14255R-100

FT 5000 Smart Transceiver FT-X3 Communications Transformer ® Troubleshoot Your Network with Ease The FT 5000 Smart Transceiver is our next-generation chip for smart networks. It is the key product in the LonWorks® 2.0 platform—the next generation of LonWorks products designed to greatly increase the power and capability of LONWORKS enabled devices, while lowering development and node costs. The FT 5000 Smart Transceiver integrates a high-performance Neuron® Core with a free topology twisted-pair transceiver. Combined with the new low-cost FT-X3 Communications Transformer and inexpensive serial memory, the FT 5000 Smart Transceiver provides a lower-cost, higher-performance LONWORKS solution than previous-generation FT Smart Transceivers. Features • 3.3V operation. • Higher-performance Neuron® Core —internal system clock scales up to 80MHz. • Substantial device price reduction. • Serial memory interface for inexpensive external EEPROM and flash non-volatile memories. • Supports up to 254 Network Variables (NVs) and 127 aliases. • Low-cost surface mount FT-X3 Communications Transformer. • User-programmable interrupts provide faster response time to external events. • Includes hardware UART with 16-byte receive and transmit FIFOs. • 7 mm x 7 mm 48-pin QFN package. • Supports polarity-insensitive free topology star, daisy chain, bus, loop, or mixed topology wiring. www.echelon.com ® • Compliant with TP/FT-10 channels using FT 3120®/FT 3150® Smart Transceivers and FTT-10/FTT-10A/ LPT-10/LPT-11 Transceivers. • 12 I/O pins with 35 programmable standard I/O models. Singly-Terminated Bus Topology Star Topology Doubly-Terminated Bus Topology Enhanced Performance • Supports up to 42KB of application code space. • 64KB RAM (44KB user-accessible) and 16KB ROM on-chip memories. • Unique 48-bit Neuron ID in every device for network installation and management. • Very high common-mode noise immunity. • -40°C to +85°C operating temperature range. Description The FT 5000 Smart Transceiver includes three independent 8-bit logical processors to manage the physical MAC layer, the network, and the user application. These are called the Media-Access Control (MAC) processor, the network (NET) processor, and the application (APP) processor, respectively (see Figure 1). At higher system clock rates, there is also a fourth processor to handle interrupts. 12 / NVM (SPI or I2C) 2-6 / I/O Comm Port Serial Memory Interface IRQ CPU 2 / External Transformer APP CPU RAM (64K x 8) NET CPU ROM (16K x 8) MAC CPU SVC~ RST~ XOUT XIN Clock, Reset, and Service JTAG 5 Figure 1: FT 5000 Smart Transceiver Chip The FT 5000 Smart Transceiver supports polarity-insensitive cabling using a star, bus, daisy-chain, loop, or combination topology (see Figure 2). Thus, installers don’t have to follow a strict set of wiring rules imposed by other networking technologies. Instead, they can install wiring in the fastest and most costeffective manner, thereby saving time and money. Free topology wiring also simplifies network expansion by eliminating restrictions on wire routing, splicing, and device placement. Transceiver. The Neuron firmware is pre-programmed into the on-chip ROM. The FT 5000 Smart Transceiver can also be configured to read newer firmware from external memories, allowing the firmware to be upgraded over time. Free Topology Loop Topology = FT device = Terminatior Figure 2: Free Topology Network Configurations The FT-X3 Communications Transformer is a surface mount communications transformer that’s compatible with both the FT 5000 Smart Transceiver and the previous-generation FT 3120/ FT 3150 Smart Transceivers. The FT-X3 Communications Transformer provides equivalent noise immunity to both the FT-X1 and FT-X2 Communication Transformers, the previous-generation communication transformers. However, the FT-X3 Communications Transformer is not pin-compatible with the FT-X2 Communication Transformer (which is also a surface mount transformer). The FT 5000 Smart Transceiver can also be used with the FT-X1 and FT-X2 Communication Transformers. Backward Compatibility The FT 5000 Smart Transceiver is fully compliant with the TP/FT-10 channel and can communicate with devices that use Echelon’s FTT-10/FTT-10A Transceivers, FT 3120/FT 3150 Smart Transceivers, or LPT-10/LPT-11 Link Power Transceivers. The Neuron Core in the FT 5000 Smart Transceiver uses the same instruction set and architecture as the previousgeneration Neuron Core, with two new additional instructions for hardware multiplication and division. The Series 5000 Neuron Core is source code compatible with applications written for the Series 3100 Neuron Core. Applications written for the Series 3100 Neuron Core must be recompiled with the NodeBuilder® FX Development Tool or the Mini FX Evaluation Kit before they can be used with the FT 5000 Smart Transceiver. The FT 5000 Smart Transceiver uses Neuron firmware version 19. Firmware versions prior to version 19 are not compatible with the FT 5000 Smart Faster system clock. The internal system clock for the FT 5000 Smart Transceiver can be user-configured to run from 5MHz to 80MHz. The required external crystal provides a 10MHz clock frequency, and an internal PLL boosts the frequency to a maximum of 80MHz as the internal system clock speed. The previous-generation Neuron 3120/3150 Core divided the external oscillator frequency by two to create the internal system clock. An FT 5000 Smart Transceiver running with an 80MHz internal system clock is thus 16 times faster than a 10MHz Neuron 3120/3150 Core running. The 5MHz internal system clock mode in the FT 5000 Smart Transceiver provides backward compatibility to support timing-critical applications designed for the 10MHz FT 3150 or FT 3120 Smart Transceiver. The Neuron Core inside the FT 5000 Smart Transceiver includes a builtin hardware multiplier and divider to increase the performance of arithmetic operations. Support for more network variables. Because it uses Neuron firmware version 19, the FT 5000 Smart Transceiver supports applications with up to 254 network variables and 127 aliases for Neuron hosted devices (devices without a host microprocessor). A Series 3100 Neuron Chip or Smart Transceiver with Neuron firmware version 15 or earlier supports up to 62 network variables and 62 aliases for Neuron hosted devices. Series 3100 chips with Neuron firmware version 16 or later support up to 254 network variables. You must use the NodeBuilder FX Development Tool to take advantage of 254 network variables. Interrupts. The FT 5000 Smart Transceiver lets developers define application interrupts to handle asynchronous events triggered by selected state changes on any of the 12 I/O pins, by on-chip hardware timer-counter units, or by an on-chip high-performance hardware system timer. An application uses the Neuron C interrupt() clause to define the interrupt condition and the interrupt task that handles the condition. The Neuron C program runs the interrupt task www.echelon.com ® whenever the interrupt condition is met. See the Neuron C Programmer’s Guide for more information about writing interrupt tasks and handling interrupts. JTAG. The FT 5000 Smart Transceiver provides an interface for the Institute of Electrical and Electronics Engineers (IEEE) Standard Test Access Port and BoundaryScan Architecture (IEEE 1149.1-1990) of the Joint Test Action Group (JTAG) to allow a Series 5000 chip to be included in the boundary-scan chain for device production tests. A Boundary Scan Description Language (BSDL) file for the FT 5000 Smart Transceiver can be downloaded from Echelon’s Web site. I/O Pins and Counters The FT 5000 Smart Transceiver provides 12 bidirectional I/O pins that are 5V-tolerant and can be configured to operate in one or more of 35 predefined standard input/output models. The chip also has two 16-bit timer/counters that reduce the need for external logic and software development. Memory Architecture The FT 5000 Smart Transceiver uses inexpensive external serial EEPROM and flash memories for non-volatile application and data storage, and optionally for future Neuron firmware upgrades. It has 16KB of ROM and 64KB (44KB user-accessible) of RAM on the chip. It has no on-chip non-volatile memory (EEPROM or flash) for application use. Each chip, however, contains its unique Neuron identifier (Neuron ID) in an on-chip, non-volatile, read-only memory. The application code and configuration data are stored in the external nonvolatile memory (NVM) and copied into the internal RAM during device reset; the instructions then execute from internal RAM. Writes to NVM are shadowed in the internal RAM and pushed out to external NVM by the Neuron firmware (see Figure 2). The application does not manage NVM directly. External memories supported. The FT 5000 Smart Transceiver supports two serial interfaces for accessing off-chip, nonvolatile memories: serial InterIntegrated Circuit (I2C) and serial peripheral interface (SPI). EEPROM and flash memory devices can use either the I2C interface or the SPI interface. However, at the time of publication, there are no serial flash parts that use the I2C protocol and meet the required specifications for the Series 5000 external memory interface. External serial EEPROMs and flash devices, which are inexpensive and come in very small form factors, are available from multiple vendors. 3.3 V The FT 5000 Smart Transceiver requires at least 2KB of off-chip memory available in an EEPROM device to store the configuration data. The application code can be stored either in the EEPROM (by using a largercapacity EEPROM device) or in a flash memory device used in addition to the 2KB (minimum) EEPROM. Thus, the external memory for the FT 5000 Smart Transceiver has one of the configurations listed in Table 1: Configuration 1 2 3 4 EEPROM I2C SPI SPI Comments ☑ A single I2C EEPROM memory device, from 2KB to 64KB in size. ☑ One I2C EEPROM (at least 2KB in size, up to 64KB in size, but the system uses only the first 2KB of the EEPROM memory). One SPI flash memory device. ☑ ☑ A single SPI EEPROM memory device, from 2KB to 64KB in size. ☑ ☑ One SPI EEPROM (at least 2KB in size, up to 64KB in size, but the system uses only the first 2KB of the EEPROM memory). One SPI flash memory device. Table 1: Allowed External Memory Device Configurations As Table 1 shows, the FT 5000 Smart Transceiver supports using a single EEPROM memory device, or a single EEPROM memory device plus a single flash memory device. If the FT 5000 Smart Transceiver detects an external flash memory device, the flash memory represents the entire user nonvolatile memory for the device. That is, any additional EEPROM memory beyond the mandatory 2KB is not used. Using the I2C interface. When using the I2C interface for external EEPROM, the FT 5000 Smart Transceiver is always the master I2C device (see Figure 3). The clock speed supported for the I2C serial memory interface is 400kHz (fast I2C mode). The I2C memory device must specify I2C address 0. Both 1-byte and 2-byte address modes are supported, but 3-byte addressing mode is not. SCL Series 5000 Chip SDA_CS1~ MISO I2C Slave (EEPROM) Figure 3: Using the I2C Interface for External NVM EEPROM Memory Memory devices supported. The FT 5000 Smart Transceiver supports any EEPROM device that uses the SPI or I2C protocol, and meets the clock speed and addressing requirements described above. While all EEPROM devices have a uniform write procedure, flash devices from various manufacturers differ slightly in their write procedure. Thus, a small library routine is stored in the external EEPROM device that helps the system write successfully to the external flash device. Echelon has qualified the following SPI flash memory devices for use with the FT 5000 Smart Transceiver: • Atmel® AT25F512B 512-Kilobit 2.7-volt Minimum SPI Serial Flash Memory. • Numonyx™ M25P05-A 512-Kbit, serial flash memory, 50MHz SPI bus interface. • Silicon Storage Technology SST25VF512A 512 Kbit SPI Serial Flash. Additional devices may be qualified in the future. Memory map. An FT 5000 Smart Transceiver has a memory map of 64KB. A Neuron C application program uses this memory map to organize its memory and data access. The memory map is a logical view of device memory, rather than a physical view, because the chip’s processors only directly access RAM. The memory map divides the FT 5000 Smart Transceiver’s physical 64KB RAM into the following types of logical memory, as shown in Figure 6: • Neuron firmware image (stored in on-chip ROM or external NVM). • On-chip RAM or NVM. Memory ranges for each are configurable within the device hardware template. The non-volatile memory represents www.echelon.com 0xF800 to 0xFFFF 0xF000 to 0xF7FF 0xE800 to 0xEFFF Reserved Mandatory EEPROM On-Chip RAM 2 KB 2 KB 2 KB Extended Memory (Configurable as: Extended RAM or Non-volatile memory) 42 KB Migration Considerations Most device designs that use the previous-generation FT 3120/3150 Smart Transceiver can transition to the FT 5000 Smart Transceiver. However, because the two generations have different supply voltage and memory architecture, hardware redesign of the boards is required to transition to the FT 5000 Smart Transceiver. See the Series 5000 Chip Data Book for more information about migrating device designs for FT 3120/3150 Smart Transceivers to the FT 5000 Smart Transceiver. 0x4000 to 0xE7FF On-Chip ROM 16 KB 0x0000 to 0x3FFF Figure 6: FT 5000 Smart Transceiver Memory Map Programming memory devices. Because the FT 5000 Smart Transceiver does not have any on-chip user-accessible NVM, only the external serial EEPROM or flash devices need to be programmed with the application and configuration data. The memory devices can be programmed in any of the following ways: • In-circuit programming on the board. • Over the network. • Pre-programming before soldering on the board. Noise Immunity A LonWorks device based on the FT 5000 Smart Transceiver is composed of two components: the FT 5000 Smart Transceiver and an external End-to-End Solutions A typical FT 5000 Smart Transceiverbased device requires a power source, crystal, external memory, and an I/O interface to the device being controlled (see Figure 7 for a typical FT 5000 Smart Transceiver-based device). MOSI SCK MISO SCL VDD1V8 SDA_CS1~ VDD3V3 VDD3V3 CS0~ CP4 RXON TXON 47 46 45 44 43 42 41 40 39 38 37 NC IO1 3 34 NETP IO2 4 33 AGND IO3 5 32 NETN VDD1V8 6 31 AVDD3V3 IO4 7 30 VDD3V3 VDD3V3 8 29 VIN3V3 IO5 9 28 RST~ IO6 10 27 VOUT1V8 IO7 11 26 GNDPLL IO8 12 25 VDDPLL 16 17 18 19 20 21 22 23 24 VDD1V8 TRST~ VDD3V3 TCK TMS TDI TDO XIN XOUT FT 5000 Smart Transceiver 15 The FT 5000 Smart Transceiver and the FT-X3 Communications Transformer are designed to be used as a pair, and therefore must be implemented together in all designs. No transformer other than the FT-X3 (or FT-X1 or FT-X2) communications transformer may be used with the FT 5000 Smart Transceiver or the smart transceiver warranty will be void. GND 35 IO11 If a 64KB external serial EEPROM or flash device is used, the maximum allowed size of application code is 42KB as defined by extended NVM area in the memory map. An additional 16KB of the remaining space can hold an external system firmware image, in case a future firmware upgrade is required. 36 2 14 • Reserved space for system use. 1 IO0 13 • Mandatory external EEPROM that holds configuration data and nonvolatile application variables. GND PAD SVC~ IO9 • On-chip RAM for stack segments and RAMNEAR data. communications transformer (the FT-X3). The transformer enables operation in the presence of high frequency common-mode noise on unshielded twisted-pair networks. Properly designed devices can meet the rigorous Level 3 requirements of EN 61000-4-6 without the need for a network isolation choke. The transformer also offers outstanding immunity from magnetic noise, eliminating the need for protective magnetic shields in most applications. IO10 the area shadowed from external NVM into the RAM. 48 ® Dashed line represents Pad (pin 49) Pad must be connected to GND Figure 8: FT 5000 Smart Transceiver Pinout to-end solutions include a comprehensive set of development tools, network interfaces, routers, and network tools. In addition, pre-production design review services, training, and worldwide technical support (including onsite support) are available through Echelon’s Support technical assistance program. FT 5000 Smart Transceiver IC Pin Configuration FT 5000 Smart Transceiver IC Pin Descriptions All digital inputs are low-voltage transistortransistor logic (LVTTL) compatible, low leakage, 5V-tolerant. All digital outputs are slew-rate limited to reduce Electromagnetic Interference (EMI). Pin Name Pin Type Description SVC~ 1 Digital I/O Service (active low) IO0 2 Digital I/O IO0 for I/O Objects IO1 3 Digital I/O IO1 for I/O Objects IO2 4 Digital I/O IO2 for I/O Objects IO3 5 Digital I/O IO3 for I/O Objects VDD1V8 6 IO4 7 Figure 7: Typical LonWorks based Device VDD3V3 8 Echelon provides all of the building blocks required to successfully design and field costeffective, robust products based on the FT 5000 Smart Transceivers. Our end- IO5 9 Digital I/O IO5 for I/O Objects IO6 10 Digital I/O IO6 for I/O Objects IO7 11 Digital I/O IO7 for I/O Objects IO8 12 IO9 13 Serial EEPROM (2KB or larger) Sense or Control Devices: Motors, Valves, Lights, Relays, Switches, Controllers I/O Serial SPI Flash (optional) FT 5000 Smart Transceiver Crystal (10 MHz) FT-X3 Communication Transformer Power Source LONWORKS TP/FT-10 Channel Power 1.8 V Power Input (from internal voltage regulator) Digital I/O IO4 for I/O Objects Power Digital I/O Digital I/O 3.3 V Power IO8 for I/O Objects IO9 for I/O Objects www.echelon.com ® Pin Name Pin Type IO10 14 Digital I/O IO11 15 Description IO10 for I/O Objects for I/O Digital I/O IO11 Objects 1.8 V Power Input Power (from internal voltage regulator) VDD1V8 16 TRST~ 17 Digital Input JTAG Test Reset (active low) VDD3V3 18 Power 3.3 V Power TCK 19 TMS 20 TDI 21 TDO 22 XIN 23 XOUT 24 Digital Input Digital Input Digital Input Digital Output Oscillator In Oscillator Out VDDPLL 25 Power GNDPLL 26 Power Ground Power 1.8 V Power Output (of internal voltage regulator) VOUT1V8 27 JTAG Test Mode Select JTAG Test Data In JTAG Test Data Out Crystal oscillator Input Crystal oscillator Output 1.8 V Power Input (from internal voltage regulator) 28 VIN3V3 29 Power 3.3 V input to internal voltage regulator VDD3V3 30 Power 3.3 V Power AVDD3V3 31 Power 3.3 V Power 32 AGND 33 Digital I/O Reset (active low) Port Communi- Network (polarity cations insensitive) Ground Ground Port Communi- Network cations (polarity insensitive) NETP 34 NC 35 N/A GND 36 Ground TXON 37 Digital I/O Pin Type Do Not Connect Ground TxActive for optional network activity LED RXON 38 Digital I/O RxActive for optional network activity LED CP4 39 N/A Connect to VDD33 through a 4.99 kΩ pullup resistor Description SPI slave select 0 (CS0~, Digital I/O active low) (for external memory connection only) CS0~ 40 VDD3V3 41 Power 3.3 V Power VDD3V3 42 Power 3.3 V Power SDA_CS1~ 43 Digital I/O VDD1V8 44 Power SCL 45 Digital I/O MISO 46 Digital I/O JTAG Test Clock RST~ NETN Pin Name SCK 47 Digital I/O MOSI 48 Digital I/O PAD 49 Ground Pad I2C: serial data (SDA) SPI: slave select 1 (CS1~, active low) (for external memory connection only) 1.8 V Power Input (from internal voltage regulator) I2C: serial clock (SCL) (for external memory connection only) SPI master input, slave output (MISO) (for external memory connection only) SPI serial clock (SCK) (for external memory connection only) SPI master output, slave input (MOSI) (for external memory connection only) Ground VDD3 VLVI TA fXIN Minimum Typical Maximum 3.00 V 3.3 V 3.60 V 2.70 V 2.96 V -40° C +85° C - 10,0000 MHz Current consumption in receive mode3 5MHz 10MHz 20MHz 40MHz 80MHz Current consumption in transmit mode3,4 9 mA 9 mA 15 mA 23 mA 38 mA 15 mA 15 mA 23 mA 33 mA 52 mA IDD3-RX + 15 mA IDD3-RX + 18mA Table 3: FT 5000 Smart Transceiver Operating Conditions Notes 1. All parameters assume nominal supply voltage (VDD3 = 3.3 V ± 0.3 V) and operating temperature (TA between -40ºC and +85ºC), unless otherwise noted. 2. See Clock Requirements in the Series 5000 Chip Data Book for more detailed information about the XIN clock frequency. 3. Assumes no load on digital I/O pins, and that the I/O lines are not switching. 4. Current consumption in Transmit mode represents a peak value rather than a continuous usage value because a Series 5000 device does not typically transmit data continuously. Table 4 below lists the characteristics of the digital I/O pins, which include IO0– IO11 and the other digital pins listed in Table 2. FT 5000 Smart Transceiver Operating Conditions Supply voltage Low-voltage indicator trip point Ambient temperature XIN clock frequency2 IDD3-TX Minimum Typical Maximum The digital I/O pins (IO0–IO11) have LVTTL-level inputs. Pins IO0–IO7 also have low-level-detect latches. The RST~ and SVC~ pins have internal pull-ups, and the RST~ pin has hysteresis. Electrical Characteristics Description IDD3-RX Description Digital Pin Characteristics Table 2: FT 5000 Smart Transceiver Pin Description Parameter1 Parameter1 - Parameter1 Description Minimum VOH Output drive high at IOH = 8 mA 2.4 V VDD3 VOL Output drive low at IOL = 8 mA GND 0.4 V VIH Input high level 2.0 V 5.5 V VIL Input low level GND 0.8 V Typical Maximum www.echelon.com ® Parameter1 Description Minimum Pin Name Pin Number Maximum Typical Description NETA 4 NETA connection to LonWorks network CTP2 5 Center tap primary 2 VHYS Input hysteresis for RST~ pin IIN Input leakage current - 10 µA NETN 6 NETN connection from FT 5000 Smart Transceiver RPU Pullup resistance2 13 kΩ 23 kΩ NETB 7 NETB connection to LonWorks network IPU Pullup current when pin at 0 V2 130 µA 275 µA CTS1 8 Center tap secondary 1 300 mV Table 5: FT-X3 Communications Transformer Pin Assignments Table 4: FT 5000 Smart Transceiver Digital Pin Characteristics Notes 1. All parameters assume nominal supply voltage (VDD3 = 3.3 V ± 0.3 V) and operating temperature (TA between -40ºC and +85ºC), unless otherwise noted. 2. Applies to RST~ and SVC~ pins only. Recommended FT 5000 Smart Transceiver Pad Layout Figure 10: FT 5000 Smart Transceiver IC Mechanical Specifications Notes Figure 9: FT 5000 Smart Transceiver Pad Layout Smart Transceiver IC Mechanical Specification 1. All dimensions are in millimeters. 2. Dimensions and tolerances conform to ASME Y14.5M.-1994. 3. Package warpage max. 0.08 mm. 4. Package corners unless otherwise specified are R0.175±0.025 mm. FT-X3 Communications Transformer Pin Descriptions Figure 12: FT-X3 Communications Transformer Electrical Connection Schematic (winding connections are made on the PCB) Recommended FT-X3 Communications Transformer Pad Layout The FT-X3 Communications Transformer is rotationally symmetric. Hence, the transformer package does not have a marking for Pin 1. Figure 11: FT-X3 Communications Transformer Pinout Diagram Pin Name Pin Number Description NETP 1 NETP connection from FT 5000 Smart Transceiver CTP1 2 Center tap primary 1 CTS2 3 Center tap secondary 2 Figure 13: FT-X3 Transformer SMT Layout Pad Pattern www.echelon.com ® Recommendation: Add vias to the ends of each pin pad connection (just outside of the SMT pad rectangles) to provide additional mechanical support for the transformer. FT 5000 Tape and Reel Information Devices are uniformly loaded in the carrier tape such that the device pin one is oriented in quadrant 1 toward the side of the tape having round sprocket holes. Figure 15 illustrates the pin-one location. FT-X3 Communications Transformer Mechanical Specification User Direction of Feed Figure 15: FT 5000 Pin One Orientation Figure 16 shows the outline dimensions of the carrier tape. Figure 16: Carrier Tape Outline Drawing Ao = Bo = 7.25 Ko = 1.10 Notes 1. All dimensions are in millimeters. 2. Tolerances unless noted: 1PL + 0.2. 2PL + 0.1 3. 10 Sprocket hole pitch cumulative tolerance +0.2 4. Camber in compliance with EIA 481. 5. P  ocket position relative to sprocket hole measured as true position of pocket, not pocket hole. For more information, refer to EIA-481-B, Taping of Surface Mount Components for Automatic Placement. Figure 17 shows the FT 5000 Series 13” Reel Drawing and Specification. www.echelon.com ® Figure 18 shows the 5000 Series 7” Reel Drawing and Specification. Figure 20 shows the 1.3” Reels/4” Hub. Figure 20: FT-X3 Reel and Hub Drawing Notes 1. All dimensions are in millimeters. Figure 17: FT 5000 13” Reel and Hub Drawing 2. Tolerances unless noted: 1PL + ; 2PL + 0.2; 3PL + 0.1; ANG + 0.5”; FRACT + Figure 18 shows the 5000 Series 7” Reel Drawing and Specification. Figure 21 shows the FT-X3 Packing Specification Figure 21: FT-X3 Packing Drawing Figure 18: FT 5000 7” Reel and Hub Drawing FT-X3 Packing Specifications FT-X3 Packing Specifications Figure 19 shows the placement of each device on the carrier tape. Notes 1. Material: Black conductive polystyrene PS 2. Inspect per EIA-481-3 standard. 3. Tape thickness: 0.5 ±0.05 mm 4. 10 Sprocket hole pitch cumulative tolerance ±0.20 5. Carrier chamber is within 1 mm in 100 mm 6. Packing length per 22” reel: 10.2 meters 7. Packing length per 13” reel: 3.4 meters 8. Component load per 13” reel: 100 PCS 9. Compression strength: 1.5 kgf min. Figure 19: FT-X3 Device Placement on the Carrier Tape 10. Environment-Related substance must meet DELTA’s general spec no. 10000-0162 www.echelon.com ® Specifications Network Length in Doubly-terminated Bus Topology2 Data Communications Type 2700m (8,850 feet) with no repeaters. Differential Manchester encoding. Maximum Stub Length in Doubly-termi- Network Polarity nated Bus Topology Polarity insensitive. 3m (9.8 fe Isolation between Network and FT 5000 IC Network Termination 0-60Hz, 60 seconds: 1,000Vrms; 0-60Hz, continuous: 277Vrms1. One terminator in free topology; two terminators in bus topology 14235R-2000 EMI (more details in Series 5000 Chip Data Book). FT-X3 Communications Transformer Designed to comply with FCC Part 15 Subpart B and EN55022 Level B. Power-down Network Protection Notes 1. Safety agency hazardous voltage barrier requirements are not supported. 2. Network segment length varies, depending on wire type. See Junction Box and Wiring Guidelines engineering bulletin for detailed specifications. Ordering Information FT 5000 Smart Transceiver 14235R-500 14255R-100 High impedance when unpowered. ESD Designed to comply with EN 61000-4-2, Level 4. Operating Temperature -40 to 85 °C Radiated Electromagnetic Susceptibility Operating Humidity Designed to comply with EN 61000-4-3, Level 3. 25-90% RH @50 °C, non-condensing (FT-X3 Communications Transformer). Fast Transient/Burst Immunity Non-operating Humidity Designed to comply with EN 61000-4-4, Level 4. 95% RH @ 50 °C, non-condensing (FT-X3 Communications Transformer). Surge Immunity Vibration Designed to comply with EN 61000-4-5, Level 3. 1.5g peak-to-peak, 8Hz-2kHz (FT-X3 Communications Transformer). Conducted RF Immunity Designed to comply with EN 61000-4-6, Level 3. Transmission Speed Mechanical Shock 100g (peak) (FT-X3 Communications Transformer). Reflow Soldering Temperature Profile 78 kilobits per second. Number of Transceivers per Segment Refer to Joint Industry Standard document IPC/JEDEC J-STD-020D.1 (March 2008). Up to 64. Peak Reflow Soldering Temperature Network Wiring 260°C (FT 5000 Smart Transceiver). 24 to 16AWG twisted pair; see Series 5000 Transformer). Chip Data Book or Junction Box and 245°C (FT-X3 Communications Wiring Guidelines engineering bulletin for Co-planarity qualified cable types. 0.12 mm (FT-X3 Communications Transformer). Network Length in Free Topology2 Mass 500m (1,640 feet) maximum total wire with no repeaters. 6g (FT-X3 Communications Transformer). 500m (1,640 feet) maximum device-todevice distance. © 2014 Echelon, LonWorks, and the Echelon logo are trademarks of Echelon Corporation registered in the United States and other countries.IzoT is a trademark of Echelon Corporation. Content subject to change without notice. www.echelon.com