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ST7FLITES5Y0M6TR

ST7FLITES5Y0M6TR

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOIC16_150MIL

  • 描述:

    IC MCU 8BIT 1KB FLASH 16SO

  • 数据手册
  • 价格&库存
ST7FLITES5Y0M6TR 数据手册
ST7LITE0xY0, ST7LITESxY0 8-bit microcontroller with single voltage Flash memory, data EEPROM, ADC, timers, SPI ■ ■ ■ ■ ■ Memories – 1K or 1.5 Kbytes single voltage Flash Program memory with read-out protection, In-Circuit and In-Application Programming (ICP and IAP). 10 K write/erase cycles guaranteed, data retention: 20 years at 55 °C. – 128 bytes RAM. – 128 bytes data EEPROM with read-out protection. 300K write/erase cycles guaranteed, data retention: 20 years at 55 °C. Clock, Reset and Supply Management – 3-level low voltage supervisor (LVD) and auxiliary voltage detector (AVD) for safe poweron/off procedures – Clock sources: internal 1MHz RC 1% oscillator or external clock – PLL x4 or x8 for 4 or 8 MHz internal clock – Four Power Saving Modes: Halt, Active-Halt, Wait and Slow Interrupt Management – 10 interrupt vectors plus TRAP and RESET – 4 external interrupt lines (on 4 vectors) I/O Ports – 13 multifunctional bidirectional I/O lines – 9 alternate function lines – 6 high sink outputs 2 Timers – One 8-bit Lite Timer (LT) with prescaler including: watchdog, 1 realtime base and 1 input capture. SO16 150” DIP16 QFN20 – One 12-bit Auto-reload Timer (AT) with output compare function and PWM ■ 1 Communication Interface – SPI synchronous serial interface ■ A/D Converter – 8-bit resolution for 0 to VDD – Fixed gain Op-amp for 11-bit resolution in 0 to 250 mV range (@ 5V VDD) – 5 input channels ■ Instruction Set – 8-bit data manipulation – 63 basic instructions with illegal opcode detection – 17 main addressing modes – 8 x 8 unsigned multiply instruction ■ Development Tools – Full hardware/software development package Device Summary Features Program memory - bytes RAM (stack) - bytes Data EEPROM - bytes Peripherals Operating Supply CPU Frequency Operating Temperature Packages ST7LITESxY0 (ST7SUPERLITE) ST7LITES2Y0 ST7LITES5Y0 ST7LITE02Y0 ST7LITE0xY0 ST7LITE05Y0 1K 1K 1.5K 128 (64) 128 (64) 128 (64) LT Timer w/ Wdg, LT Timer w/ Wdg, LT Timer w/ Wdg, AT Timer w/ 1 PWM, AT Timer w/ 1 PWM, AT Timer w/ 1 PWM, SPI SPI, 8-bit ADC SPI 2.4V to 5.5V 1MHz RC 1% + PLLx4/8MHz -40°C to +85°C SO16 150”, DIP16, QFN20 ST7LITE09Y0 1.5K 1.5K 128 (64) 128 (64) 128 LT Timer w/ Wdg, AT Timer w/ 1 PWM, SPI, 8-bit ADC w/ Op-Amp Rev 6 November 2007 1/124 1 Table of Contents ST7LITE0xY0, ST7LITESxY0 . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 REGISTER & MEMORY MAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 FLASH PROGRAM MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.3 PROGRAMMING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.4 ICC INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.5 MEMORY PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.6 RELATED DOCUMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.7 REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5 DATA EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.3 MEMORY ACCESS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5.4 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.5 ACCESS ERROR HANDLING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.6 DATA EEPROM READ-OUT PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.7 REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 6 CENTRAL PROCESSING UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.3 CPU REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7 SUPPLY, RESET AND CLOCK MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.1 INTERNAL RC OSCILLATOR ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.2 PHASE LOCKED LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.3 REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.4 RESET SEQUENCE MANAGER (RSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 8 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.1 NON MASKABLE SOFTWARE INTERRUPT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.2 EXTERNAL INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.3 PERIPHERAL INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.4 SYSTEM INTEGRITY MANAGEMENT (SI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 9 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9.2 9.3 SLOW MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 WAIT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 . . . . 38 9.4 ACTIVE-HALT AND HALT MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 2/124 2 Table of Contents 10 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 10.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 10.2 FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 10.3 UNUSED I/O PINS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 10.4 LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 10.5 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 10.6 I/O PORT IMPLEMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 11 ON-CHIP PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 11.1 LITE TIMER (LT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 11.2 12-BIT AUTORELOAD TIMER (AT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 11.3 SERIAL PERIPHERAL INTERFACE (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 11.4 8-BIT A/D CONVERTER (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 12 INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 12.1 ST7 ADDRESSING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 12.2 INSTRUCTION GROUPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 13 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 13.1 PARAMETER CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 13.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 13.3 OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 13.4 SUPPLY CURRENT CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 13.5 CLOCK AND TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 13.6 MEMORY CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 13.7 EMC (ELECTROMAGNETIC COMPATIBILITY) CHARACTERISTICS . . . . . . . . . . . . . 93 13.8 I/O PORT PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 13.9 CONTROL PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 13.10 COMMUNICATION INTERFACE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . 102 13.11 8-BIT ADC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 14 PACKAGE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 14.1 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 14.2 THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 15 DEVICE CONFIGURATION AND ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . 112 15.1 OPTION BYTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 15.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE . . . . 114 15.3 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 15.4 ST7 APPLICATION NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 16 KNOWN LIMITATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 16.1 EXECUTION OF BTJX INSTRUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 16.2 IN-CIRCUIT PROGRAMMING OF DEVICES PREVIOUSLY PROGRAMMED WITH HARDWARE WATCHDOG OPTION 121 16.3 IN-CIRCUIT DEBUGGING WITH HARDWARE WATCHDOG . . . . . . . . . . . . . . . . . . . 121 16.4 RECOMMENDATIONS WHEN LVD IS ENABLED . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 16.5 CLEARING ACTIVE INTERRUPTS OUTSIDE INTERRUPT ROUTINE . . . . . . . . . . . . 121 17 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 3/124 3 Table of Contents To obtain the most recent version of this datasheet, please check at www.st.com Please also pay special attention to the Section “KNOWN LIMITATIONS” on page 121. 4/124 1 ST7LITE0xY0, ST7LITESxY0 1 DESCRIPTION The ST7LITE0x and ST7SUPERLITE (ST7LITESx) are members of the ST7 microcontroller family. All ST7 devices are based on a common industry-standard 8-bit core, featuring an enhanced instruction set. The ST7LITE0x and ST7SUPERLITE feature FLASH memory with byte-by-byte In-Circuit Programming (ICP) and In-Application Programming (IAP) capability. Under software control, the ST7LITE0x and ST7SUPERLITE devices can be placed in WAIT, SLOW, or HALT mode, reducing power consumption when the application is in idle or standby state. The enhanced instruction set and addressing modes of the ST7 offer both power and flexibility to software developers, enabling the design of highly efficient and compact application code. In addition to standard 8-bit data management, all ST7 microcontrollers feature true bit manipulation, 8x8 unsigned multiplication and indirect addressing modes. For easy reference, all parametric data are located in section 13 on page 81. Figure 1. General Block Diagram 1 MHz. RC OSC + PLL x 4 or x 8 Internal CLOCK LITE TIMER VDD VSS POWER SUPPLY PORT A CONTROL 8-BIT CORE ALU FLASH MEMORY (1 or 1.5K Bytes) ADDRESS AND DATA BUS RESET LVD/AVD w/ WATCHDOG PA7:0 (8 bits) 12-BIT AUTORELOAD TIMER SPI PORT B PB4:0 (5 bits) 8-BIT ADC RAM (128 Bytes) DATA EEPROM (128 Bytes) 5/124 1 ST7LITE0xY0, ST7LITESxY0 2 PIN DESCRIPTION PA0 (HS)/LTIC VSS VDD PB0/SS/AIN0 Figure 2. 20-Pin QFN Package Pinout 20 19 18 17 e3 e0 16 PA1 (HS) 2 15 PA2 (HS)/ATPWM0 NC 3 14 PA3 (HS) NC 4 13 NC MISO/AIN2/PB2 5 12 PA4 (HS) 11 PA5 (HS)/ICCDATA RESET 1 NC ei1 ei2 7 8 9 10 CLKIN/AIN4/PB4 PA7 MCO/ICCCLK/PA6 6 MOSI/AIN3/PB3 SCK/AIN1/PB1 (HS) 20mA High sink capability eix associated external interrupt vector Figure 3. 16-Pin SO and DIP Package Pinout k VSS 1 ei0 16 VDD RESET 2 15 3 14 4 ei3 13 PA3 (HS) 5 12 PA4 (HS) MISO/AIN2/PB2 6 11 PA5 (HS)/ICCDATA MOSI/AIN3/PB3 7 ei2 10 PA6/MCO/ICCCLK SS/AIN0/PB0 SCK/AIN1/PB1 CLKIN/AIN4/PB4 8 ei1 9 PA0 (HS)/LTIC PA1 (HS) PA2 (HS)/ATPWM0 PA7 (HS) 20mA high sink capability eix associated external interrupt vector 6/124 1 ST7LITE0xY0, ST7LITESxY0 PIN DESCRIPTION (Cont’d) Legend / Abbreviations for Table 1: Type: I = input, O = output, S = supply In/Output level: C= CMOS 0.15VDD/0.85VDD with input trigger CT= CMOS 0.3VDD/0.7VDD with input trigger Output level: HS = 20mA high sink (on N-buffer only) Port and control configuration: – Input: float = floating, wpu = weak pull-up, int = interrupt 1), ana = analog – Output: OD = open drain, PP = push-pull Table 1. Device Pin Description Port / Control VSS S Ground 19 2 VDD S Main power supply 1 3 RESET I/O CT 20 4 PB0/AIN0/SS I/O CT X 6 5 PB1/AIN1/SCK I/O CT X 5 6 PB2/AIN2/MISO I/O CT X 7 7 PB3/AIN3/MOSI I/O CT X 8 8 PB4/AIN4/CLKIN I/O CT X 9 9 PA7 I/O CT X X PP OD Output ana int wpu Input float Output 1 Input 18 Pin Name Type SO16/DIP16 Level QFN20 Pin n° X ei3 Main Function (after reset) Top priority non maskable interrupt (active low) X X X Port B0 X X X X Port B1 X X X X Port B2 X X X Port B3 X X X Port B4 X X Port A7 ei2 X ei1 Alternate Function ADC Analog Input 0 or SPI Slave Select (active low) ADC Analog Input 1 or SPI Clock Caution: No negative current injection allowed on this pin. For details, refer to section 13.2.2 on page 82 ADC Analog Input 2 or SPI Master In/ Slave Out Data ADC Analog Input 3 or SPI Master Out / Slave In Data ADC Analog Input 4 or External clock input X X X X Port A6 Main Clock Output/In Circuit Communication Clock. Caution: During normal operation this pin must be pulled- up, internally or externally (external pull-up of 10k mandatory in noisy environment). This is to avoid entering ICC mode unexpectedly during a reset. In the application, even if the pin is configured as output, any reset will put it back in input pull-up I/O CT HS X X X X Port A5 In Circuit Communication Data 12 12 PA4 I/O CT HS X X X X Port A4 14 13 PA3 I/O CT HS X X X X Port A3 10 10 PA6 /MCO/ ICCCLK I/O 11 11 PA5/ ICCDATA CT 7/124 1 ST7LITE0xY0, ST7LITESxY0 Level Port / Control PP X X X Port A2 16 15 PA1 I/O CT HS X X X X Port A1 17 16 PA0/LTIC I/O CT HS X X X Port A0 ei0 ana X int I/O CT HS Pin Name Input 15 14 PA2/ATPWM0 QFN20 OD Main Function (after reset) wpu Output float Input Output Type SO16/DIP16 Pin n° Alternate Function Auto-Reload Timer PWM0 Lite Timer Input Capture Note: In the interrupt input column, “eix” defines the associated external interrupt vector. If the weak pull-up column (wpu) is merged with the interrupt column (int), then the I/O configuration is pull-up interrupt input, else the configuration is floating interrupt input. 8/124 1 ST7LITE0xY0, ST7LITESxY0 3 REGISTER & MEMORY MAP As shown in Figure 4 and Figure 5, the MCU is capable of addressing 64K bytes of memories and I/ O registers. The available memory locations consist of up to 128 bytes of register locations, 128 bytes of RAM, 128 bytes of data EEPROM and up to 1.5 Kbytes of user program memory. The RAM space includes up to 64 bytes for the stack from 0C0h to 0FFh. The highest address bytes contain the user reset and interrupt vectors. The size of Flash Sector 0 is configurable by Option byte. IMPORTANT: Memory locations marked as “Reserved” must never be accessed. Accessing a reserved area can have unpredictable effects on the device. Figure 4. Memory Map (ST7LITE0x) 0000h 007Fh 0080h HW Registers (see Table 2) RAM (128 Bytes) 00FFh 0100h 0080h Short Addressing RAM (zero page) 00BFh 00C0h 64 Bytes Stack 00FFh Reserved 0FFFh 1000h 107Fh 1080h Data EEPROM (128 Bytes) F9FFh FA00h 1001h RCCR1 1.5K FLASH PROGRAM MEMORY FA00h Flash Memory (1.5K) FBFFh FC00h FFFFh FFFFh RCCR0 see section 7.1 on page 24 Reserved FFDFh FFE0h 1000h Interrupt & Reset Vectors (see Table 6) 0.5 Kbytes SECTOR 1 1 Kbytes SECTOR 0 FFDEh RCCR0 FFDFh RCCR1 see section 7.1 on page 24 9/124 1 ST7LITE0xY0, ST7LITESxY0 REGISTER AND MEMORY MAP (Cont’d) Figure 5. Memory Map (ST7SUPERLITE) 0000h 007Fh 0080h HW Registers (see Table 2) RAM (128 Bytes) 00FFh 0100h 0080h Short Addressing RAM (zero page) 00BFh 00C0h 64 Bytes Stack 00FFh Reserved 1K FLASH PROGRAM MEMORY FBFFh FC00h FC00h Flash Memory (1K) FDFFh FE00h FFFFh FFDFh FFE0h FFFFh Interrupt & Reset Vectors (see Table 6) 0.5 Kbytes SECTOR 1 0.5 Kbytes SECTOR 0 FFDEh RCCR0 FFDFh RCCR1 see section 7.1 on page 24 10/124 1 ST7LITE0xY0, ST7LITESxY0 REGISTER AND MEMORY MAP (Cont’d) Legend: x=undefined, R/W=read/write Table 2. Hardware Register Map Address 0000h 0001h 0002h 0003h 0004h 0005h Block Register Label 000Dh 000Eh 000Fh 0010h 0011h 0012h 0013h Remarks Port A Port A Data Register Port A Data Direction Register Port A Option Register 00h1) 00h 40h R/W R/W R/W Port B PBDR PBDDR PBOR Port B Data Register Port B Data Direction Register Port B Option Register E0h 1) 00h 00h R/W R/W R/W2) Reserved area (5 bytes) LITE TIMER LTCSR LTICR ATCSR CNTRH CNTRL AUTO-RELOAD ATRH TIMER ATRL PWMCR PWM0CSR 0014h to 0016h 0017h 0018h Reset Status PADR PADDR PAOR 0006h to 000Ah 000Bh 000Ch Register Name Lite Timer Control/Status Register Lite Timer Input Capture Register xxh xxh R/W Read Only Timer Control/Status Register Counter Register High Counter Register Low Auto-Reload Register High Auto-Reload Register Low PWM Output Control Register PWM 0 Control/Status Register 00h 00h 00h 00h 00h 00h 00h R/W Read Only Read Only R/W R/W R/W R/W 00h 00h R/W R/W Reserved area (3 bytes) AUTO-RELOAD DCR0H TIMER DCR0L 0019h to 002Eh PWM 0 Duty Cycle Register High PWM 0 Duty Cycle Register Low Reserved area (22 bytes) 0002Fh FLASH FCSR Flash Control/Status Register 00h R/W 00030h EEPROM EECSR Data EEPROM Control/Status Register 00h R/W 0031h 0032h 0033h SPI SPIDR SPICR SPICSR SPI Data I/O Register SPI Control Register SPI Control/Status Register xxh 0xh 00h R/W R/W R/W 0034h 0035h 0036h ADC ADCCSR ADCDR ADCAMP A/D Control Status Register A/D Data Register A/D Amplifier Control Register 00h 00h 00h R/W Read Only R/W 0037h ITC EICR External Interrupt Control Register 00h R/W MCCSR RCCR Main Clock Control/Status Register RC oscillator Control Register 00h FFh R/W R/W 0038h 0039h CLOCKS 11/124 1 ST7LITE0xY0, ST7LITESxY0 Address Block 003Ah SI 003Bh to 007Fh Register Label SICSR Register Name System Integrity Control/Status Register Reset Status 0xh Remarks R/W Reserved area (69 bytes) Notes: 1. The contents of the I/O port DR registers are readable only in output configuration. In input configuration, the values of the I/O pins are returned instead of the DR register contents. 2. The bits associated with unavailable pins must always keep their reset value. 12/124 1 ST7LITE0xY0, ST7LITESxY0 4 FLASH PROGRAM MEMORY 4.1 Introduction The ST7 single voltage extended Flash (XFlash) is a non-volatile memory that can be electrically erased and programmed either on a byte-by-byte basis or up to 32 bytes in parallel. The XFlash devices can be programmed off-board (plugged in a programming tool) or on-board using In-Circuit Programming or In-Application Programming. The array matrix organisation allows each sector to be erased and reprogrammed without affecting other sectors. 4.2 Main Features ■ ■ ■ ■ ■ ICP (In-Circuit Programming) IAP (In-Application Programming) ICT (In-Circuit Testing) for downloading and executing user application test patterns in RAM Sector 0 size configurable by option byte Read-out and write protection 4.3 PROGRAMMING MODES The ST7 can be programmed in three different ways: – Insertion in a programming tool. In this mode, FLASH sectors 0 and 1, option byte row and data EEPROM can be programmed or erased. – In-Circuit Programming. In this mode, FLASH sectors 0 and 1, option byte row and data EEPROM can be programmed or erased without removing the device from the application board. – In-Application Programming. In this mode, sector 1 and data EEPROM can be programmed or erased without removing the device from the application board and while the application is running. 4.3.1 In-Circuit Programming (ICP) ICP uses a protocol called ICC (In-Circuit Communication) which allows an ST7 plugged on a printed circuit board (PCB) to communicate with an external programming device connected via cable. ICP is performed in three steps: Switch the ST7 to ICC mode (In-Circuit Communications). This is done by driving a specific signal sequence on the ICCCLK/DATA pins while the RESET pin is pulled low. When the ST7 enters ICC mode, it fetches a specific RESET vector which points to the ST7 System Memory containing the ICC protocol routine. This routine enables the ST7 to receive bytes from the ICC interface. – Download ICP Driver code in RAM from the ICCDATA pin – Execute ICP Driver code in RAM to program the FLASH memory Depending on the ICP Driver code downloaded in RAM, FLASH memory programming can be fully customized (number of bytes to program, program locations, or selection of the serial communication interface for downloading). 4.3.2 In Application Programming (IAP) This mode uses an IAP Driver program previously programmed in Sector 0 by the user (in ICP mode). This mode is fully controlled by user software. This allows it to be adapted to the user application, (user-defined strategy for entering programming mode, choice of communications protocol used to fetch the data to be stored etc.) IAP mode can be used to program any memory areas except Sector 0, which is write/erase protected to allow recovery in case errors occur during the programming operation. 13/124 1 ST7LITE0xY0, ST7LITESxY0 FLASH PROGRAM MEMORY (Cont’d) 4.4 ICC interface high level (push pull output or pull-up resistor1K or a reset management IC with open drain output and pull-up resistor>1K, no additional components are needed. In all cases the user must ensure that no external reset is generated by the application during the ICC session. 3. The use of Pin 7 of the ICC connector depends on the Programming Tool architecture. This pin must be connected when using most ST Programming Tools (it is used to monitor the application power supply). Please refer to the Programming Tool manual. 4. Pin 9 has to be connected to the CLKIN pin of the ST7 when the clock is not available in the application or if the selected clock option is not programmed in the option byte. Caution: During normal operation, ICCCLK pin must be pulled- up, internally or externally (external pull-up of 10K mandatory in noisy environment). This is to avoid entering ICC mode unexpectedly during a reset. In the application, even if the pin is configured as output, any reset will put it back in input pull-up. ICP needs a minimum of 4 and up to 6 pins to be connected to the programming tool. These pins are: – RESET: device reset – VSS: device power supply ground – ICCCLK: ICC output serial clock pin – ICCDATA: ICC input serial data pin – CLKIN: main clock input for external source – VDD: application board power supply (optional, see Note 3) Notes: 1. If the ICCCLK or ICCDATA pins are only used as outputs in the application, no signal isolation is necessary. As soon as the Programming Tool is plugged to the board, even if an ICC session is not in progress, the ICCCLK and ICCDATA pins are not available for the application. If they are used as inputs by the application, isolation such as a serial resistor has to be implemented in case another device forces the signal. Refer to the Programming Tool documentation for recommended resistor values. 2. During the ICP session, the programming tool must control the RESET pin. This can lead to conflicts between the programming tool and the application reset circuit if it drives more than 5mA at Figure 6. Typical ICC Interface PROGRAMMING TOOL ICC CONNECTOR ICC Cable ICC CONNECTOR HE10 CONNECTOR TYPE (See Note 3) OPTIONAL (See Note 4) 9 7 5 3 1 10 8 6 4 2 APPLICATION BOARD APPLICATION RESET SOURCE See Note 2 APPLICATION POWER SUPPLY 14/124 1 ICCDATA ICCCLK ST7 RESET CLKIN VDD See Note 1 and Caution APPLICATION I/O See Note 1 ST7LITE0xY0, ST7LITESxY0 FLASH PROGRAM MEMORY (Cont’d) 4.5 Memory Protection There are two different types of memory protection: Read Out Protection and Write/Erase Protection which can be applied individually. 4.5.1 Read out Protection Readout protection, when selected provides a protection against program memory content extraction and against write access to Flash memory. Even if no protection can be considered as totally unbreakable, the feature provides a very high level of protection for a general purpose microcontroller. Both program and data E2 memory are protected. In flash devices, this protection is removed by reprogramming the option. In this case, both program and data E2 memory are automatically erased, and the device can be reprogrammed. Read-out protection selection depends on the device type: – In Flash devices it is enabled and removed through the FMP_R bit in the option byte. – In ROM devices it is enabled by mask option specified in the Option List. 4.5.2 Flash Write/Erase Protection Write/erase protection, when set, makes it impossible to both overwrite and erase program memory. It does not apply to E2 data. Its purpose is to provide advanced security to applications and prevent any change being made to the memory content. Warning: Once set, Write/erase protection can never be removed. A write-protected flash device is no longer reprogrammable. Write/erase protection is enabled through the FMP_W bit in the option byte. 4.6 Related Documentation For details on Flash programming and ICC protocol, refer to the ST7 Flash Programming Reference Manual and to the ST7 ICC Protocol Reference Manual. 4.7 Register Description FLASH CONTROL/STATUS REGISTER (FCSR) Read/Write Reset Value: 000 0000 (00h) 1st RASS Key: 0101 0110 (56h) 2nd RASS Key: 1010 1110 (AEh) 7 0 0 0 0 0 0 OPT LAT PGM Note: This register is reserved for programming using ICP, IAP or other programming methods. It controls the XFlash programming and erasing operations. When an EPB or another programming tool is used (in socket or ICP mode), the RASS keys are sent automatically. Table 3. FLASH Register Map and Reset Values Address (Hex.) 002Fh Register Label 7 6 5 4 3 2 1 0 0 0 0 0 0 OPT 0 LAT 0 PGM 0 FCSR Reset Value 15/124 1 ST7LITE0xY0, ST7LITESxY0 5 DATA EEPROM 5.1 INTRODUCTION 5.2 MAIN FEATURES The Electrically Erasable Programmable Read Only Memory can be used as a non-volatile backup for storing data. Using the EEPROM requires a basic access protocol described in this chapter. ■ ■ ■ ■ ■ ■ Up to 32 bytes programmed in the same cycle EEPROM mono-voltage (charge pump) Chained erase and programming cycles Internal control of the global programming cycle duration WAIT mode management Read-out protection Figure 7. EEPROM Block Diagram HIGH VOLTAGE PUMP EECSR 0 0 0 ADDRESS DECODER 0 0 4 0 E2LAT E2PGM EEPROM ROW MEMORY MATRIX DECODER (1 ROW = 32 x 8 BITS) 128 4 128 DATA 32 x 8 BITS MULTIPLEXER DATA LATCHES 4 ADDRESS BUS 16/124 1 DATA BUS ST7LITE0xY0, ST7LITESxY0 DATA EEPROM (Cont’d) 5.3 MEMORY ACCESS The Data EEPROM memory read/write access modes are controlled by the E2LAT bit of the EEPROM Control/Status register (EECSR). The flowchart in Figure 8 describes these different memory access modes. Read Operation (E2LAT = 0) The EEPROM can be read as a normal ROM location when the E2LAT bit of the EECSR register is cleared. On this device, Data EEPROM can also be used to execute machine code. Take care not to write to the Data EEPROM while executing from it. This would result in an unexpected code being executed. Write Operation (E2LAT = 1) To access the write mode, the E2LAT bit has to be set by software (the E2PGM bit remains cleared). When a write access to the EEPROM area occurs, the value is latched inside the 32 data latches according to its address. When PGM bit is set by the software, all the previous bytes written in the data latches (up to 32) are programmed in the EEPROM cells. The effective high address (row) is determined by the last EEPROM write sequence. To avoid wrong programming, the user must take care that all the bytes written between two programming sequences have the same high address: Only the five Least Significant Bits of the address can change. At the end of the programming cycle, the PGM and LAT bits are cleared simultaneously. Note: Care should be taken during the programming cycle. Writing to the same memory location will over-program the memory (logical AND between the two write access data result) because the data latches are only cleared at the end of the programming cycle and by the falling edge of the E2LAT bit. It is not possible to read the latched data. This note is illustrated by the Figure 10. Figure 8. Data EEPROM Programming Flowchart READ MODE E2LAT = 0 E2PGM = 0 READ BYTES IN EEPROM AREA WRITE MODE E2LAT = 1 E2PGM = 0 WRITE UP TO 32 BYTES IN EEPROM AREA (with the same 11 MSB of the address) START PROGRAMMING CYCLE E2LAT=1 E2PGM=1 (set by software) 0 E2LAT 1 CLEARED BY HARDWARE 17/124 1 ST7LITE0xY0, ST7LITESxY0 DATA EEPROM (Cont’d) Figure 9. Data E2PROM Write Operation ⇓ Row / Byte ⇒ ROW DEFINITION 0 1 2 3 ... 30 31 Physical Address 0 00h...1Fh 1 20h...3Fh ... Nx20h...Nx20h+1Fh N Read operation impossible Byte 1 Byte 2 Byte 32 Read operation possible Programming cycle PHASE 1 PHASE 2 Writing data latches Waiting E2PGM and E2LAT to fall E2LAT bit Set by USER application Cleared by hardware E2PGM bit Note: If a programming cycle is interrupted (by RESET action), the integrity of the data in memory will not be guaranteed. 18/124 1 ST7LITE0xY0, ST7LITESxY0 DATA EEPROM (Cont’d) 5.4 POWER SAVING MODES 5.5 ACCESS ERROR HANDLING Wait mode The DATA EEPROM can enter WAIT mode on execution of the WFI instruction of the microcontroller or when the microcontroller enters Active Halt mode.The DATA EEPROM will immediately enter this mode if there is no programming in progress, otherwise the DATA EEPROM will finish the cycle and then enter WAIT mode. If a read access occurs while E2LAT = 1, then the data bus will not be driven. If a write access occurs while E2LAT = 0, then the data on the bus will not be latched. If a programming cycle is interrupted (by RESET action), the integrity of the data in memory will not be guaranteed. 5.6 DATA EEPROM READ-OUT PROTECTION Active Halt mode Refer to Wait mode. Halt mode The DATA EEPROM immediately enters HALT mode if the microcontroller executes the HALT instruction. Therefore the EEPROM will stop the function in progress, and data may be corrupted. The read-out protection is enabled through an option bit (see option byte section). When this option is selected, the programs and data stored in the EEPROM memory are protected against read-out (including a re-write protection). In Flash devices, when this protection is removed by reprogramming the Option Byte, the entire Program memory and EEPROM is first automatically erased. Note: Both Program Memory and data EEPROM are protected using the same option bit. Figure 10. Data EEPROM Programming Cycle READ OPERATION NOT POSSIBLE READ OPERATION POSSIBLE INTERNAL PROGRAMMING VOLTAGE ERASE CYCLE WRITE OF DATA LATCHES WRITE CYCLE tPROG LAT PGM 19/124 1 ST7LITE0xY0, ST7LITESxY0 DATA EEPROM (Cont’d) 5.7 REGISTER DESCRIPTION EEPROM CONTROL/STATUS REGISTER (EECSR) Read/Write Reset Value: 0000 0000 (00h) 7 0 0 0 0 0 0 0 E2LAT E2PGM Bits 7:2 = Reserved, forced by hardware to 0. Bit 1 = E2LAT Latch Access Transfer This bit is set by software. It is cleared by hardware at the end of the programming cycle. It can only be cleared by software if the E2PGM bit is cleared. 0: Read mode 1: Write mode Bit 0 = E2PGM Programming control and status This bit is set by software to begin the programming cycle. At the end of the programming cycle, this bit is cleared by hardware. 0: Programming finished or not yet started 1: Programming cycle is in progress Note: If the E2PGM bit is cleared during the programming cycle, the memory data is not guaranteed. Table 4. DATA EEPROM Register Map and Reset Values Address (Hex.) 0030h 20/124 1 Register Label 7 6 5 4 3 2 1 0 0 0 0 0 0 0 E2LAT 0 E2PGM 0 EECSR Reset Value ST7LITE0xY0, ST7LITESxY0 6 CENTRAL PROCESSING UNIT 6.1 INTRODUCTION This CPU has a full 8-bit architecture and contains six internal registers allowing efficient 8-bit data manipulation. 6.2 MAIN FEATURES ■ ■ ■ ■ ■ ■ ■ ■ 63 basic instructions Fast 8-bit by 8-bit multiply 17 main addressing modes Two 8-bit index registers 16-bit stack pointer Low power modes Maskable hardware interrupts Non-maskable software interrupt 6.3 CPU REGISTERS The six CPU registers shown in Figure 11 are not present in the memory mapping and are accessed by specific instructions. Accumulator (A) The Accumulator is an 8-bit general purpose register used to hold operands and the results of the arithmetic and logic calculations and to manipulate data. Index Registers (X and Y) In indexed addressing modes, these 8-bit registers are used to create either effective addresses or temporary storage areas for data manipulation. (The Cross-Assembler generates a precede instruction (PRE) to indicate that the following instruction refers to the Y register.) The Y register is not affected by the interrupt automatic procedures (not pushed to and popped from the stack). Program Counter (PC) The program counter is a 16-bit register containing the address of the next instruction to be executed by the CPU. It is made of two 8-bit registers PCL (Program Counter Low which is the LSB) and PCH (Program Counter High which is the MSB). Figure 11. CPU Registers 7 0 ACCUMULATOR RESET VALUE = XXh 7 0 X INDEX REGISTER RESET VALUE = XXh 7 0 Y INDEX REGISTER RESET VALUE = XXh 15 PCH 8 7 PCL 0 PROGRAM COUNTER RESET VALUE = RESET VECTOR @ FFFEh-FFFFh 7 1 1 1 H I 0 N Z C CONDITION CODE REGISTER RESET VALUE = 1 1 1 X 1 X X X 15 8 7 0 STACK POINTER RESET VALUE = STACK HIGHER ADDRESS X = Undefined Value 21/124 1 ST7LITE0xY0, ST7LITESxY0 CPU REGISTERS (Cont’d) CONDITION CODE REGISTER (CC) Read/Write Reset Value: 111x1xxx 7 1 0 1 1 H I N Z because the I bit is set by hardware at the start of the routine and reset by the IRET instruction at the end of the routine. If the I bit is cleared by software in the interrupt routine, pending interrupts are serviced regardless of the priority level of the current interrupt routine. C The 8-bit Condition Code register contains the interrupt mask and four flags representative of the result of the instruction just executed. This register can also be handled by the PUSH and POP instructions. These bits can be individually tested and/or controlled by specific instructions. Bit 4 = H Half carry. This bit is set by hardware when a carry occurs between bits 3 and 4 of the ALU during an ADD or ADC instruction. It is reset by hardware during the same instructions. 0: No half carry has occurred. 1: A half carry has occurred. This bit is tested using the JRH or JRNH instruction. The H bit is useful in BCD arithmetic subroutines. Bit 2 = N Negative. This bit is set and cleared by hardware. It is representative of the result sign of the last arithmetic, logical or data manipulation. It is a copy of the 7th bit of the result. 0: The result of the last operation is positive or null. 1: The result of the last operation is negative (that is, the most significant bit is a logic 1). This bit is accessed by the JRMI and JRPL instructions. Bit 1 = Z Zero. This bit is set and cleared by hardware. This bit indicates that the result of the last arithmetic, logical or data manipulation is zero. 0: The result of the last operation is different from zero. 1: The result of the last operation is zero. This bit is accessed by the JREQ and JRNE test instructions. Bit 3 = I Interrupt mask. This bit is set by hardware when entering in interrupt or by software to disable all interrupts except the TRAP software interrupt. This bit is cleared by software. 0: Interrupts are enabled. 1: Interrupts are disabled. This bit is controlled by the RIM, SIM and IRET instructions and is tested by the JRM and JRNM instructions. Note: Interrupts requested while I is set are latched and can be processed when I is cleared. By default an interrupt routine is not interruptible 22/124 1 Bit 0 = C Carry/borrow. This bit is set and cleared by hardware and software. It indicates an overflow or an underflow has occurred during the last arithmetic operation. 0: No overflow or underflow has occurred. 1: An overflow or underflow has occurred. This bit is driven by the SCF and RCF instructions and tested by the JRC and JRNC instructions. It is also affected by the “bit test and branch”, shift and rotate instructions. ST7LITE0xY0, ST7LITESxY0 CPU REGISTERS (Cont’d) Stack Pointer (SP) Read/Write Reset Value: 00 FFh 15 0 8 0 0 0 0 0 0 7 1 0 0 1 SP5 SP4 SP3 SP2 SP1 SP0 The Stack Pointer is a 16-bit register which is always pointing to the next free location in the stack. It is then decremented after data has been pushed onto the stack and incremented before data is popped from the stack (see Figure 12). Since the stack is 64 bytes deep, the 10 most significant bits are forced by hardware. Following an MCU Reset, or after a Reset Stack Pointer instruction (RSP), the Stack Pointer contains its reset value (the SP5 to SP0 bits are set) which is the stack higher address. The least significant byte of the Stack Pointer (called S) can be directly accessed by a LD instruction. Note: When the lower limit is exceeded, the Stack Pointer wraps around to the stack upper limit, without indicating the stack overflow. The previously stored information is then overwritten and therefore lost. The stack also wraps in case of an underflow. The stack is used to save the return address during a subroutine call and the CPU context during an interrupt. The user may also directly manipulate the stack by means of the PUSH and POP instructions. In the case of an interrupt, the PCL is stored at the first location pointed to by the SP. Then the other registers are stored in the next locations as shown in Figure 12. – When an interrupt is received, the SP is decremented and the context is pushed on the stack. – On return from interrupt, the SP is incremented and the context is popped from the stack. A subroutine call occupies two locations and an interrupt five locations in the stack area. Figure 12. Stack Manipulation Example CALL Subroutine PUSH Y Interrupt event POP Y RET or RSP IRET @ 00C0h SP SP CC A X X X PCH PCH PCH PCL PCL PCL PCH PCH PCH PCH PCH PCL PCL PCL PCL PCL SP @ 00FFh SP Y CC A CC A SP SP Stack Higher Address = 00FFh Stack Lower Address = 00C0h 23/124 1 ST7LITE0xY0, ST7LITESxY0 7 SUPPLY, RESET AND CLOCK MANAGEMENT The device includes a range of utility features for securing the application in critical situations (for example in case of a power brown-out), and reducing the number of external components. Main features ■ Clock Management – 1 MHz internal RC oscillator (enabled by option byte) – External Clock Input (enabled by option byte) – PLL for multiplying the frequency by 4 or 8 (enabled by option byte) ■ Reset Sequence Manager (RSM) ■ System Integrity Management (SI) – Main supply Low voltage detection (LVD) with reset generation (enabled by option byte) – Auxiliary Voltage detector (AVD) with interrupt capability for monitoring the main supply (enabled by option byte) 7.1 INTERNAL RC OSCILLATOR ADJUSTMENT The ST7 contains an internal RC oscillator with an accuracy of 1% for a given device, temperature and voltage. It must be calibrated to obtain the frequency required in the application. This is done by software writing a calibration value in the RCCR (RC Control Register). Whenever the microcontroller is reset, the RCCR returns to its default value (FFh), i.e. each time the device is reset, the calibration value must be loaded in the RCCR. Predefined calibration values are stored in EEPROM for 3.0 and 5V VDD supply voltages at 25°C, as shown in the following table. Notes: – See “ELECTRICAL CHARACTERISTICS” on page 81. for more information on the frequency and accuracy of the RC oscillator. – To improve clock stability and frequency accuracy, it is recommended to place a decoupling capacitor, typically 100nF, between the VDD and VSS pins as close as possible to the ST7 device. 24/124 1 RCCR RCCR0 RCCR1 Conditions VDD=5V TA=25°C fRC=1MHz VDD=3.0V TA=25°C fRC=700KHz ST7FLITE09 Address ST7FLITE05/ ST7FLITES5 Address 1000h and FFDEh FFDEh 1001h andFFDFh FFDFh – These two bytes are systematically programmed by ST, including on FASTROM devices. Consequently, customers intending to us e FASTROM service must not use these two bytes. – RCCR0 and RCCR1 calibration values will be erased if the read-out protection bit is reset after it has been set. See “Read out Protection” on page 15. Caution: If the voltage or temperature conditions change in the application, the frequency may need to be recalibrated. Refer to application note AN1324 for information on how to calibrate the RC frequency using an external reference signal. 7.2 PHASE LOCKED LOOP The PLL can be used to multiply a 1MHz frequency from the RC oscillator or the external clock by 4 or 8 to obtain fOSC of 4 or 8 MHz. The PLL is enabled and the multiplication factor of 4 or 8 is selected by 2 option bits. – The x4 PLL is intended for operation with VDD in the 2.4V to 3.3V range – The x8 PLL is intended for operation with VDD in the 3.3V to 5.5V range Refer to Section 15.1 for the option byte description. If the PLL is disabled and the RC oscillator is enabled, then fOSC = 1MHz. If both the RC oscillator and the PLL are disabled, fOSC is driven by the external clock. ST7LITE0xY0, ST7LITESxY0 Figure 13. PLL Output Frequency Timing Diagram LOCKED bit set 4/8 x input freq. Bit 1 = MCO Main Clock Out enable This bit is read/write by software and cleared by hardware after a reset. This bit allows to enable the MCO output clock. 0: MCO clock disabled, I/O port free for general purpose I/O. 1: MCO clock enabled. Output freq. tSTAB Bit 0 = SMS Slow Mode select This bit is read/write by software and cleared by hardware after a reset. This bit selects the input clock fOSC or fOSC/32. 0: Normal mode (fCPU = fOSC 1: Slow mode (fCPU = fOSC/32) tLOCK tSTARTUP t When the PLL is started, after reset or wakeup from Halt mode or AWUFH mode, it outputs the clock after a delay of tSTARTUP. When the PLL output signal reaches the operating frequency, the LOCKED bit in the SICSCR register is set. Full PLL accuracy (ACCPLL) is reached after a stabilization time of tSTAB (see Figure 13 and 13.3.4 Internal RC Oscillator and PLL) Refer to section 8.4.4 on page 36 for a description of the LOCKED bit in the SICSR register. 7.3 REGISTER DESCRIPTION MAIN CLOCK CONTROL/STATUS REGISTER (MCCSR) Read / Write Reset Value: 0000 0000 (00h) 7 0 0 0 0 0 0 0 MCO RC CONTROL REGISTER (RCCR) Read / Write Reset Value: 1111 1111 (FFh) 7 0 CR7 CR6 CR5 CR4 CR3 CR2 CR1 CR0 Bits 7:0 = CR[7:0] RC Oscillator Frequency Adjustment Bits These bits must be written immediately after reset to adjust the RC oscillator frequency and to obtain an accuracy of 1%. The application can store the correct value for each voltage range in EEPROM and write it to this register at start-up. 00h = maximum available frequency FFh = lowest available frequency Note: To tune the oscillator, write a series of different values in the register until the correct frequency is reached. The fastest method is to use a dichotomy starting with 80h. SMS Bits 7:2 = Reserved, must be kept cleared. Table 5. Clock Register Map and Reset Values Address (Hex.) 0038h 0039h Register Label 7 6 5 4 3 2 1 0 0 0 0 0 0 0 MCO 0 SMS 0 CR7 1 CR6 1 CR5 1 CR4 1 CR3 1 CR2 1 CR1 1 CR0 1 MCCSR Reset Value RCCR Reset Value 25/124 1 ST7LITE0xY0, ST7LITESxY0 SUPPLY, RESET AND CLOCK MANAGEMENT (Cont’d) Figure 14. Clock Management Block Diagram CR7 CR6 CR5 CR4 CR3 CR2 CR1 CR0 RCCR 1MHz 8MHz PLL 1MHz -> 8MHz PLL 1MHz -> 4MHz Tunable 1% RC Oscillator Option byte /2 DIVIDER CLKIN fOSC 4MHz 0 to 8 MHz Option byte 8-BIT LITE TIMER COUNTER fOSC fLTIMER (1ms timebase @ 8 MHz fOSC) fOSC/32 /32 DIVIDER 1 fCPU fOSC 0 TO CPU AND PERIPHERALS (except LITE TIMER) MCO SMS MCCSR 7 26/124 1 0 fCPU MCO ST7LITE0xY0, ST7LITESxY0 7.4 RESET SEQUENCE MANAGER (RSM) 7.4.1 Introduction The reset sequence manager includes three RESET sources as shown in Figure 16: ■ External RESET source pulse ■ Internal LVD RESET (Low Voltage Detection) ■ Internal WATCHDOG RESET Note: A reset can also be triggered following the detection of an illegal opcode or prebyte code. Refer to section 11.2.1 on page 53 for further details. These sources act on the RESET pin and it is always kept low during the delay phase. The RESET service routine vector is fixed at addresses FFFEh-FFFFh in the ST7 memory map. The basic RESET sequence consists of 3 phases as shown in Figure 15: ■ Active Phase depending on the RESET source ■ 256 CPU clock cycle delay ■ RESET vector fetch The 256 CPU clock cycle delay allows the oscillator to stabilise and ensures that recovery has taken place from the Reset state. The RESET vector fetch phase duration is 2 clock cycles. If the PLL is enabled by option byte, it outputs the clock after an additional delay of tSTARTUP (see Figure 13). Figure 15. RESET Sequence Phases RESET Active Phase INTERNAL RESET 256 CLOCK CYCLES FETCH VECTOR Figure 16.Reset Block Diagram VDD RON RESET INTERNAL RESET FILTER PULSE GENERATOR WATCHDOG RESET ILLEGAL OPCODE RESET 1) LVD RESET Note 1: See “Illegal Opcode Reset” on page 78. for more details on illegal opcode reset conditions. 27/124 1 ST7LITE0xY0, ST7LITESxY0 RESET SEQUENCE MANAGER (Cont’d) 7.4.2 Asynchronous External RESET pin The RESET pin is both an input and an open-drain output with integrated RON weak pull-up resistor. This pull-up has no fixed value but varies in accordance with the input voltage. It can be pulled low by external circuitry to reset the device. See Electrical Characteristic section for more details. A RESET signal originating from an external source must have a duration of at least th(RSTL)in in order to be recognized (see Figure 17). This detection is asynchronous and therefore the MCU can enter reset state even in HALT mode. The RESET pin is an asynchronous signal which plays a major role in EMS performance. In a noisy environment, it is recommended to follow the guidelines mentioned in the electrical characteristics section. 7.4.3 External Power-On RESET If the LVD is disabled by option byte, to start up the microcontroller correctly, the user must ensure by means of an external reset circuit that the reset signal is held low until VDD is over the minimum level specified for the selected fOSC frequency. A proper reset signal for a slow rising VDD supply can generally be provided by an external RC network connected to the RESET pin. 7.4.4 Internal Low Voltage Detector (LVD) RESET Two different RESET sequences caused by the internal LVD circuitry can be distinguished: ■ Power-On RESET ■ Voltage Drop RESET The device RESET pin acts as an output that is pulled low when VDD 79/124 1 ST7LITE0xY0, ST7LITESxY0 INSTRUCTION GROUPS (cont’d) Mnemo Description Function/Example Dst Src JRULE Jump if (C + Z = 1) Unsigned
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