SiP32411
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Vishay Siliconix
2 A, 1.2 V, Slew Rate Controlled Load Switch
DESCRIPTION
FEATURES
The SiP32411 is a slew rate controlled load switch that is
designed for 1.1 V to 5.5 V operation.
The device guarantees low switch on-resistance at 1.2 V
input. It features a controlled soft-on slew rate of typical
150 μs that limits the inrush current for designs of capacitive
load or noise sensitive loads.
The device features a low voltage control logic interface
(on/off interface) that can interface with low voltage digital
control without extra level shifting circuit. It also integrates
an output discharge switch that enables fast shutdown load
discharge. When the switch is off, it provides the reverse
blocking to prevent high current flowing into the power
source.
The SiP32411DN is in TDFN4 package of 1.2 mm by
1.6 mm. It supports over 2 A of continuous current. The
SiP32411DR is in SC-70-6 package.
• 1.1 V to 5.5 V operation voltage range
• 62 m typical from 2 V to 5 V for SiP32411DN
• 101 m typical from 2 V to 5 V for SiP32411DR
• Low RON down to 1.2 V
• Slew rate controlled turn-on: 150 μs at 3.6 V
Available
• Fast shutdown load discharge
• Low quiescent current
< 1 μA when disabled
6.7 μA at VIN = 1.2 V
• Switch off reversed blocking
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Cellular phones
• Portable media players
• Digital camera
• GPS
• Computers
• Portable instruments and healthcare devices
TYPICAL APPLICATION CIRCUIT
VIN
IN
OUT
VOUT
SiP32411
C IN
4.7 µF
C OUT
0.1 µF
EN
GND
EN
GND
GND
Fig. 1 - SiP32411 Typical Application Circuit
ORDERING INFORMATION
TEMPERATURE RANGE
-40 °C to 85 °C
PACKAGE
MARKING
PART NUMBER
SC-70-6
MBxx
SiP32411DR-T1-GE3
TDFN4 1.2 mm x 1.6 mm
Ex
SiP32411DNP-T1-GE4
Notes
• x = lot code
• -GE3 and -GE4 denotes halogen-free and RoHS-compliant
S20-0532-Rev. G, 06-Jul-2020
Document Number: 66710
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SiP32411
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ABSOLUTE MAXIMUM RATINGS
PARAMETER
LIMIT
Supply input voltage (VIN)
Enable input voltage (VEN)
Maximum pulsed current (IDM) VIN
(pulsed at 1 ms, 10 % duty cycle)
-0.3 to VIN +0.3
SC-70-6 package
1.8
TDFN4 1.2 mm x 1.6 mm
2.4
SC-70-6 package
2.2
TDFN4 1.2 mm x 1.6 mm
Junction temperature (TJ)
Power dissipation (PD) a
A
3
ESD rating (HBM)
Thermal tesistance (JA) a
V
-0.3 to 6
Output voltage (VOUT)
Maximum continuous switch current (Imax.)
UNIT
-0.3 to 6
4000
V
-40 to +125
°C
6 pin SC-70-6 b
240
4 pin TDFN4 1.2 mm x 1.6 mm c
170
6 pin SC-70- 6 b
230
4 pin TDFN4 1.2 mm x 1.6 mm c
324
°C/W
mW
Notes
a. Device mounted with all leads and power pad soldered or welded to PC board, see PCB layout
b. Derate 4.5 mW/°C above TA = 70 °C, see PCB layout
c. Derate 5.9 mW/°C above TA = 70 °C, see PCB layout
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating/conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING RANGE
PARAMETER
LIMIT
UNIT
Input voltage range (VIN)
1.1 to 5.5
V
Operating temperature range
-40 to 85
°C
S20-0532-Rev. G, 06-Jul-2020
Document Number: 66710
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SiP32411
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SPECIFICATIONS
PARAMETER
Operating voltage c
Quiescent current
SYMBOL
TEST CONDITIONS UNLESS SPECIFIED
VIN = 5, TA = -40 °C to 85 °C
(Typical values are at TA = 25 °C)
VIN
IQ
LIMITS
-40 °C TO 85 °C
MIN. a
UNIT
TYP. b
MAX. a
1.5
-
5.5
VIN = 1.2 V, EN = active
-
6.7
14
VIN = 1.8 V, EN = active
-
14
24
VIN = 2.5 V, EN = active
-
25
40
VIN = 3.6 V, EN = active
-
40
60
VIN = 4.3 V, EN = active
-
52
75
99
VIN = 5 V, EN = active
-
71
Off supply current
IQ(off)
EN = inactive, OUT = open
-
-
1
Off switch current
IDS(off)
EN = inactive, OUT = GND
-
-
1
IRB
VOUT = 5 V, VIN = 1.2 V, VEN = inactive
Reverse blocking current
SC-70-6
On-resistance
RDS(on)
TDFN4
1.2 mm
x 1.6 mm
On-resistance temperature
coefficient
EN input low voltage c
EN input high voltage c
TCRDS
VIL
VIH
-
-
10
VIN = 1.2 V, IL = 100 mA, TA = 25 °C
-
105
125
VIN = 1.8 V, IL = 100 mA, TA = 25 °C
-
101
120
VIN = 2.5 V, IL = 100 mA, TA = 25 °C
-
101
120
VIN = 3.6 V, IL = 100 mA, TA = 25 °C
-
101
120
VIN = 4.3 V, IL = 100 mA, TA = 25 °C
-
101
120
VIN = 5 V, IL = 100 mA, TA = 25 °C
-
101
120
VIN = 1.2 V, IL = 100 mA, TA = 25 °C
-
66
76
VIN = 1.8 V, IL = 100 mA, TA = 25 °C
-
62
72
VIN = 2.5 V, IL = 100 mA, TA = 25 °C
-
62
72
VIN = 3.6 V, IL = 100 mA, TA = 25 °C
-
62
72
VIN = 4.3 V, IL = 100 mA, TA = 25 °C
-
62
72
VIN = 5 V, IL = 100 mA, TA = 25 °C
-
62
72
SC-70-6 package
-
4300
-
TDFN4 1.2 mm x 1.6 mm package
-
3400
-
VIN = 1.2 V
-
-
0.3
VIN = 1.8 V
-
-
0.4 d
VIN = 2.5 V
-
-
0.5 d
VIN = 3.6 V
-
-
0.6 d
VIN = 4.3 V
-
-
0.7 d
VIN = 5 V
-
-
0.8 d
VIN = 1.2 V
0.9 d
-
-
VIN = 1.8 V
1.2 d
-
-
VIN = 2.5 V
1.4 d
-
-
VIN = 3.6 V
1.6 d
-
-
VIN = 4.3 V
1.7 d
-
-
VIN = 5 V
1.8
-
-
V
μA
m
ppm/°C
V
EN Input leakage
ISINK
VEN = 5.5 V
-1
-
1
μA
Output pull-down resistance
RPD
EN = inactive, TA = 25 °C
-
217
280
Output turn-on delay time
td(on)
-
140
210
Output turn-on rise time
t(on)
VIN = 3.6 V, Rload = 10 , TA = 25 °C
80
150
220
Output turn-off delay time
td(off)
-
0.27
1
μs
Notes
a. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum
b. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing
c. For VIN outside this range consult typical EN threshold curve
d. Not tested, guarantee by design
S20-0532-Rev. G, 06-Jul-2020
Document Number: 66710
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SiP32411
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Vishay Siliconix
PIN CONFIGURATION
1
OUT
N/C
6
EN
GND
2
5
GND
EN
3
4
IN
4
1
OUT
2
GND
GND
IN
3
Bottom View
Top View
Fig. 2 - SC-70-6 Package
Fig. 3 - TDFN4 1.2 mm x 1.6 mm Package
PIN DESCRIPTION
PIN NUMBER
SC-70-6
TDFN4
4
3
2, 5
2
3
4
1
1
NAME
FUNCTION
IN
GND
EN
OUT
This pin is the n-channel MOSFET drain connection. Bypass to ground through a 2.2 μF capacitor
Ground connection
Enable input
This pin is the n-channel MOSFET source connection. Bypass to ground through a 0.1 μF capacitor
TYPICAL CHARACTERISTICS (internally regulated, 25 °C, unless otherwise noted)
100
80
VIN = 5 V
70
IQ - Quiescent Current (μA)
IQ - Quiescent Current (μA)
80
60
40
20
60
50
VIN = 3.6 V
40
30
20
VIN = 1.2 V
10
0
1.0
1.5
2.0
2.5
3.0 3.5
VIN (V)
4.0
4.5
5.0
0
- 40
5.5
0
20
40
60
80
100
Temperature (°C)
Fig. 4 - Quiescent Current vs. Input Voltage
Fig. 6 - Quiescent Current vs. Temperature
0.9
1000
0.8
100
IQ(OFF) - Off Supply Current (nA)
IQ(OFF) - Off Supply Current (nA)
- 20
0.7
0.6
0.5
0.4
0.3
0.2
VIN = 5 V
10
VIN = 3.6 V
1
0.1
0.01
0.001
0.1
VIN = 1.2 V
0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VIN (V)
Fig. 5 - Off Supply Current vs. Input Voltage
S20-0532-Rev. G, 06-Jul-2020
0.0001
- 40
- 20
0
20
40
Temperature (°C)
60
80
100
Fig. 7 - Off Supply Current vs. Temperature
Document Number: 66710
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SiP32411
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TYPICAL CHARACTERISTICS (internally regulated, 25 °C, unless otherwise noted)
1000
0.9
IDS(off) - Off Switch Current (nA)
IDS(off) - Off Switch Current (nA)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
100
VIN = 5 V
10
VIN = 3.6 V
1
0.1
0.01
VIN = 1.2 V
0.1
0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.001
- 40
5.5
- 20
0
Fig. 8 - Off Switch Current vs. Input Voltage
60
80
100
85
TDFN4 1.2 mm x 1.6 mm package
TDFN4 1.2 mm x 1.6 mm package
74
80
72
75
RDS - On-Resistance (mΩ)
RDS - On-Resistance (mΩ)
40
Fig. 11 - Off Switch Current vs. Temperature
76
IO = 2 A
70
68
IO = 1.5 A
66
IO = 1.0 A
64
62
IO = 0.1 A
VIN = 5 V
70
65
60
55
50
IO = 0.5 A
60
1.0
IO = 0.1 A
45
1.5
2.0
2.5
3.0 3.5
VIN (V)
4.0
4.5
5.0
5.5
- 40
Fig. 9 - RDS(on) vs. VIN for TDFN4 package
- 20
0
20
40
60
Temperature (°C)
80
100
Fig. 12 - RDS(on) vs. Temperature for TDFN4 package
130
130
IO = 2 A
125
SC70-6 package
SC70-6 package
120
120
RDS - On-Resistance (mΩ)
RDS - On-Resistance (mΩ)
20
Temperature (°C)
VIN (V)
IO = 1.5 A
115
110
IO = 1.0 A
105
100
95
IO = 0.5 A
IO = 0.1 A
IO = 0.1 A
VIN = 5 V
110
100
90
80
90
85
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VIN (V)
Fig. 10 - RDS(on) vs. VIN for SC-70-6 package
S20-0532-Rev. G, 06-Jul-2020
5.5
70
- 40
- 20
0
20
40
60
80
100
Temperature (°C)
Fig. 13 - RDS(on) vs. Temperature for SC-70-6 package
Document Number: 66710
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TYPICAL CHARACTERISTICS (internally regulated, 25 °C, unless otherwise noted)
300
600
VOUT = VIN = 5 V
VOUT = VIN
RPD - Output Pulldown Resistance (Ω)
RPD - Output Pulldown Resistance (Ω)
550
500
450
400
350
300
250
200
150
100
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
260
240
220
200
180
160
- 40
5.5
- 20
0
20
40
60
80
100
VIN (V)
Temperature (°C)
Fig. 14 - Output Pull Down vs. Input Voltage
Fig. 17 - Output Pull Down vs. Temperature
100
1.5
VIN = 1.2 V
VEN = 0 V
1.4
1.3
10
EN Threshold Voltage (V)
IIN - Input Current (nA)
280
1
0.1
1.2
VIH
1.1
VIL
1.0
0.9
0.8
0.7
0.6
0.01
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.5
1.0
5.5
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VOUT (V)
VIN (V)
Fig. 15 - Reverse Blocking Current vs. Output Voltage
Fig. 18 - EN Threshold Voltage vs. Input Voltage
120
190
t(on) - Rise Switching Time (μs)
td(on) - Turn-On Delay Time (μs)
115
200
VIN = 5 V
CL = 0.1 μF
RL = 10 Ω
110
105
100
95
90
180
170
160
150
140
85
80
- 40
VIN = 5 V
CL = 0.1 μF
RL = 10 Ω
- 20
0
20
40
60
80
100
Temperature (°C)
Fig. 16 - Turn-On Delay Time vs. Temperature
S20-0532-Rev. G, 06-Jul-2020
130
- 40
- 20
0
20
40
Temperature (°C)
60
80
100
Fig. 19 - Rise Time vs. Temperature
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TYPICAL CHARACTERISTICS (internally regulated, 25 °C, unless otherwise noted)
td(off) - Turn-Off Delay Time (μs)
0.22
VIN = 5 V
CL = 0.1 μF
RL = 10 Ω
0.20
0.18
0.16
0.14
0.12
0.10
- 40
- 20
0
20
40
60
80
100
Temperature (°C)
Fig. 20 - Turn-Off Delay Time vs. Temperature
TYPICAL WAVEFORMS
Fig. 21 - Switching (VIN = 3.6 V)
Fig. 23 - Turn-Off (VIN = 3.6 V)
Fig. 22 - Switching (VIN = 5 V)
Fig. 24 - Turn-Off (VIN = 5 V)
S20-0532-Rev. G, 06-Jul-2020
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SiP32411
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BLOCK DIAGRAM
Reverse
Blocking
IN
EN
OUT
Control
Logic
Charge
Pump
Turn-On
Slew Rate
Control
+
-
GND
Fig. 25 - Functional Block Diagram
PCB LAYOUT
Fig. 26 - Top, PCB Layout for TDFN4 1.2 mm x 1.6 mm
(board size: 1" x 1v)
Fig. 28 - Top, PCB Layout for SC-70-6
(board size: 1" x 1")
Fig. 27 - Bottom, PCB Layout for TDFN4 1.2 mm x 1.6 mm
(board size: 1" x 1")
Fig. 29 - Bottom, PCB Layout for SC-70-6
(board size: 1" x 1")
S20-0532-Rev. G, 06-Jul-2020
Document Number: 66710
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SiP32411
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DETAILED DESCRIPTION
SiP32411 is an n-channel power MOSFET designed as high
side load switch with slew rate control to prevent in-rush
current. Once enable the device charge pumps the gate of
the power MOSFET to 5 V gate to source voltage while
controlling the slew rate of the turn on time. The mostly
constant gate to source voltage keeps the on resistance low
through out the input voltage range. When disable, the
output discharge circuit turns on to help pull the output
voltage to ground more quickly. Also in disable mode, the
reverse blocking circuit is activated to prevent current from
going back to the input in case the output voltage is higher
than the input voltage. Input voltage is needed for the
reverse blocking circuit to work properly, it can be as low as
VIN(min.).
APPLICATION INFORMATION
Input Capacitor
While a bypass capacitor on the input is not required, a
2.2 μF or larger capacitor for CIN is recommended in almost
all applications. The bypass capacitor should be placed as
physically close as possible to the SiP32411 to be effective
in minimizing transients on the input. Ceramic capacitors are
recommended over tantalum because of their ability to
withstand input current surges from low impedance sources
such as batteries in portable devices.
Output Capacitor
A 0.1 μF capacitor or larger across VOUT and GND is
recommended to insure proper slew operation. COUT may
be increased without limit to accommodate any load
transient condition with only minimal affect on the SiP32411
turn on slew rate time. There are no ESR or capacitor type
requirement.
for SC-70-6 package and 2.4 A for TDFN4 package, as
stated in the absolute maximum ratings table. However,
another limiting characteristic for the safe operating load
current is the thermal power dissipation of the package. To
obtain the highest power dissipation (and a thermal
resistance of 240 °C/W for SC-70-6 and 170 °C/W for
TDFN4) the power pad of the device should be connected to
a heat sink on the printed circuit board.
The maximum power dissipation in any application is
dependent on the maximum junction temperature,
TJ(max.) = 125 °C, the junction-to-ambient thermal resistance
for the TDFN4 1.2 mm x 1.6 mm package, J-A = 170 °C/W,
and the ambient temperature, TA, which may be
formulaically expressed as:
125 – T A
T J (max.) – T A
P (max.) = --------------------------------- = ---------------------J – A
170
It then follows that, assuming an ambient temperature of
70 °C, the maximum power dissipation will be limited to
about 324 mW.
So long as the load current is below the 2.4 A limit, the
maximum continuous switch current becomes a function
two things: the package power dissipation and the RDS(on) at
the ambient temperature.
As an example let us calculate the worst case maximum
load current at TA = 70 °C. The worst case RDS(on) at 25 °C
occurs at an input voltage of 1.2 V and is equal to 75 m.
The RDS(on) at 70 °C can be extrapolated from this data using
the following formula
RDS(on) (at 70 °C) = RDS(on) (at 25 °C) x (1 + TC x T)
Enable
Where TC is 3400 ppm/°C. Continuing with the calculation
we have
The EN pin is compatible with both TTL and CMOS logic
voltage levels.
RDS(on) (at 70 °C) = 75 m x (1 + 0.0034 x (70 °C - 25 °C)) =
86.5 m
Protection Against Reverse Voltage Condition
The maximum current limit is then determined by
The SiP32411 contains a reverse blocking circuitry to
protect the current from going to the input from the output
in case where the output voltage is higher than the input
voltage when the main switch is off. A supply voltage as low
as the minimum required input voltage is necessary for this
circuitry to work properly.
Thermal Considerations
The SiP32411 is designed to maintain a constant output
load current. Due to physical limitations of the layout and
assembly of the device the maximum switch current is 1.8 A
S20-0532-Rev. G, 06-Jul-2020
P (max.)
I LOAD (max.) ---------------------R DS on
which in case is 1.94 A. Under the stated input voltage
condition, if the 1.94 A current limit is exceeded the internal
die temperature will rise and eventually, possibly damage
the device.
Document Number: 66710
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PRODUCT SUMMARY
Part number
SiP32411
SiP32411
Description
1.1 V to 5 V, 62 m, 150 μs rise time,
output discharge
1.1 V to 5 V, 101 m, 150 μs rise time,
output discharge
Configuration
Single
Single
Slew rate time (μs)
150
150
On delay time (μs)
140
140
Input voltage min. (V)
1.1
1.1
Input voltage max. (V)
5.5
5.5
On-resistance at input voltage min. (m)
66
105
On-resistance at input voltage max. (m)
62
101
Quiescent current at input voltage min. (μA)
6.7
6.7
Quiescent current at input voltage max. (μA)
71
71
Output discharge (yes / no)
Yes
Yes
Reverse blocking (yes / no)
Yes
Yes
Continuous current (A)
2.4
1.8
TDFN4
SC-70-6
1.2 x 1.6 x 0.5
2.0 x 2.0 x 0.5
Package type
Package size (W, L, H) (mm)
Status code
2
2
Product type
Slew rate
Slew rate
Applications
Computers, consumer, industrial,
healthcare, networking, portable
Computers, consumer, industrial,
healthcare, networking, portable
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?66710.
S20-0532-Rev. G, 06-Jul-2020
Document Number: 66710
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Package Information
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TDFN4 1.2 x 1.6 Case Outline
D
D2
4
b
3
Pin #1 ID
(Optional)
4
K
E
E2
3
1
2
e
Index Area
(D/2 x E/2)
Bottom View
A
A1
Top View
A3
1
L
2
Side View
DIM.
MILLIMETERS
INCHES
MIN.
NOM.
MAX.
MIN.
NOM.
MAX.
A
0.45
0.55
0.60
0.017
0.022
0.024
A1
0.00
-
0.05
0.00
-
A3
0.15 REF. or 0.127 REF.
(1)
0.006 or 0.005
0.002
(1)
b
0.20
0.25
0.30
0.008
0.010
0.012
D
1.15
1.20
1.25
0.045
0.047
0.049
D2
0.81
0.86
0.91
0.032
0.034
0.036
e
0.50 BSC
0.020
E
1.55
1.60
1.65
0.061
0.063
0.065
E2
0.45
0.50
0.55
0.018
0.020
0.022
K
L
0.25 typ.
0.25
0.30
0.010 typ.
0.35
0.010
0.012
0.014
ECN: T16-0143-Rev. C, 18-Apr-16
DWG: 5995
Note
(1) The dimension depends on the leadframe that assembly house used.
Revision: 18-Apr-16
Document Number: 65734
1
For technical questions, contact: powerictechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
Vishay Siliconix
SC-70:
3/4/5/6-LEADS (PIC ONLY)
0.15 (0.006)
D
C
e1
A
A
D
N5
N4
N3
E/2
E1/2
E
E/1
0.15 (0.006)
C
Pin 1
N1
N2
B
e
See Detail A
C
0.10 (0.004)
M
C
A
b
B
U1
A2
A
SEATING
PLANE
0.10 (0.004)
C
A1
C
H
(b)
0.15 (0.0059)
b1
c1
GAGE PLANE
c
Base Metal
DETAIL A
SECTIION A-A
Pin
Code
N1
N2
N3
N4
N5
U
L
LEAD COUNT
NOTES:
3
4
5
6
1.
Dimensioning and tolerancing per ANSI Y14.5M-1994.
−
−
2
2
2.
2
2
3
3
Controlling dimensions: millimeters converted to inch dimensions are
not necessarily exact.
−
3
4
4
3.
3
−
−
5
Dimension “D” does not include mold flash, protrusion or gate burr.
Mold flash, protrusion or gate burr shall not exceed 0.15 mm
(0.006 inch) per side.
−
4
5
6
4.
The package top shall be smaller than the package bottom.
Dimension “D” and “E1” are determined at the outer most extremes
of the plastic body exclusive of mold flash, tie bar burrs, gate burrs
and interlead flash, but including any mismatch between the top and
bottom of the plastic body.
Document Number: 73201
19-Nov-04
www.vishay.com
1
Package Information
Vishay Siliconix
MILLIMETERS
INCHES
Dim
Min
Nom
Max
Min
Nom
Max
A
0.80
−
1.10
0.031
−
0.043
A1
0.00
−
0.10
0.000
−
0.004
A2
0.80
0.90
1.00
0.031
0.035
0.040
b
0.15
−
0.30
0.006
−
0.012
b1
0.15
0.20
0.25
0.006
0.008
0.010
c
0.08
−
0.25
0.003
−
0.010
c1
0.08
0.13
0.20
0.003
0.005
0.008
D
1.90
2.10
2.15
0.074
0.082
0.084
E
2.00
2.10
2.20
0.078
0.082
0.086
E1
1.15
1.25
1.35
0.045
0.050
0.055
e
0.65 BSC
0.0255 BSC
e1
1.30 BSC
0.0512 BSC
L
0.26
0.36
0.46
0.010
0.014
0.018
U
0_
−
8_
0_
−
8_
U1
4_
10_
4_
10_
ECN: S-42145—Rev. A, 22-Nov-04
DWG: 5941
www.vishay.com
2
Document Number: 73201
19-Nov-04
PAD Pattern
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR TDFN4 1.2 x 1.6
0.86
0.50
3
1
2
2.0
0.55
0.20
0.50
0.20
4
0.55
0.30
Recommended Minimum Pads
Dimensions in mm
Document Number: 66558
Revision: 05-Mar-10
www.vishay.com
1
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www.vishay.com
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Disclaimer
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