STTH4R02FP

STTH4R02 Ultrafast recovery diode Datasheet  production data Description $ . The STTH4R02 uses ST's new 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. $ . $ . 60% Packaged in DPAK, SMB and SMC, this device is intended for use in low voltage, high frequency inverters, freewheeling and polarity protection. 60& Table 1. Device summary . . 1& 1& $ $ '3$. Symbol Value IF(AV) 4A VRRM 200 V VF (typ) 0.76 V Tj (max) 175 °C trr (typ) 16 ns Features  Negligible switching losses  High junction temperature  Very low conduction losses  Low forward and reverse recovery times  ECOPACK®2 compliant component for DPAK on demand November 2016 This is information on a product in full production. DocID12360 Rev 6 1/14 www.st.com 14 Characteristics 1 STTH4R02 Characteristics Table 2. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Unit 200 V DPAK 10 SMB / SMC 70 A Average forward current, δ = 0.5, square wave DPAK IF(AV) Tc = 160 °C SMB / SMC TL = 95 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal Tstg Storage temperature range Maximum operating junction temperature Tj Value 4 A 70 A -65 to +175 °C 175 °C Max. value Unit Table 3. Thermal parameters Symbol Parameter Rth(j-c) Junction to case DPAK 3.5 Rth(j-l) Junction to lead SMB / SMC 20 °C/W Table 4. Static electrical characteristics Symbol IR(1) VF (2) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Forward voltage drop Tj = 25 °C Tj = 150 °C Min. - VR = VRRM IF = 12 A IF = 4 A µA 20 - 1.15 1.25 - 0.95 1.05 - 0.76 0.83 To evaluate the conduction losses, use the following equation: DocID12360 Rev 6 Unit 3 2 1. Pulse test: tp = 5 ms,  < 2% P = 0.67 x IF(AV) + 0.04 x IF2(RMS) Max. - 2. Pulse test: tp = 380 µs,  < 2% 2/14 Typ. V STTH4R02 Characteristics Table 5. Dynamic electrical characteristics Symbol trr IRM tfr Parameter Reverse recovery time Reverse recovery current Tests conditions IF = 1 A dIF/dt = -50 A/µs VR = 30 V - IF = 1 A dIF/dt = -100 A/µs VR = 30 V - 16 20 IF = 4 A Tj = 125 °C dIF/dt = -200 A/µs VR = 160 V - 4.4 5.5 IF = 4 A dIF/dt = 50 A/µs VFR = 1.1 x VFmax - 80 ns IF = 4 A dIF/dt = 50 A/µs - 1.6 V Tj = 25 °C Forward recovery time Tj = 25 °C VFP Forward recovery voltage Min. Typ. Max. Unit DocID12360 Rev 6 24 30 ns A 3/14 Characteristics STTH4R02 Figure 1. Peak current versus duty cycle Figure 2. Forward voltage drop versus forward current (typical values) ,)$ , $  0  7    į WS7  WS 7  ƒ& 3 :  M   3 :  7  ƒ& M    į  9 9 ) 3 :               Figure 3. Forward voltage drop versus forward current (maximum values)         Figure 4. Relative variation of thermal impedance, junction to case, versus pulse duration ,)$   =WKMF5WKMF '3$. 6LQJOHSXOVH   7  ƒ& M    7  ƒ& M    9 9 )          Figure 5. Relative variation of thermal impedance, junction to ambient, versus pulse duration (SMB)  =WKMD5WKMD                ( 4/14 ( ( ( ( 60& 6&8 FPð   W3V ( ( =WKMD5WKMD   ( Figure 6. Relative variation of thermal impedance, junction to ambient, versus pulse duration (SMC)  60% 6&8 FPð W3V  (  ( DocID12360 Rev 6 W3V ( ( ( ( STTH4R02 Characteristics Figure 7. Junction capacitance versus reverse applied voltage (typical values) 4UUQ& &S)  Figure 8. Reverse recovery charges versus dIF/dt (typical values)  ) 0+] 9RVF P9506 7M ƒ&  ,  $ ) 95 9 7  ƒ& M   7  ƒ& M   959     WUUQV  ,  $ ) 95 9  7  ƒ&  7  ƒ& M M 7  ƒ&  M     7  ƒ& M  GO GW$—V )    GO GW$—V )    Figure 11. Dynamic parameters versus junction temperature (reference: Tj = 125 °C) ,  $ ) 95 9           Figure 12. Thermal resistance, junction to ambient, versus copper surface under each lead  5WKMDƒ&: (SR[\SULQWHGERDUG)5FRSSHUWKLFNQHVV —P   '3$.   ,  50   4  UU                  ,50$ ,  $ ) 95 9    Figure 10. Peak reverse recovery current versus dIF/dt (typical values)      Figure 9. Reverse recovery time versus dIF/dt (typical values)  GO GW$—V )   7 ƒ& M 6 FPð &8        DocID12360 Rev 6         5/14 Characteristics STTH4R02 Figure 13. Thermal resistance, junction to ambient, versus copper surface under each lead  Figure 14. Thermal resistance, junction to ambient, versus copper surface under tab 5WKMDƒ&:  5WKMDƒ&:  (SR[\SULQWHGERDUG)5FRSSHUWKLFNQHVV —P  (SR[\SULQWHGERDUG)5FRSSHUWKLFNQHVV —P 60%              6 FPð 6 FPð &8   6/14 60&          &8       DocID12360 Rev 6           STTH4R02 2 Package information Package information  Epoxy meets UL94,V0  Cooling method: by conduction (C)  Band indicates cathode In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 DPAK package information Figure 15. DPAK package outline ( $ E F 7KHUPDOSDG ( / ' ' 5 + / $ E H H 5 F $ / /  Note: 9 *DXJH SODQH This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID12360 Rev 6 7/14 Package information STTH4R02 Table 6. DPAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.214 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.264 E1 4.32 5.50 0.170 0.216 e 2.28 0.090 e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.00 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° 8° Figure 16. DPAK footprint dimensions (in mm)      % 7KHGHYLFHPXVWEHSRVLWLRQHGZLWKLQ 8/14 DocID12360 Rev 6   $ % $ STTH4R02 2.2 Package information SMB package information Figure 17. SMB package outline ( ' ( $ $ F E / Table 7. SMB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 DocID12360 Rev 6 9/14 Package information STTH4R02 Figure 18. SMB footprint, dimensions in mm (inches)       10/14   DocID12360 Rev 6   STTH4R02 2.3 Package information SMC package information Figure 19. SMC package outline ( ' ( $ $ F ( / DocID12360 Rev 6 E 11/14 Package information STTH4R02 Table 8. SMC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 (1) b 2.90 3.20 0.114 0.126 c(1) 0.15 0.40 0.006 0.016 D 5.55 6.25 0.218 0.246 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 L 0.75 1.50 0.030 0.059 1. Dimensions b and c apply to plated leads Figure 20. SMC footprint, dimensions in mm (inches)       12/14   DocID12360 Rev 6   STTH4R02 3 Ordering information Ordering information Table 9. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode STTH4R02B-TR STTH 4R02 DPAK 0.32 g 2500 Tape and reel STTH4R02U 4R2U SMB 0.110 g 2500 Tape and reel STTH4R02S 4R2S SMC 0.243 g 2500 Tape and reel Revision history Table 10. Document revision history Date Revision Changes 03-May-2006 1 First issue. 10-Oct-2006 2 Added SMC package 13-Apr-2010 3 Updated ECOPACK statement. Updated dimensions tables for SMB and SMC. 01-Jul-2010 4 Separated junction to lead values from junction to case values in Table 3. 20-Nov-2014 5 Removed TO-220AC, TO-220FPAC and DO-201AB package informations. 02-Nov-2016 6 Updated DPAK package information and reformatted to current standard. DocID12360 Rev 6 13/14 STTH4R02 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 14/14 DocID12360 Rev 6