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STTH512FP

STTH512FP

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    ITO220FP-2

  • 描述:

    DIODE GEN PURP 1.2KV 5A TO220FP

  • 数据手册
  • 价格&库存
STTH512FP 数据手册
STTH512 Ultrafast recovery - 1200 V diode Main product characteristics A K IF(AV) VRRM Tj VF (typ) trr (typ) 5A 1200 V 175° C 1.25 V 48 ns A K TO-220AC STTH512D A K TO-220FPAC STTH512FP Features and benefits ■ ■ ■ ■ ■ ■ K A NC DPAK STTH512B Ultrafast, soft recovery Very low conduction and switching losses High frequency and/or high pulsed current operation High reverse voltage capability High junction temperature Insulated package: TO-220FPAC Electrical insulation = 2000 VRMS Capacitance = 12 pF Order codes Part Number STTH512D STTH512B Marking STTH512D STTH512B STTH512B STTH512FP Description The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. STTH512B-TR STTH512FP March 2006 Rev 1 www.st.com 1/10 10 Characteristics STTH512 1 Table 1. Symbol VRRM IF(RMS) Characteristics Absolute ratings (limiting values at 25° C, unless otherwise specified) Parameter Repetitive peak reverse voltage TO-220AC / TO-220FPAC RMS forward current DPAK Average forward current, δ = 0.5 Repetitive peak forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature TO-220AC / DPAK TO-220FPAC Tc = 145° C Tc = 105° C 60 55 -65 to + 175 175 A A °C °C 10 5 A Value 1200 30 A Unit V IF(AV) IFRM IFSM Tstg Tj tp = 5 µs, F = 5 kHz square tp = 10 ms Sinusoidal Table 2. Symbol Rth(j-c) Thermal parameters Parameter TO-220AC / DPAK Junction to case TO-220FPAC 5.8 Value 2.5 °C/W Unit Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Tj = 25° C VR = VRRM Min. Typ Max. 5 µA 3 30 2.2 IF = 5 A 1.30 1.25 2.0 1.9 V Unit VF (2) Forward voltage drop Tj = 125° C Tj = 150° C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 1.5 x IF(AV) + 0.08 IF2(RMS) Table 4. Symbol Dynamic characteristics Parameter Test conditions IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25° C IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25° C Reverse recovery current IF = 5 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125° C 48 11 Min. Typ Max. 95 ns 70 16 A Unit trr Reverse recovery time IRM 2/10 STTH512 Table 4. S tfr VFP Characteristics Dynamic characteristics Softness factor Forward recovery time Forward recovery voltage IF = 5 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125° C dIF/dt = 50 A/µs IF = 5 A VFR = 1.5 x VFmax, Tj = 25° C IF = 5 A, dIF/dt = 50 A/µs, Tj = 25° C 9.5 2 400 ns V Figure 1. P(W) 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0.0 0.5 1.0 Conduction losses versus average current δ = 0.1 δ = 0.05 δ=1 δ = 0.2 δ = 0.5 Figure 2. IFM(A) 50 45 40 35 30 25 20 15 Forward voltage drop versus forward current Tj=150°C (typical values) Tj=25°C (maximum values) Tj=150°C (maximum values) T 10 5 IF(AV)(A) 1.5 2.0 2.5 3.0 3.5 4.0 4.5 δ=tp/T 5.0 5.5 tp 0 6.0 0.0 0.5 1.0 1.5 2.0 VFM(V) 2.5 3.0 3.5 4.0 4.5 5.0 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00 Single pulse TO-220AC DPAK Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse TO-220FPAC tp(s) 0.1 0.0 1.E-03 1.E-02 tp(s) 1.E-01 1.E+00 1.E+01 Figure 5. Peak reverse recovery current versus dIF/dt (typical values) Figure 6. Reverse recovery time versus dIF/dt (typical values) 3/10 Characteristics STTH512 IRM(A) 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 0 100 200 300 400 500 IF=0.5 x IF(AV) IF=IF(AV) VR=600V Tj=125°C IF=2 x IF(AV) trr(ns) 600 550 500 450 400 350 300 250 200 150 100 IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) VR=600V Tj=125°C dIF/dt(A/µs) 50 0 0 100 dIF/dt(A/µs) 200 300 400 500 Figure 7. Qrr(nC) 2000 1800 1600 1400 1200 1000 800 600 400 VR=600V Tj=125°C Reverse recovery charges versus dIF/dt (typical values) Figure 8. S factor 4.0 3.5 Softness factor versus dIF/dt (typical values) IF ≤ 2xIF(AV) VR=600V Tj=125°C IF=2 x IF(AV) 3.0 2.5 2.0 1.5 1.0 IF=IF(AV) IF=0.5 x IF(AV) 200 0 0 100 dIF/dt(A/µs) 0.5 200 300 400 500 0 100 dIF/dt(A/µs) 200 300 400 500 Figure 9. Relative variations of dynamic parameters versus junction temperature IF=IF(AV) VR=600V Reference: Tj=125°C S factor Figure 10. Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 50 45 40 35 30 25 IF=IF(AV) Tj=125°C 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 25 50 75 100 125 QRR trr IRM 20 15 10 Tj(°C) 5 0 0 50 100 dIF/dt(A/µs) 150 200 250 300 4/10 STTH512 Characteristics Figure 11. Forward recovery time versus dIF/dt (typical values) tfr(ns) 700 IF=IF(AV) VFR=1.5 x VF max. Tj=125°C Figure 12. Junction capacitance versus reverse voltage applied (typical values) C(pF) 100 F=1MHz VOSC=30mVRMS Tj=25°C 600 500 10 400 300 dIF/dt(A/µs) 200 0 50 100 150 200 250 300 350 400 450 500 VR(V) 1 1 10 100 1000 Figure 13. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, ecu = 35 µm) Rth(j-a)(°C/W) 100 90 80 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 40 SCU(cm²) 5/10 Package mechanical data STTH512 2 Package mechanical data Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC) Maximum torque value: 0.7 Nm (TO-220AC) Table 5. T0-220AC dimensions DIMENSIONS REF. Millimeters Min. H2 ØI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 A C D E F F1 G 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 F1 L9 L4 F D H2 L2 L4 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E G L5 L6 L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/10 STTH512 Table 6. T0-220FPAC dimensions Package mechanical data DIMENSIONS REF Millimeters Min. A H B Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4 A B D 4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10 Dia L6 L2 L3 L5 F1 L4 D L7 E F F1 G G1 H L2 L3 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G E L4 L5 L6 L7 Dia. 7/10 Package mechanical data Table 7. DPAK dimensions DIMENSIONS REF. Millimeters Min. E B2 L2 C2 A STTH512 Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 Max 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 A A1 A2 B D 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 H L4 B G A1 R B2 C R C C2 D E A2 0.60 MIN. G H V2 L2 L4 V2 0.80 typ. 0.60 0° 1.00 8° 0.031 typ. 0.023 0° 0.039 8° Figure 14. DPAK footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 STTH512 Ordering information 3 Ordering information Part Number STTH512D STTH512FP STTH512B STTH512B-TR Marking STTH512D STTH512FP STTH512B STTH512B Package TO-220AC TO-220FPAC DPAK DPAK Weight 1.86g 2.2 0.30 0.30 Base qty 50 50 75 2500 Delivery mode Tube Tube Tube Tape & reel 4 Revision history Date 02-Mar-2006 Revision 1 First issue. Description of Changes 9/10 STTH512 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10
STTH512FP 价格&库存

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STTH512FP
    •  国内价格 香港价格
    • 50+2.2500750+0.27296
    • 200+2.23956200+0.27169
    • 1000+2.239511000+0.27168
    • 2000+2.239462000+0.27168
    • 6250+2.239416250+0.27167

    库存:0