SKB02N60
Fast IGBT in NPT-technology with soft, fast recovery anti-parallel Emitter Controlled
Diode
C
75% lower Eoff compared to previous generation
combined with low conduction losses
Short circuit withstand time – 10 s
Designed for frequency inverters for washing machines,
fans, pumps and vacuum cleaners
NPT-Technology for 600V applications offers:
- very tight parameter distribution
- high ruggedness, temperature stable behaviour
- parallel switching capability
Very soft, fast recovery anti-parallel Emitter Controlled
Diode
Pb-free lead plating; RoHS compliant
1
Qualified according to JEDEC for target applications
Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/
Type
SKB02N60
G
E
PG-TO-263-3-2
VCE
IC
VCE(sat)
Tj
Marking
Package
600V
2A
2.2V
150C
K06N60
PG-TO-263-3-2
Maximum Ratings
Parameter
Symbol
Collector-emitter voltage
VCE
DC collector current
IC
Value
600
Unit
V
A
TC = 25C
6.0
TC = 100C
2.9
Pulsed collector current, tp limited by Tjmax
ICpul s
12
Turn off safe operating area
-
12
VCE 600V, Tj 150C
IF
Diode forward current
TC = 25C
6.0
TC = 100C
2.9
Diode pulsed current, tp limited by Tjmax
IFpul s
12
Gate-emitter voltage
VGE
20
V
tSC
10
s
Ptot
30
W
-55...+150
C
260
°C
2
Short circuit withstand time
VGE = 15V, VCC 600V, Tj 150C
Power dissipation
TC = 25C
Operating junction and storage temperature
Tj , Tstg
Soldering temperature (reflow soldering, MSL1)
Ts
1
2
J-STD-020 and JESD-022
Allowed number of short circuits: 1s.
1
Rev. 2.3
12.06.2013
SKB02N60
Thermal Resistance
Parameter
Symbol
Conditions
Max. Value
Unit
RthJC
4.2
K/W
RthJCD
7
RthJA
40
Characteristic
IGBT thermal resistance,
junction – case
Diode thermal resistance,
junction – case
1)
SMD version, device on PCB
Electrical Characteristic, at Tj = 25 C, unless otherwise specified
Parameter
Symbol
Conditions
Value
min.
Typ.
max.
600
-
-
1.7
1.9
2.4
-
2.2
2.7
1.2
1.4
1.8
T j =1 5 0 C
-
1.25
1.65
3
4
5
T j =2 5 C
-
-
20
T j =1 5 0 C
-
-
250
Unit
Static Characteristic
Collector-emitter breakdown voltage
V ( B R ) C E S V G E = 0V , I C = 5 00 A
Collector-emitter saturation voltage
VCE(sat)
V G E = 15 V , I C = 2 A
T j =2 5 C
T j =1 5 0 C
VF
Diode forward voltage
V
V G E = 0V , I F = 2 .9 A
T j =2 5 C
Gate-emitter threshold voltage
VGE(th)
I C = 15 0 A , V C E = V G E
Zero gate voltage collector current
ICES
V C E = 60 0 V, V G E = 0 V
A
Gate-emitter leakage current
IGES
V C E = 0V , V G E =2 0 V
-
-
100
nA
Transconductance
gfs
V C E = 20 V , I C = 2 A
-
1.6
-
S
Ciss
V C E = 25 V ,
-
142
170
pF
Coss
V G E = 0V ,
-
18
22
Reverse transfer capacitance
Crss
f= 1 MH z
-
10
12
Gate charge
QGate
V C C = 48 0 V, I C =2 A
-
14
18
nC
-
7
-
nH
-
20
-
A
Dynamic Characteristic
Input capacitance
Output capacitance
V G E = 15 V
LE
Internal emitter inductance
measured 5mm (0.197 in.) from case
Short circuit collector current
2)
IC(SC)
V G E = 15 V ,t S C 10 s
V C C 6 0 0 V,
T j 1 5 0 C
1)
2
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70m thick) copper area for
collector connection. PCB is vertical without blown air.
2)
Allowed number of short circuits: 1s.
2
Rev. 2.3
12.06.2013
SKB02N60
Switching Characteristic, Inductive Load, at Tj=25 C
Parameter
Symbol
Conditions
Value
min.
typ.
max.
-
20
24
-
13
16
-
259
311
-
52
62
-
0.036
0.041
-
0.028
0.036
-
0.064
0.078
130
-
Unit
IGBT Characteristic
Turn-on delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Turn-on energy
Eon
Turn-off energy
Eoff
Total switching energy
Ets
T j =2 5 C ,
V C C = 40 0 V, I C = 2 A,
V G E = 0/ 15 V ,
R G = 11 8 ,
1)
L = 18 0 nH ,
1)
C = 18 0 pF
Energy losses include
“tail” and diode
reverse recovery.
trr
T j =2 5 C ,
-
tS
V R = 2 00 V , I F = 2. 9 A ,
-
12
-
tF
d i F / d t =2 0 0 A/ s
-
118
-
ns
mJ
Anti-Parallel Diode Characteristic
Diode reverse recovery time
ns
Diode reverse recovery charge
Qrr
-
65
-
nC
Diode peak reverse recovery current
Irrm
-
1.9
-
A
Diode peak rate of fall of reverse
recovery current during t b
d i r r /d t
-
180
-
A/s
Switching Characteristic, Inductive Load, at Tj=150 C
Parameter
Symbol
Conditions
Value
min.
typ.
max.
T j =1 5 0 C
V C C = 40 0 V,
I C = 2 A,
V G E = 0/ 15 V ,
R G = 11 8 ,
1)
L = 18 0 nH ,
1)
C = 18 0 pF
Energy losses include
“tail” and diode
reverse recovery.
-
20
24
-
14
17
-
287
344
-
67
80
-
0.054
0.062
-
0.043
0.056
-
0.097
0.118
Unit
IGBT Characteristic
Turn-on delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Turn-on energy
Eon
Turn-off energy
Eoff
Total switching energy
Ets
ns
mJ
Anti-Parallel Diode Characteristic
Diode reverse recovery time
trr
T j =1 5 0 C
-
150
-
tS
V R = 2 00 V , I F = 2. 9 A ,
-
19
-
tF
d i F / d t =2 0 0 A/ s
-
131
-
ns
Diode reverse recovery charge
Qrr
-
150
-
nC
Diode peak reverse recovery current
Irrm
-
3.8
-
A
Diode peak rate of fall of reverse
recovery current during t b
d i r r /d t
-
200
-
A/s
1)
Leakage inductance L a nd Stray capacity C due to dynamic test circuit in Figure E.
3
Rev. 2.3
12.06.2013
SKB02N60
16A
Ic
t p =2 s
10A
14A
IC, COLLECTOR CURRENT
IC, COLLECTOR CURRENT
12A
10A
T C =80°C
8A
6A
T C =110°C
4A
2A
0A
10Hz
15 s
1A
50 s
200 s
0.1A
1ms
DC
Ic
0.01A
100Hz
1kHz
10kHz
1V
100kHz
35W
7A
30W
6A
25W
5A
20W
15W
10W
5W
0W
25°C
100V
1000V
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 2. Safe operating area
(D = 0, TC = 25C, Tj 150C)
IC, COLLECTOR CURRENT
Ptot, POWER DISSIPATION
f, SWITCHING FREQUENCY
Figure 1. Collector current as a function of
switching frequency
(Tj 150C, D = 0.5, VCE = 400V,
VGE = 0/+15V, RG = 118)
10V
4A
3A
2A
1A
50°C
75°C
100°C
0A
25°C
125°C
TC, CASE TEMPERATURE
Figure 3. Power dissipation (IGBT) as a
function of case temperature
(Tj 150C)
50°C
75°C
100°C
125°C
TC, CASE TEMPERATURE
Figure 4. Collector current as a function of
case temperature
(VGE 15V, Tj 150C)
4
Rev. 2.3
12.06.2013
7A
7A
6A
6A
5A
V G E =20V
IC, COLLECTOR CURRENT
IC, COLLECTOR CURRENT
SKB02N60
15V
4A
13V
11V
3A
9V
7V
2A
5V
1V
2V
3V
4V
13V
3A
11V
9V
2A
7V
5V
7A
Tj=+25°C
6A
-55°C
+150°C
5A
4A
3A
2A
1A
2V
4V
6V
8V
10V
1V
2V
3V
4V
5V
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 6. Typical output characteristics
(Tj = 150C)
VCE(sat), COLLECTOR-EMITTER SATURATION VOLTAGE
8A
IC, COLLECTOR CURRENT
15V
4A
0A
0V
5V
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 5. Typical output characteristics
(Tj = 25C)
0A
0V
V G E =20V
1A
1A
0A
0V
5A
VGE, GATE-EMITTER VOLTAGE
Figure 7. Typical transfer characteristics
(VCE = 10V)
4.0V
3.5V
IC = 4A
3.0V
2.5V
IC = 2A
2.0V
1.5V
1.0V
-50°C
0°C
50°C
100°C
150°C
Tj, JUNCTION TEMPERATURE
Figure 8. Typical collector-emitter
saturation voltage as a function of junction
temperature
(VGE = 15V)
5
Rev. 2.3
12.06.2013
SKB02N60
t d(off)
t, SWITCHING TIMES
t, SWITCHING TIMES
t d(off)
tf
100ns
td(on)
tf
100ns
t d(on)
tr
10ns
0A
1A
2A
3A
4A
tr
10ns
0
5A
IC, COLLECTOR CURRENT
Figure 9. Typical switching times as a
function of collector current
(inductive load, Tj = 150C, VCE = 400V,
VGE = 0/+15V, RG = 11 8,
Dynamic test circuit in Figure E)
300
400
RG, GATE RESISTOR
Figure 10. Typical switching times as a
function of gate resistor
(inductive load, Tj = 150C, VCE = 400V,
VGE = 0/+15V, IC = 2A,
Dynamic test circuit in Figure E)
VGE(th), GATE-EMITTER THRESHOLD VOLTAGE
t, SWITCHING TIMES
200
5.5V
t d(off)
100ns
tf
t d(on)
tr
10ns
0°C
100
50°C
100°C
5.0V
4.5V
4.0V
max.
3.5V
3.0V
typ.
2.5V
min.
2.0V
150°C
-50°C
Tj, JUNCTION TEMPERATURE
Figure 11. Typical switching times as a
function of junction temperature
(inductive load, VCE = 400V, VGE = 0/+15V,
IC = 2A, RG = 1 1 8,
Dynamic test circuit in Figure E)
0°C
50°C
100°C
150°C
Tj, JUNCTION TEMPERATURE
Figure 12. Gate-emitter threshold voltage
as a function of junction temperature
(IC = 0.15mA)
6
Rev. 2.3
12.06.2013
SKB02N60
0.2mJ
*) Eon and Ets include losses
due to diode recovery.
0.2mJ
E, SWITCHING ENERGY LOSSES
E, SWITCHING ENERGY LOSSES
*) Eon and Ets include losses
due to diode recovery.
E ts *
E on *
0.1mJ
E off
E ts *
0.1mJ
E on *
E off
0.0mJ
0A
1A
2A
3A
4A
0.0mJ
0
5A
IC, COLLECTOR CURRENT
Figure 13. Typical switching energy losses
as a function of collector current
(inductive load, Tj = 150C, VCE = 400V,
VGE = 0/+15V, RG = 11 8,
Dynamic test circuit in Figure E)
100
200
300
400
RG, GATE RESISTOR
Figure 14. Typical switching energy losses
as a function of gate resistor
(inductive load, Tj = 150C, VCE = 400V,
VGE = 0/+15V, IC = 2A,
Dynamic test circuit in Figure E)
0.2mJ
D=0.5
E ts *
E on *
0.1mJ
E off
0.0mJ
0°C
50°C
100°C
ZthJC, TRANSIENT THERMAL IMPEDANCE
E, SWITCHING ENERGY LOSSES
*) Eon and Ets include losses
due to diode recovery.
150°C
0
10 K/W
0.2
0.1
0.05
0.02
R,(K/W)
1.026
1.3
1.69
0.183
-1
10 K/W
0.01
R1
, (s)
0.035
3.62*10-3
4.02*10-4
4.21*10-5
R2
-2
10 K/W
1µs
single pulse
10µs 100µs
C 1 = 1 / R 1 C 2 = 2 /R 2
1m s
10m s 100m s
1s
tp, PULSE WIDTH
Tj, JUNCTION TEMPERATURE
Figure 15. Typical switching energy losses
as a function of junction temperature
(inductive load, VCE = 400V, VGE = 0/+15V,
IC = 2A, RG = 1 1 8,
Dynamic test circuit in Figure E)
Figure 16. IGBT transient thermal
impedance as a function of pulse width
(D = tp / T)
7
Rev. 2.3
12.06.2013
SKB02N60
25V
C iss
15V
120V
C, CAPACITANCE
VGE, GATE-EMITTER VOLTAGE
20V
480V
10V
100pF
C oss
5V
10pF
C rss
0V
0nC
5nC
10nC
15nC
0V
QGE, GATE CHARGE
Figure 17. Typical gate charge
(IC = 2A)
30V
40A
IC(sc), SHORT CIRCUIT COLLECTOR CURRENT
tsc, SHORT CIRCUIT WITHSTAND TIME
20V
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 18. Typical capacitance as a
function of collector-emitter voltage
(VGE = 0V, f = 1MHz)
25 s
20 s
15 s
10 s
5 s
0 s
10V
10V
11V
12V
13V
14V
30A
20A
10A
0A
10V
15V
VGE, GATE-EMITTER VOLTAGE
Figure 19. Short circuit withstand time as a
function of gate-emitter voltage
(VCE = 600V, start at Tj = 25C)
12V
14V
16V
18V
20V
VGE, GATE-EMITTER VOLTAGE
Figure 20. Typical short circuit collector
current as a function of gate-emitter voltage
(VCE 600V,Tj = 150C)
8
Rev. 2.3
12.06.2013
SKB02N60
500ns
280nC
trr, REVERSE RECOVERY TIME
300ns
I F = 4A
200ns
IF = 2A
I F = 1A
100ns
0ns
20A/ s
60A/ s
Qrr, REVERSE RECOVERY CHARGE
240nC
400ns
80nC
40nC
IF = 2A
IF = 1A
1A
0A
20A/s
60A/s
100A/s
140A/s
OF REVERSE RECOVERY CURRENT
200A/s
d i r r /d t, DIODE PEAK RATE OF FALL
4A
2A
60A/ s
100A/ s 140A/ s 180A/ s
d i F / d t, DIODE CURRENT SLOPE
Figure 22. Typical reverse recovery charge
as a function of diode current slope
(VR = 200V, Tj = 125C,
Dynamic test circuit in Figure E)
250A/s
IF = 4A
I F = 1A
120nC
5A
3A
I F = 2A
160nC
0nC
20A/ s
100A/ s 140A/ s 180A/ s
d i F / d t, DIODE CURRENT SLOPE
Figure 21. Typical reverse recovery time as
a function of diode current slope
(VR = 200V, Tj = 125C,
Dynamic test circuit in Figure E)
Irr, REVERSE RECOVERY CURRENT
IF = 4A
200nC
150A/s
100A/s
50A/s
0A/s
20A/s
180A/s
d i F / d t, DIODE CURRENT SLOPE
Figure 23. Typical reverse recovery current
as a function of diode current slope
(VR = 200V, Tj = 125C,
Dynamic test circuit in Figure E)
60A/s
100A/s
140A/s
180A/s
diF/dt, DIODE CURRENT SLOPE
Figure 24. Typical diode peak rate of fall of
reverse recovery current as a function of
diode current slope
(VR = 200V, Tj = 125C,
Dynamic test circuit in Figure E)
9
Rev. 2.3
12.06.2013
SKB02N60
4A
2.5V
VF, FORWARD VOLTAGE
IF, FORWARD CURRENT
3A
150°C
2A
100°C
25°C
-55°C
1A
0A
0.0V
0.5V
1.0V
1.5V
2.0V
I F = 4A
I F = 2A
1.5V
1.0V
2.0V
VF, FORWARD VOLTAGE
Figure 25. Typical diode forward current as
a function of forward voltage
-40°C
0°C
40°C
80°C
120°C
Tj, JUNCTION TEMPERATURE
Figure 26. Typical diode forward voltage as
a function of junction temperature
1
ZthJCD, TRANSIENT THERMAL IMPEDANCE
10 K/W
D=0.5
0.2
0
10 K/W 0.1
0.05
R,(K/W)
0.830
2.240
3.930
0.02
-1
0.01
10 K/W
R1
, (s)
6.40*10-3
8.79*10-4
1.19*10-4
R2
single pulse
C 1 = 1 / R 1 C 2 = 2 /R 2
-2
10 K/W
1µs
10µs
100µs
1ms
10ms 100ms
1s
tp, PULSE WIDTH
Figure 27. Diode transient thermal
impedance as a function of pulse width
(D = tp / T)
10
Rev. 2.3
12.06.2013
SKB02N60
PG-TO263-3-2
11
Rev. 2.3
12.06.2013
SKB02N60
i,v
tr r =tS +tF
diF /dt
Qr r =QS +QF
tr r
IF
tS
QS
Ir r m
tF
QF
10% Ir r m
dir r /dt
90% Ir r m
t
VR
Figure C. Definition of diodes
switching characteristics
1
2
r1
r2
n
rn
Tj (t)
p(t)
r1
r2
rn
Figure A. Definition of switching times
TC
Figure D. Thermal equivalent
circuit
Figure E. Dynamic test circuit
Leakage inductance L =180nH
an d Stray capacity C =180pF.
Figure B. Definition of switching losses
12
Rev. 2.3
12.06.2013
SKB02N60
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2013 Infineon Technologies AG
All Rights Reserved.
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characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or
any information regarding the application of the device, Infineon Technologies hereby disclaims any and all
warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the
types in question, please contact the nearest Infineon Technologies Office.
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or
systems and/or automotive, aviation and aerospace applications or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the
failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or
effectiveness of that device or system. Life support devices or systems are intended to be implanted in the
human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable
to assume that the health of the user or other persons may be endangered.
13
Rev. 2.3
12.06.2013