mA) Forward Current IF(mA) Duty Ratio 2010.03.30 Page 11 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（AN） Ambient Temperature vs. Forward Current Ambient Temperature vs. Pulse Forward Current Condition : tw≦100μs, Duty≦1/100 Pulse Forward Current IFRM(mA) Forward Current : IF (mA) Ambient Temperature : Ta(℃) Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Condition : IF = 20mA Pulse Forward Voltage vs. Pulse Forward Current Condition : Ta=25℃, tw≦100μs, Duty≦1/100 Ambient Temperature : Ta (℃) Pulse Forward Current IFRM(mA) Forward Voltage VF(V) Pulse Forward Voltage : VFM(V) 2010.03.30 Page 12 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Technical Data（AN） Ambient Temperature vs. Peak Wavelength Condition : IF = 20mA Forward Current vs. Relative Total Power Condition : - - Pulse, tw≦100μs, Duty≦1/100, Ta = 25℃ Peak Wavelength λp (nm) Ambient Temperature : Ta(℃) Relative Total Power Forward Current : IF (mA) Ambient Temperature vs. Relative Total Power Condition : IF = 20mA Relative Total Power Ambient Temperature : Ta (℃) 2010.03.30 Page 13 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Package Dimensions (Unit: mm) Weight: (1.40)mg Recommended Soldering Pattern (Unit: mm) Taping Specification Quantity: 4,000pcs/ reel (standard) (Unit: mm) 2010.03.30 Page 14 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Reflow Soldering Conditions 1) The above profile temperature gives the maximum temperature of the LED resin surface. Please set the temperature so as to avoid exceeding this range. 2) Total times of reflow soldering process shall be no more than 2 times. When the second reflow soldering process is performed, intervals between the first and second reflow should be short as possible (while allowing some time for the component to return to normal temperature after the first reflow) in order to prevent the LED from absorbing moisture. 3) Temperature fluctuation to the LED during the pre-heating process shall be minimized. Manual Soldering Conditions Iron tip temp. Soldering time and frequency 350 ℃ 3s 1 time (MAX.) (30 W Max.) (MAX.) (MAX.) 2010.03.30 Page 15 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Reliability Testing Result Reliability Testing Result Room Temp. Operating Life Applicable Standard EIAJ ED4701/100(101) Testing Conditions Ta = 25℃, IF = Maxium Rated Current (Pretreatment) Individual standard (Reflow Soldering) Pre-heating 150℃～180 ℃ 1 20s Operating Heating 230℃ Min. Peak temperature 260℃ Minimum Rated Storage Temperature(30min) ～Normal Temperature(15min) ～Maximum Rated Storage Temperature(30min) ～Normal Temperature(15min) Ta = 60±2 ℃, RH = 90 ±5% Ta = Maximum Rated Storage Temperature Ta = Minimum Rated Storage Temperature 98.1m/s ( 10G), 100 ～ 2 KHz sweep for 20min., XYZ each direction 2 Duration 1,000 h Failure 0/25 Resistance to Soldering Heat EIAJ ED4701/300(301) Twice 0/25 Temperature Cycling Wet High Temp. Storage Life High Temp. Storage Life Low Temp. Storage Life Vibration, Variable Frequency EIAJ ED4701/100(105) EIAJ ED4701/100(103) EIAJ ED4701/200(201) EIAJ ED4701/200(202) EIAJ ED4701/400(403) 5 cycles 0/25 1,000 h 1,000 h 1,000 h 2h 0/25 0/25 0/25 0/10 Failure Criteria Items Radiant Intensity Forward Voltage Reverse Current Symbols IE VF IR Conditions IF Value of each product Radiant Intensity IF Value of each product Forward Voltage VR = Maximum Rated Reverse Voltage V Failure criteria Testing Min. Value ＜ Initial Value x 0.5 Testing Max. Value ＞ Spec. Max. Value x 1.2 Testing Max. Value ≧ Spec. Max. Value x 2.5 2010.12.30 2010.03.30 Page 16 □□1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2010.03.30 Page 17