STTH4R02BY-TR

STTH4R02-Y Automotive ultrafast recovery diode Datasheet - production data Description A K A This device uses ST's new 200 V planar Pt doping technology, and it is especially suited for switching mode base drive and transistor circuits. A K K SMB Packaged in SMB, SMC and DPAK, it is intended for use in low voltage, high frequency inverters, freewheeling and polarity protection in automotive applications. SMC K Table 1: Device summary NC Symbol Value IF(AV) 4A VRRM 200 V Features Tj (max.) 175 °C       VF (typ.) 0.76 V trr (typ.) 16 ns A DPAK Very low conduction losses Negligible switching losses Low forward and reverse recovery times High junction temperature PPAP capable AEC-Q101 qualified April 2016 DocID17391 Rev 2 This is information on a product in full production. 1/14 www.st.com Characteristics 1 STTH4R02-Y Characteristics Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Tj = -40 °C to + 175 °C DPAK Tc = 160 °C SMB, SMC Tlead = 95 °C Value Unit 200 V 10 A 4 A 70 A IF(AV) Average forward current δ = 0.5, square wave IFSM Surge non repetitive forward current Tstg Storage temperature range -65 to +175 °C Maximum operating junction temperature(1) -40 to +175 °C Tj tp = 10 ms sinusoidal Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameters Symbol Parameter Maximum Rth(j-c) Junction to case DPAK 3.5 Rth(j-l) Junction to lead SMB, SMC 20 Unit °C/W Table 4: Static electrical characteristics Symbol Parameter Test conditions IR(1) Reverse leakage current VF(2) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 4 A Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.67 x IF(AV) + 0.04 IF2(RMS) 2/14 DocID17391 Rev 2 Min. Typ. - Max. 3 - 2 20 - 0.95 1.05 - 0.76 0.83 Unit µA V STTH4R02-Y Characteristics Table 5: Dynamic characteristics Symbol Parameters Reverse recovery time trr 1.1 Test conditions IRM Reverse recovery current trr Reverse recovery time Qrr Reverse recovery charges Tj = 25 °C Min. Typ. Max. IF = 1 A; dIF/dt = -50 A/μs; VR = 30 V - 24 30 IF = 1 A; dIF/dt = -100 A/μs; VR = 30 V - 16 20 - 4.4 5.5 - 27 ns - 60 nC ns IF = 4 A; dIF/dt = -200 A/μs; VR = 160 V Tj = 125 °C Unit A Characteristics (curves) Figure 2: Forward voltage drop versus forward current (typical values) Figure 1: Peak current versus duty cycle IFM(A) 50 IM(A) 1.0E+02 T 45 40 Tj=150°C 1.0E+01 δ= tp/T 35 tp P=5W 30 25 Tj=25°C 1.0E+00 P=2W 20 15 10 δ 5 1.0E-01 P=1W 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 VFM (V) 1.0 1.0E-02 0.0 Figure 3: Forward voltage drop versus forward current (maximum values) 1.0E+02 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Figure 4: Relative variation of thermal impedance, junction to case, versus pulse duration IFM(A) 1.0 Tj =150°C Zth(j-c)/Rth(j-c) 1.0E+01 DPAK Tj =25°C 1.0E+00 Single pulse 1.0E-01 t (s) P VFM(V) 1.0E-02 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.1 1.E-03 1.E-02 1.E-01 1.E+00 3.5 DocID17391 Rev 2 3/14 Characteristics STTH4R02-Y Figure 5: Relative variation of thermal impedance, junction to ambient, versus pulse duration (SMB) Figure 6: Relative variation of thermal impedance, junction to ambient, versus pulse duration (SMC) Zth(j-a)/Rth(j-a) 1.0 0.9 1.0 SMB S CU = 1 cm² 0.8 Zth(j-a)/Rth(j-a) 0.9 SMC SCU = 1 cm² 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 0.1 t (s) P 0.0 1.E-01 1.E+00 1.E+01 1.E+02 120 OSC 1.E+01 1.E+02 1.E+03 Figure 8: Reverse recovery charges versus dlF/dt (typical values) C(pF) F = 1 MHz V = 30 mV 1.E+00 1.E+03 Figure 7: Junction capacitance versus reverse applied voltage (typical values) 100 tP(s) 0.0 1.E-01 QRR(nC) I =4A F V R = 160 V 100 RMS T = 125 °C j T = 25 °C j 80 60 T = 25 °C j 40 20 VR(V) 10 1 10 100 Figure 9: Reverse recovery time versus dlF/dt (typical values) 70 0 50 100 150 200 250 300 350 400 450 500 Figure 10: Peak reverse recovery current versus dlF/dt (typical values) 10 t (ns) 80 RR dl /dt (A/µs) F 0 1000 IRM(A) IF = 4 A VR = 160 V IF = 4 A VR= 160 V 8 60 50 40 Tj = 125 °C 6 Tj = 25 °C Tj = 125 °C 4 30 20 10 T j = 25 °C 2 dlF/dt (A/µs) 0 10 100 1000 dlF/dt (A/µs) 0 0 4/14 DocID17391 Rev 2 50 100 150 200 250 300 350 400 450 500 STTH4R02-Y Characteristics Figure 11: Dynamic parameters versus junction temperature Figure 12: Thermal resistance, junction to ambient, versus copper surface under tab Rth(j-a) (°C/W) 100 1.4 DPAK QRR; IRM [Tj] / QRR; IRM [Tj = 125 °C] 90 IF = 4 A VR = 160 V 1.2 80 70 1.0 IRM 60 0.8 50 Q RR 40 0.6 30 0.4 10 dlF/dt (A/µs) 0.0 25 50 75 100 125 0 150 5 10 15 20 25 30 35 Rth(j-a)(°C/W) Epoxy printed board FR4, copper thickness = 35 µm Epoxy printed board FR4, copper thickness = 35 µm 40 Figure 14: Thermal resistance, junction to ambient, versus copper surface under each lead 160 Rth(j-a)(°C/W) 180 SCu(cm²) 0 Figure 13: Thermal resistance, junction to ambient, versus copper surface under each lead 200 Epoxy printed board FR4, e CU= 35 µm 20 0.2 SMC 140 SMB 120 160 140 100 120 80 100 80 60 60 40 40 20 S CU(cm²) 20 SCU(cm²) 0 0 1 2 3 4 5 6 7 8 9 10 0 0 DocID17391 Rev 2 1 2 3 4 5 6 7 8 9 5/14 10 Package information 2 STTH4R02-Y Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 DPAK package information Figure 15: DPAK package outline 6/14 DocID17391 Rev 2 STTH4R02-Y Package information Table 6: DPAK mechanical data Dimensions Dim. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 5.20 5.40 0.205 0.213 c 0.45 0.60 0.018 0.024 c2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.236 0.244 D1 4.95 5.25 0.201 E 6.40 6.60 0.252 E1 4.60 4.70 4.80 0.181 0.185 0.189 e 2.16 2.28 2.40 0.085 0.090 0.094 e1 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.398 L 1.00 1.50 0.039 0.059 (L1) 2.60 2.80 3.00 0.102 0.110 0.118 L2 0.65 0.80 0.95 0.026 0.031 0.037 L4 0.60 1.00 0.024 R V2 5.10 0.20 0° 0.195 0.207 0.260 0.039 0.008 8° DocID17391 Rev 2 0° 8° 7/14 Package information STTH4R02-Y Figure 16: DPAK recommended footprint (dimensions are in mm) 8/14 DocID17391 Rev 2 STTH4R02-Y 2.2 Package information SMC package information Figure 17: SMC package outline Table 7: SMC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 2.90 3.20 0.1142 0.1260 c 0.15 0.40 0.0059 0.0157 D 5.55 6.25 0.2185 0.2461 E 7.75 8.15 0.3051 0.3209 E1 6.60 7.15 0.2598 0.2815 E2 4.40 4.70 0.1732 0.1850 L 0.75 1.50 0.0295 0.0591 DocID17391 Rev 2 9/14 Package information STTH4R02-Y Figure 18: SMC recommended Footprint 1.54 (0.061) 5.11 (0.201) 3.14 (0.124) 8.19 (0.323) millimeters (inches) 2.3 SMB package information Figure 19: SMB package outline 10/14 DocID17391 Rev 2 1.54 (0.061) STTH4R02-Y Package information Table 8: SMB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 1.95 2.20 0.0768 0.0867 c 0.15 0.40 0.0059 0.0157 D 3.30 3.95 0.1299 0.1556 E 5.10 5.60 0.2008 0.2205 E1 4.05 4.60 0.1594 0.1811 L 0.75 1.50 0.0295 0.0591 Figure 20: SMB recommended Footprint 1.62 0.064 2.60 (0.102) 1.62 0.064 2.18 (0.086) 5.84 (0.230) millimeters (inches) DocID17391 Rev 2 11/14 Ordering information 3 STTH4R02-Y Ordering information Figure 21: Ordering information scheme STTH 4 R 02 xxx Ultrafast switching diode Average forward current 4= 4A Model R Repetitive peak reverse voltage 02 = 200 V Package BY-TR = DPAK in tape and reel UY = SMB in tape and reel SY = SMC in tape and reel Table 9: Ordering information 12/14 Order code Marking Package Weight Base qty. Delivery mode STTH4R02BY-TR STTH4 R02BY DPAK 0.320 g 2500 Tape and reel STTH4R02UY 4R2UY SMB 0.110 g 2500 Tape and reel STTH4R02SY 4R2SY SMC 0.243 g 2500 Tape and reel DocID17391 Rev 2 STTH4R02-Y 4 Revision history Revision history Table 10: Document revision history Date Revision 03-Dec-2010 1 First issue 2 Added device in DPAK. Updated features and description in cover page. Updated Table 2: "Absolute ratings (limiting values at 25 °C, unless otherwise specified)", Table 3: "Thermal parameters" and Table 5: "Dynamic characteristics". Updated Figure 2: "Forward voltage drop versus forward current (typical values)" and Figure 3: "Forward voltage drop versus forward current (maximum values)". Updated Section 4: "Ordering information". 14-Apr-2016 Changes DocID17391 Rev 2 13/14 STTH4R02-Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 14/14 DocID17391 Rev 2