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MSM51V18165F-60T3

MSM51V18165F-60T3

  • 厂商:

    ROHM(罗姆)

  • 封装:

    TSOP50-II

  • 描述:

    IC DRAM 16MBIT PARALLEL 50TSOP

  • 数据手册
  • 价格&库存
MSM51V18165F-60T3 数据手册
FEDD51V18165F-05 Issue Date: Nov. 01, 2013 MSM51V18165F 1,048,576-Word  16-Bit DYNAMIC RAM : FAST PAGE MODE TYPE WITH EDO DESCRIPTION The MSM51V18165F is a 1,048,576-word  16-bit dynamic RAM fabricated in LAPIS Semiconductor’s silicon-gate CMOS technology. The MSM51V18165F achieves high integration, high-speed operation, and low-power consumption because LAPIS Semiconductor manufactures the device in a quadruple-layer poly-silicon/double-layer metal CMOS process. The MSM51V18165F is available in a 50/44-pin plastic TSOP. FEATURES · 1,048,576-word  16-bit configuration · Single 3.3V power supply, 0.3V tolerance · Input : LVTTL compatible, low input capacitance · Output : LVTTL compatible, 3-state · Refresh : 1024 cycles/16ms · Fast page mode with EDO, read modify write capability · CAS before RAS refresh, hidden refresh, RAS-only refresh capability · Package: 50/44-pin 400mil plastic TSOP (P-TSOP(2)50/44-400-0.80-T3K6) PRODUCT FAMILY Access Time (Max.) Family MSM51V18165F tRAC tAA tCAC tOEA Cycle Time (Min.) 50ns 60ns 70ns 25ns 30ns 35ns 13ns 15ns 20ns 13ns 15ns 20ns 84ns 104ns 124ns Power Dissipation Operating (Max.) 450mW 414mW 378mW Standby (Max.) 1.8mW 1/17 FEDD51V18165F-05 MSM51V18165F PIN CONFIGURATION (TOP VIEW) VCC 1 DQ1 2 DQ2 3 DQ3 4 DQ4 5 VCC 6 DQ5 7 DQ6 8 DQ7 9 DQ8 10 NC 11 50 VSS 49 DQ16 NC 15 NC 16 WE 17 RAS 18 NC 19 NC 20 A0 21 A1 22 A2 23 A3 24 VCC 25 36 NC 35 LCAS 48 DQ15 47 DQ14 46 DQ13 45 VSS 44 DQ12 43 DQ11 42 DQ10 41 DQ9 40 NC 34 UCAS 33 OE 32 A9 31 A8 30 A7 29 A6 28 A5 27 A4 26 VSS 50/44-Pin Plastic TSOP (K Type) Pin Name Function A0–A9 Address Input RAS Row Address Strobe LCAS Lower Byte Column Address Strobe UCAS Upper Byte Column Address Strobe DQ1–DQ16 Data Input/Data Output OE Output Enable WE Write Enable VCC Power Supply (3.3V) VSS Ground (0V) NC No Connection Note : The same power supply voltage must be provided to every VCC pin, and the same GND voltage level must be provided to every VSS pin. 2/17 FEDD51V18165F-05 MSM51V18165F FUNCTION TABLE Input Pin DQ Pin Function Mode RAS LCAS UCAS WE OE DQ1-DQ8 DQ9-DQ16 H * * * * High-Z High-Z Standby L H H * * High-Z High-Z Refresh L L H H L DOUT High-Z Lower Byte Read L H L H L High-Z DOUT Upper Byte Read L L L H L DOUT DOUT Word Read L L H L H DIN Don’t Care Lower Byte Write L H L L H Don’t Care DIN Upper Byte Write L L L L H DIN DIN Word Write L L L H H High-Z High-Z  * : “H” or “L” 3/17 FEDD51V18165F-05 MSM51V18165F ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS Parameter Symbol Value Unit Voltage on Any Pin Relative to VSS VIN, VOUT –0.5 to VCC+ 0.3 V Voltage VCC Supply relative to VSS VCC –0.5 to 4.6 V Short Circuit Output Current IOS 50 mA Power Dissipation PD* 1 W Operating Temperature Topr 0 to 70 °C Storage Temperature Tstg –55 to 150 °C *: Ta = 25C RECOMMENDED OPERATING CONDITIONS (Ta = 0 to 70°C) Parameter Power Supply Voltage Symbol Min. Typ. Max. Unit VCC 3.0 3.3 3.6 V VSS 0 0 0 Input High Voltage VIH 2.0  Input Low Voltage VIL  0.3*2  V *1 VCC + 0.3 0.8 V V Notes: *1. The input voltage is VCC + 1.0V when the pulse width is less than 20ns (the pulse width is with respect to the point at which VCC is applied). *2. The input voltage is VSS  1.0V when the pulse width is less than 20ns (the pulse width respect to the point at which VSS is applied). PIN CAPACITANCE (Vcc = 3.3V  0.3V, Ta = 25°C, f = 1 MHz) Parameter Symbol Min. Max. Unit CIN1 — 5 pF (RAS, LCAS, UCAS, WE, OE) CIN2 — 7 pF Output Capacitance (DQ1 - DQ16) CI/O — 7 pF Input Capacitance (A0 - A9) Input Capacitance 4/17 FEDD51V18165F-05 MSM51V18165F DC CHARACTERISTICS (VCC = 3.3V  0.3V, Ta = 0 to 70°C) Parameter Symbol Condition Min. Max. Min. Max. Min. Max. 2.4 VCC 2.4 VCC 2.4 VCC V 0 0.4 0 0.4 0 0.4 V All other pins not under test = 0V  10 10  10 10  10 10 A DQ disable  10 10  10 10  10 10 A  125  115  105 mA 1,2 RAS, CAS = VIH  2  2  2 RAS, CAS  VCC  0.2V   1 0.5  mA 0.5 0.5  125  115  105 mA 1,2  5  5  5 mA 1  125  115  105 mA 1,2  125  115  105 mA 1,3 Output High Voltage VOH IOH = 2.0mA Output Low Voltage VOL IOL = 2mA 0V  VI  VCC+0.3V; Input Leakage Current ILI Output Leakage Current ILO Average Power Supply Current ICC1 (Operating) Power Supply Current ICC2 (Standby) Average Power Supply Current ICC3 (CAS before RAS Refresh) Average Power Supply Current (Fast Page Mode) RAS, CAS cycling, tRC = Min. CAS = VIH, tRC = Min. RAS = VIH, ICC5 (Standby) Average Power Supply Current 0V  VO  VCC RAS cycling, (RAS-only Refresh) Power Supply Current MSM51V18165 MSM51V18165 MSM51V18165 F-50 F-60 F-70 Unit Note CAS = VIL, DQ = enable ICC6 RAS = cycling, CAS before RAS RAS = VIL, ICC7 CAS cycling, tHPC = Min. Notes: 1. ICC Max. is specified as ICC for output open condition. 2. The address can be changed once or less while RAS = VIL. 3. The address can be changed once or less while CAS = VIH. 5/17 FEDD51V18165F-05 MSM51V18165F AC CHARACTERISTICS (1/2) (VCC = 3.3V  0.3V, Ta = 0 to 70°C) Note1,2,3 Parameter Symbol MSM51V18165 F-50 MSM51V18165 F-60 MSM51V18165 F-70 Unit Note Min. Max. Min. Max. Min. Max. tRC 84  104  124  ns Read Modify Write Cycle Time tRWC 110  135  160  ns Fast Page Mode Cycle Time tHPC 20  25  30  ns Fast Page Mode Read Modify Write tHPRWC Cycle Time 58  68  78  ns Access Time from RAS tRAC  50  60  70 ns 4, 5, 6 Access Time from CAS tCAC  13  15  20 ns 4,5 Access Time from Column Address tAA  25  30  35 ns 4,6 Access Time from CAS Precharge tCPA  30  35  40 ns 4,12 Access Time from OE tOEA  13  15  20 ns 4 Output Low Impedance Time from CAS tCLZ 0  0  0  ns 4 Data Output Hold After CAS Low tDOH 5  5  5  ns CAS to Data Output Buffer Turnoff Delay Time tCEZ 0 13 0 15 0 20 ns 7,8 RAS to Data Output Buffer Turnoff Delay Time tREZ 0 13 0 15 0 20 ns 7,8 OE to Data Output Buffer Turn-off Delay Time tOEZ 0 13 0 15 0 20 ns 7 WE to Data Output Buffer Turnoff Delay Time tWEZ 0 13 0 15 0 20 ns 7 Transition Time tT 1 50 1 50 1 50 ns 3 Refresh Period tREF  16  16  16 ms RAS Precharge Time tRP 30  40  50  ns RAS Pulse Width tRAS 50 10,000 60 10,000 70 10,000 ns RAS Pulse Width (Fast Page Mode with EDO) tRASP 50 100,000 60 100,000 70 100,000 ns RAS Hold Time tRSH 7  10  13  ns RAS Hold Time referenced to OE tROH 7  10  13  ns CAS Precharge Time (Fast Page Mode with EDO) tCP 7  10  10  ns CAS Pulse Width tCAS 7 10,000 10 10,000 13 10,000 ns CAS Hold Time tCSH 35  40  45  ns CAS to RAS Precharge Time tCRP 5  5  5  ns 13 30  35  40  ns 13 Random Read or Write Cycle Time RAS Hold Time from CAS Precharge tRHCP 15 6/17 FEDD51V18165F-05 MSM51V18165F AC CHARACTERISTICS (2/2) (VCC = 3.3V  0.3V, Ta = 0 to 70°C) Note1,2,3 Parameter Symbol MSM51V18165 F-50 MSM51V18165 F-60 MSM51V18165 F-70 Min. Max. Min. Max. Min. Max. Unit Note OE Hold Time from CAS (DQ Disable) tCHO 5  5  5  ns RAS to CAS Delay Time tRCD 11 37 14 45 14 50 ns 5 RAS to Column Address Delay Time tRAD 9 25 12 30 12 35 ns 6 Row Address Set-up Time tASR 0  0  0  ns Row Address Hold Time tRAH 7  10  10  ns Column Address Set-up Time tASC 0  0  0  ns 12 Column Address Hold Time tCAH 7  10  13  ns 12 Column Address to RAS Lead Time tRAL 25  30  35  ns Read Command Set-up Time tRCS 0  0  0  ns 12 Read Command Hold Time tRCH 0  0  0  ns 9,12 Read Command Hold Time referenced to RAS tRRH 0  0  0  ns 9 Write Command Set-up Time tWCS 0  0  0  ns 10,12 Write Command Hold Time tWCH 7  10  13  ns 12 Write Command Pulse Width tWP 7  10  10  ns WE Pulse Width (DQ Disable) tWPE 7  10  10  ns OE Command Hold Time tOEH 7  10  13  ns OE Precharge Time tOEP 7  10  10  ns OE Command Hold Time tOCH 7  10  10  ns Write Command to RAS Lead Time tRWL 7  10  13  ns Write Command to CAS Lead Time tCWL 7  10  13  ns 14 Data-in Set-up Time tDS 0  0  0  ns 11,12 Data-in Hold Time tDH 7  10  13  ns 11,12 OE to Data-in Delay Time tOED 13  15  20  ns CAS to WE Delay Time tCWD 30  34  44  ns 10 Column Address to WE Delay Time tAWD 42  49  59  ns 10 RAS to WE Delay Time tRWD 67  79  94  ns 10 tCPWD 47  54  64  ns 10 CAS Active Delay Time from RAS Precharge tRPC 5  5  5  ns 12 RAS to CAS Set-up Time (CAS before RAS) tCSR 5  5  5  ns 12 RAS to CAS Hold Time (CAS before RAS) tCHR 10  10  10  ns 13 CAS Precharge WE Delay Time 7/17 FEDD51V18165F-05 MSM51V18165F Notes: 1. A start-up delay of 200s is required after power-up, followed by a minimum of eight initialization cycles (RAS-only refresh or CAS before RAS refresh) before proper device operation is achieved. 2. The AC characteristics assume tT = 2ns. 3. VIH (Min.) and VIL (Max.) are reference levels for measuring input timing signals. Transition times (tT) are measured between VIH and VIL. 4. -50 is measured with a load circuit equivalent to 1 TTL load and 50pF, and -60/-70 is measured with a load circuit equivalent to 1 TTL load and 100pF. The output timing reference levels are VOH=2.0 and VOL=0.8V. 5. Operation within the tRCD (Max.) limit ensures that tRAC (Max.) can be met. tRCD (Max.) is specified as a reference point only. If tRCD is greater than the specified tRCD (Max.) limit, then the access time is controlled by tCAC. 6. Operation within the tRAD (Max.) limit ensures that tRAC (Max.) can be met. tRAD (Max.) is specified as a reference point only. If tRAD is greater than the specified tRAD (Max.) limit, then the access time is controlled by tAA. 7. tCEZ (Max.), tREZ (Max.), tWEZ (Max.), and tOEZ (Max.) define the time at which the output achieved the open circuit condition and are not referenced to output voltage levels. 8. tCEZ, and tREZ must be satisfied for open circuit condition. 9. tRCH or tRRH must be satisfied for a read cycle. 10. tWCS, tCWD, tRWD, tAWD and tCPWD are not restrictive operating parameters. They are included in the data sheet as electrical characteristics only. If tWCS  tWCS (Min.), then the cycle is an early write cycle and the data out will remain open circuit (high impedance) throughout the entire cycle. If tCWD  tCWD (Min.), tRWD  tRWD(Min.), tAWD  tAWD (Min.) and tCPWD  tCPWD (Min.), then the cycle is a read modify write cycle and data out will contain data read from the selected cell; if neither of the above sets of conditions is satisfied, then the condition of the data out (at access time) is indeterminate. 11. These parameters are referenced to the UCAS and LCAS, leading edges in an early write cycle, and to the WE leading edge in an OE control write cycle, or a read modify write cycle. 12. These parameters are determined by the falling edge of either UCAS or LCAS, whichever is earlier. 13. These parameters are determined by the rising edge of either UCAS or LCAS, whichever is later. 14. tCWL should be satisfied by both UCAS and LCAS. 15. tCP is determined by the time both UCAS and LCAS are high. 8/17 FEDD51V18165F-05 MSM51V18165F TIMING CHART Read Cycle RAS tRC tRAS VIH tRP VIL tCSH tCRP CAS tRCD VIH tRAD VIL tRAL tASR Address WE tCRP tRSH tCAS VIH tRAH tASC Row VIL tCAH Column tRCS tRRH VIH tAA VIL tRCH tROH tREZ tOEA OE VIH VIL tCAC tRAC DQ tCEZ tOEZ tCLZ VOH Valid Data-out Open VOL “H” or “L” Write Cycle (Early Write) tRC tRAS RAS VIH tRP VIL tCSH tCRP CAS VIH tRAD VIL tRAL tASR Address VIH VIL tRAH tASC Row OE tCWL VIH tWCH tWP VIL tRWL VIH VIL tDS DQ tCAH Column tWCS WE tCRP tRSH tCAS tRCD VIH VIL tDH Valid Data-in Open “H” or “L” 9/17 FEDD51V18165F-05 MSM51V18165F Read Modify Write Cycle tRWC tRAS RAS VIH tRP VIL tCSH tCRP CAS tCRP tRSH tCAS VIH tRAD VIL tASR Address tRCD VIH VIL tRAH Row tCWL tRWL tCAH tASC Column tCWD tRCS tRWD WE OE tWP VIH VIL tAWD tAA tOEH tOEA VIH tOED VIL tDH tCAC tRAC DQ VI/OH VI/OL tOEZ tCLZ Valid Data-out tDS Valid Data-in “H” or “L” 10/17 FEDD51V18165F-05 MSM51V18165F Fast Page Mode Read Cycle (Part-1) tRASP tRCD RAS Address tRHCP VIH VIL tCSH tCRP CAS tRP tHPC tCP tCP tCAS tCAS tCAS VIH VIL VIH VIL tRAD tASR tRAH tASC Row tCAH tASC Column tASC tCAH Column Column tRCS WE OE tOCH tRRH VIH tAA VIL tCAC tRAC tAA VIH VIL tCAC tOEP tOEA tOEA tOEZ tOEZ tDOH VOH Valid Data-out VOL tCAC tAA tCHO tOEP tCPA tOEA DQ tCAH Valid Data-out tREZ Valid * Data-out Valid * Data-out tCLZ * : Same Data, “H” or “L” Fast Page Mode Read Cycle (Part-2) tRP tRASP tRHCP tHPC RAS CAS Address VIH VIL tCRP tCSH tRCD VIH VIL tCAS OE tCAS tRAD tASR tRAH Row tASC tCAH tCAH tASC Column Column tRCS WE tCP tCAS VIH VIL tCRP tHPC tCP tASC tCAH Column tRCS VIH VIL tAA tRAC tRCH tWPE tOEA VIH tAA tCPA tAA tCAC tDOH VIL tCAC tCAC DQ VOH VOL tWEZ Valid Data-out Valid Data-out tCEZ Valid Data-out tCLZ “H” or “L” 11/17 FEDD51V18165F-05 MSM51V18165F Fast Page Mode Write Cycle (Early Write) tRP tRASP tCSH RAS tHPC VIH VIL tCRP tRCD tCP tCP tCAS CAS Address OE VIL VIH VIL tRAD tASR tASC tRAH Row tASC tCAH Column tASC tCAH Column tWCS tWCH tCAH Column tWCS tWCH tWCH VIH VIL VIH VIL tDS DQ tRSH tCAS tCAS VIH tWCS WE tHPC VIH tDH tDS Valid Data-in VIL tDH tDS tDH Valid Data-in Valid Data-in “H” or “L” Fast Page Mode Read Modify Write Cycle tRASP tRWD RAS VIH VIL tCRP tCPWD tRCD tCP tRWL tCWD CAS VIH tASR Address VIH VIL tASC tASC tRAD VIL tHPRWC tRAH Row Column Column tRCS WE VIH VIL tCAH tCPA tCWL tCAH tCWD tRCS tAWD tAWD tAA tWP tDS tRAC tAA VIH tOED VIL tCAC DQ VI/OH VI/OL tCLZ tWP tOEA tOEA OE tDS tOED tOEH tOEZ tDH Valid Data-out Valid Data-in tCAC tOEH tOEZ Valid Data-out tDH Valid Data-in tCLZ “H” or “L” 12/17 FEDD51V18165F-05 MSM51V18165F RAS-only Refresh Cycle tRC RAS CAS Address tRAS VIH VIL tRP tRPC tCRP VIH VIL tASR VIH tRAH Row VIL tCEZ DQ VOH Open VOL Note: WE, OE = “H” or “L” “H” or “L” CAS before RAS Refresh Cycle tRP RAS CAS tRC tRAS VIH VIL tRPC tCP tRP tCSR tRPC tCHR VIH VIL tCEZ DQ VOH VOL Open 13/17 FEDD51V18165F-05 MSM51V18165F Hidden Refresh Read Cycle tRC tRC tRAS RAS tRAS VIH VIL tCRP tRCD tRSH tRP tRP tCHR CAS VIH tRAD VIL tRAH tASR Address VIH tASC Row VIL tCAH Column tRCS WE tCAC VIH VIL tRRH tRAL tREZ tAA tROH OE DQ tCEZ tOEA VIH VIL tRAC tOEZ tCLZ VOH Open VOL Valid Data-out “H” or “L” Hidden Refresh Write Cycle tRC tRC tRAS RAS tRAS VIH VIL tCRP tRCD tRSH tRP tRP tCHR CAS VIH tRAD VIL tASR Address VIH VIL tRAH tASC Row tCAH Column tRAL tRWL tWP WE VIH VIL tWCS OE DQ tWCH VIH VIL VIH tDS tDH Valid Data-in VIL “H” or “L” 14/17 FEDD51V18165F-05 MSM51V18165F PACKAGE DIMENSIONS (Unit: mm) Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact ROHM’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 15/17 FEDD51V18165F-05 MSM51V18165F REVISION HISTORY Document No. Date Page Previous Current Edition Edition Description FEDD51V18165F-01 Oct. 2000 – – Final edition FEDD51V18165F-02 Oct. 05, 2006 – – Delete BLOCK-DIAGRAM FEDD51V18165F-03 Mar. 29, 2010 – – Changed Company-name and LOGO FEDD51V18165F-04 Feb.06, 2012 1,2 1,2 Deleted SOJ42 package FEDD51V18165F-05 Nov. 01, 2013 1 – 1 15 Changed package code Added Package Dimensions 16/17 FEDD51V18165F-05 MSM51V18165F NOTES No copying or reproduction of this document, in part or in whole, is permitted without the consent of LAPIS Semiconductor Co., Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing LAPIS Semiconductor's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from LAPIS Semiconductor upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, LAPIS Semiconductor shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. LAPIS Semiconductor does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by LAPIS Semiconductor and other parties. LAPIS Semiconductor shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While LAPIS Semiconductor always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. LAPIS Semiconductor shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). LAPIS Semiconductor shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Copyright 2013 - 2011 LAPIS Semiconductor Co., Ltd. 17/17
MSM51V18165F-60T3 价格&库存

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