DFP252012TF-2R2M

TAI-TECH P1 Power Inductor DFP252012TF-SERIES ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 13/10/30 新 發 行 楊祥忠 詹偉特 林宜蕰 備 註 www.tai-tech.com.tw TAI-TECH P2 Power Inductor DFP252012TF-SERIES 1. Features 1. This specification applies Low Profile Power Inductors. 2. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension Halogen Pb Halogen-free Pb-free B A D E D C Series A(mm) B(mm) C(mm) D(mm) E(mm) DFP252012TF 2.5 -0.1/+0.2 2.0 -0.05/+0.35 1.2Max 0.85 ref. 0.80 ref. Units: mm 3. Part Numbering DFP 252012 TF A B - R47 M D E C A: Series B: Dimension C: Lead Free Material D: Inductance E: Inductance Tolerance R47=0.47uH M=±20% 4. Specification TAI-TECH Part Number Inductance Tolerance (uH) (%) Test Frequency (Hz) DCR (Ω) typ. DCR (Ω) Max. I sat (A) typ. I sat (A) Max. I rms (A) typ DFP252012TF-R24M 0.24 ±20% 0.1V/1M 0.020 0.024 8.00 6.50 4.70 DFP252012TF-R33M 0.33 ±20% 0.1V/1M 0.027 0.032 5.70 4.60 4.50 DFP252012TF-R47M 0.47 ±20% 0.1V/1M 0.027 0.032 5.50 4.50 4.40 DFP252012TF-R68M 0.68 ±20% 0.1V/1M 0.036 0.043 4.50 3.80 3.60 DFP252012TF-1R0M 1.0 ±20% 0.1V/1M 0.045 0.057 3.90 3.40 3.50 DFP252012TF-1R5M 1.5 ±20% 0.1V/1M 0.080 0.096 3.00 2.60 2.50 0.1V/1M 0.085 0.102 2.70 2.30 2.30 DFP252012TF-2R2M 2.2 ±20% Note: Isat：Based on inductance change （△L/L0：≦-30%）@ ambient temp. 25℃ Irms：Based on temperature rise （△T：40℃.）Max www.tai-tech.com.tw TAI-TECH P3 DFP252012TF-R24 DFP252012TF-R33 0.4 0.5 0.4 Inductance(uH) Inductance(uH) 0.3 0.2 0.1 0.3 0.2 0.1 0 0 2 4 6 8 0 DCcurrent(A) 0 2 4 6 8 DCcurrent(A) DFP252012TF-R47 0.8 DFP252012TF-R68 1 0.8 Inductance(uH) Inductance(uH) 0.6 0.4 0.2 0.6 0.4 0.2 0 0 2 4 6 8 0 DCcurrent(A) 0 1 2 3 4 5 2.4 3 DCcurrent(A) DFP252012TF-1R0 DFP252012TF-1R5 2 2.5 2 Inductance(uH) Inductance(uH) 1.5 1 1.5 1 0.5 0.5 0 0 1 2 3 0 4 0 DCcurrent(A) DFP252012TF-2R2 Inductance(uH) 3 2 1 0 0.5 1 1.2 1.8 DCcurrent(A) 4 0 0.6 1.5 2 2.5 DCcurrent(A) www.tai-tech.com.tw TAI-TECH P4 5. Material List No. Description Specification a. Core Ferrite Core b. Coating Epoxy with magnetic powder c Termination Tin( Pb Free) d Wire Enameled Copper Wire Exposed wire tolerance limit of coating resin part on product side. Size of exposed wire occurring to coating resin is specified below. 1. Width direction（dimension a）：Acceptable when a≦w/2 Nonconforming when a＞w/2 2. Length direction（dimension b）：Dimension b is not specified. 3. The total area of exposed wire occurring to each sides is not greater than 50% of coating resin area, and is acceptable. 6. Reliability and Test Condition Item Operating Temperature Performance Test Condition -55~+125℃(For products in unopened tape package, less than 40℃) Electrical Performance Test Agilent-4291, Agilent-4287 Inductance L Refer to standard electrical characteristic list Agilent-4291 DC Resistance Rated Current Temperature Rise Test Agilent-4338 Base on temp. rise & △L/L0A≦30%. Saturation DC Current (Isat) will cause L0 to drop approximately △L(%). Heat Rated Current (Irms) will cause the coil temperature rise approximately △T(℃) without core loss. ΔT 40℃ Max 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer Mechanical Performance Test Appearance：No damage. Inductance：within±10% of initial value Solder Heat Resistance RDC：within ±15% of initial value and shall not exceed the specification value Temperature (°C) Time (s) Temperature ramp/immersion and emersion rate 260 ±5 (solder temp) 10 ±1 25mm/s±6 mm/s Depth: completely cover the termination Solderability Test More than 95% of terminal electrode should be covered with solder. www.tai-tech.com.tw Preheat: 150℃,60sec.。 Solder: Sn99.5%-Cu0. 5%。 Temperature: 245±5℃。 Flux for lead free: Rosin. 9.5%。 Dip time: 4±1sec。 Depth: completely cover the termination Number of heat cycles 1 TAI-TECH P5 Item Performance Test Condition Reliability Test Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Temperature：125±2℃(Bead) Life Test Temperature： 85±2℃(Inductor) Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Step1：-40±2℃ 30±5min Step2：25±2℃ ≦0.5min Thermal shock Appearance：No damage. Step3：105±2℃ 30±5min Inductance：within±10% of initial value Number of cycles： 500 Measured at room fempraturc after placing for 24±2 hrs RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪R.H, Humidity Resistance Test Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Oscillation Frequency: 10〜2K〜10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Vibration Test www.tai-tech.com.tw TAI-TECH P6 7. Soldering and Mounting 7-1. Soldering Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 7-1.1 Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. 7-1.2 Soldering Iron(Figure 2): Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. •Preheat circuit and products to 150℃ •Never contact the ceramic with the iron tip •Use a 20 watt soldering iron with tip diameter of 1.0mm •355℃ tip temperature (max) •1.0mm tip diameter (max) •Limit soldering time to 4~5 sec. Iron Soldering Reflow Soldering PRE-HEATING SOLDER ING 20~40s PRE-H EATING NATURAL CO OLING TEMPERATURE( C) TEMPERATURE( C) TP(260 C / 40s max.) 217 60~150s 200 150 SOLDERING within 4~5s 60~180s N ATUR AL C OOLING 350 150 Gradual cooling O ver 60s 480s max. 25 TIME(sec.) TIME( sec.) Reflow times: 3 times max. Iron Soldering times: 1 times max. Fig.1 Fig.2 7-2. Recommended PC Board Pattern H L L(mm) G(mm) H(mm) 2.9 0.8 2.4 G www.tai-tech.com.tw TAI-TECH P7 8. Packaging Information 8-1. Reel Dimension C B D A Type A(mm) B(mm) C(mm) D(mm) 7”x8mm 8.4±1.0 50 min. 13±0.8 178±2 7"x8mm 8-2. Tape Dimension / 8mm t P Ao Bo Po:4∮0.1 W:8.0∮0.1 P2:2∮ 0.05 Series Size DFP 252012 Bo(mm) Ao(mm) Ko(mm) P(mm) 2.85±0.1 2.45±0.1 1.40±0.1 4.0±0.1 t(mm) 0.23±0.05 Ko 8-3. Packaging Quantity Chip size 252012 Chip / Reel 2000 8-4. Tearing Off Force F Top cover tape The force for tearing off cover tape is 15 to 80 grams in the arrow direction under the following conditions. 165 to180 Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice •Storage Conditions To maintain the solderability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. •Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw