P1
TAI-TECH
Power Inductor
DFP252012TF-SERIES
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
16/07/26
新 發 行
楊祥忠
詹偉特
孔妍暄
備
註
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P2
TAI-TECH
Power Inductor
DFP252012TF-SERIES
1. Features
1. This specification applies Low Profile Power Inductors.
2. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
2. Dimension
Halogen
Pb
Halogen-free
Pb-free
B
A
D
E
D
C
Series
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
DFP252012TF
2.5 -0.1/+0.2
2.0 -0.05/+0.35
1.2Max
0.85 ref. 0.80 ref.
Units: mm
3. Part Numbering
DFP
252012 TF
A
B
-
R47
M
D
E
C
A: Series
B: Dimension
C: Lead Free
Material
D: Inductance
E: Inductance Tolerance
R47=0.47uH
M=±20%
4. Specification
TAI-TECH
Part Number
Inductance Tolerance
(uH)
(%)
Test
Frequency
(Hz)
DCR
(Ω) typ.
DCR
(Ω) Max.
I sat
(A) typ.
I sat
(A) Max.
I rms
(A) typ
I rms
(A) max
0.1V/1M
0.024
0.028
8.00
6.50
4.70
4.20
DFP252012TF-R24M
0.24
±20%
DFP252012TF-R33M
0.33
±20%
0.1V/1M
0.027
0.032
5.70
4.60
4.50
4.00
DFP252012TF-R47M
0.47
±20%
0.1V/1M
0.027
0.032
5.50
4.50
4.40
3.90
DFP252012TF-R68M
0.68
±20%
0.1V/1M
0.036
0.043
4.50
3.80
3.60
3.20
DFP252012TF-1R0M
1.0
±20%
0.1V/1M
0.045
0.057
3.90
3.40
3.50
3.15
DFP252012TF-1R5M
1.5
±20%
0.1V/1M
0.080
0.096
3.00
2.60
2.50
2.25
DFP252012TF-2R2M
2.2
±20%
0.1V/1M
0.085
0.102
2.70
2.30
2.30
2.00
Note:
Isat:Based on inductance change (△L/L0:≦30%)@ ambient temp. 25℃
Irms:Based on temperature rise (△T:40℃.)Max
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P3
TAI-TECH
DFP252012TF-R24
DFP252012TF-R33
0.4
0.5
0.4
Inductance(uH)
Inductance(uH)
0.3
0.2
0.3
0.2
0.1
0.1
0
0
2
4
6
0
8
0
DCcurrent(A)
2
4
6
8
DCcurrent(A)
DFP252012TF-R68
DFP252012TF-R47
1
0.8
0.8
Inductance(uH)
Inductance(uH)
0.6
0.4
0.2
0.6
0.4
0.2
0
0
0
2
4
6
0
8
1
2
3
4
5
2.4
3
DCcurrent(A)
DCcurrent(A)
DFP252012TF-1R5
DFP252012TF-1R0
2.5
2
2
Inductance(uH)
Inductance(uH)
1.5
1
1.5
1
0.5
0.5
0
0
1
2
3
0
4
0
DCcurrent(A)
DFP252012TF-2R2
Inductance(uH)
3
2
1
0
0.5
1
1.2
1.8
DCcurrent(A)
4
0
0.6
1.5
2
2.5
DCcurrent(A)
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TAI-TECH
5. Material List
No.
Description
Specification
a.
Core
Ferrite Core
b.
Glue
Epoxy with magnetic powder
c
Termination
Tin (Pb Free)
d
Wire
Enameled Copper Wire
Appearance of exposed wire tolerance limit:
1. Width direction(dimension a):Acceptable when a≦w/2
Nonconforming when a>w/2
2. Length direction(dimension b):Dimension b is not specified.
3. The total area of exposed wire occurring to each sides is
not greater than 50% of coating resin area, and is acceptable.
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6. Reliability and Test Condition
Item
Performance
Operating temperature
-40~+125℃ (Including self - temperature rise)
Storage temperature
-40~+125℃ (on board)
Test Condition
Electrical Performance Test
HP4284A,CH11025,CH3302,CH1320,CH1320S
Inductance
Refer to standard electrical characteristics list.
DCR
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation DC Current (Isat) will cause L0
Saturation Current (Isat)
△L≦30% typical.
to drop △L(%)(keep quickly).
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃) without core loss.
Heat Rated Current (Irms)
Approximately △T≦40℃
1.Applied the allowed DC current(keep 1 min.).
2.Temperature measured by digital surface thermometer
Reliability Test
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature: 125±2℃
Life Test
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity:85±2﹪R.H,
Load Humidity
Temperature:85℃±2℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Moisture Resistance
Appearance:No damage.
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature after
placing for 4 hrs.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1:-40±2℃ 30±5min
Thermal
shock
Step2:25±2℃ ≦0.5min
Step3:125±2℃ 30±5min
Number of cycles: 500
Measured at room temperature after placing for 24±2 hrs
Oscillation Frequency: 10~2K~10Hz for 20 minutes
Vibration
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
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Item
Performance
Shock
Appearance:No damage.
Test Condition
Type
Peak value
(g's)
Normal
duration
(D) (ms)
Wave form
Velocity
change
(Vi)ft/sec
SMD
50
11
Half-sine
11.3
Lead
50
11
Half-sine
11.3
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
Bending
Soderability
RDC:within ±15% of initial value and shall not
exceed the specification value
More than 95% of the terminal electrode should
be covered with solder。
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805:40x100x1.2mm
=0805:1.2mm
0805:1kg ,
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